05-08-1834

PF Package
Variation: PF24MA
24-Lead Plastic UTQFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1834 Rev Ø)
2.50 REF
0.70 ± 0.05
4.50 ± 0.05 2.45 ± 0.05
3.10 ± 0.05
0.41
± 0.05
0.41 ± 0.05
1.24 ±0.05
0.41
± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 × 45°
CHAMFER
BOTTOM VIEW—EXPOSED PAD
4.00 ± 0.10
0.55 ± 0.05
R = 0.05
TYP
2.50 REF
23
PIN 1
TOP MARK
(NOTE 6)
24
0.40 ± 0.10
1
2
4.00 ± 0.10
2.45 ± 0.10
0.41 ± 0.10
0.41
± 0.10
1.24 ± 0.10
R = 0.125
TYP
(PF24MA) UTQFN 0908 REV Ø
0.125 REF
0.00 – 0.05
0.41 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
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