CRL1206

MATERIAL DECLARATION SHEET
Material Number
CRL1206 series
Product Line
Thick Film Low Ohmic Chip Resistors
Compliance Date
04-01-2003
RoHS Compliant
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
1
Ceramic Substrate
Ceramic
0.00779
2
Conductor Layer
Thick Film Conductor
0.00015
3
Resistive Element
Thick Film Resistor
0.0001
4
5
Over Coating
Marking
Epoxy
Epoxy
0.00011
0.000013
6
End Terminal
NI-CR
0.000007
7
Ni Plating
Nickel
8
Sn Plating
0.00023
0.00019
0.00859
Tin
Total weight
Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium dioxide
Silver
Palladium
Lead
Epoxy
Epoxy
Nickel
Chromium
Nickel
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
25085-99-8
7440-02-0
7440-47-3
7440-02-0
Tin
7440-31-5
CASRN
if applicable
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
100%
80%
20%
100%
Material
Mass % of
total unit wt.
87.04
3.63
1.63
0.02
0.02
0.02
0.02
0.28
0.44
0.17
0.22
1.32
0.15
0.06
0.02
2.7
Subpart
mass of
total wt. (%)
100%
2.26
2.26
Materials
Mass %
This Document was updated on: 2016-2-5
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I.
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90.67
1.71
1.11
1.32
0.15
0.08
2.7
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