05-08-1980

BGA Package
113-Lead (15mm × 15mm × 4.92mm)
(Reference LTC DWG # 05-08-1980 Rev Ø)
Z
A
DETAIL A
aaa Z
10
11
A2
9
8
7
6
5
4
3
2
SEE NOTES
7
1
PAD 1
A
PAD “A1”
CORNER
A1
4
b
B
ccc Z
C
D
E
b1
MOLD
CAP
F
D
F
SUBSTRATE
H
Z
// bbb Z
G
H1
H2
DETAIL B
J
K
e
L
Øb (113 PLACES)
ddd M Z X Y
eee M Z
X
aaa Z
e
b
Y
E
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
SEE NOTES
G
3
PACKAGE BOTTOM VIEW
DIMENSIONS
6.350
0.630 ±0.025 Ø 113x
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
6.350
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.75
0.63
15.00
15.00
1.27
12.70
12.70
0.32
4.00
MAX
5.12
0.70
4.42
0.90
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 113
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 113 0414 REV Ø
Similar pages