05-08-1921

BGA Package
144-Lead (15mm × 15mm × 4.92mm)
(Reference LTC DWG # 05-08-1921 Rev A)
DETAIL A
Z
A
12
A2
aaa Z
SEE NOTES
11
10
9
8
7
6
5
4
3
2
7
1
M
L
b
A1
ccc Z
K
J
H
b1
MOLD
CAP
G
F
D
SUBSTRATE
E
Z
H2
// bbb Z
F
H1
D
DETAIL B
C
B
PIN “A1”
CORNER
A
ddd M Z X Y
eee M Z
X
0.0
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
e
b
SEE NOTES
Y
E
aaa Z
4
e
Øb (144 PLACES)
PIN 1
G
3
PACKAGE BOTTOM VIEW
DETAIL A
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
6.9850
0.630 ±0.025 Ø 144x
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.75
0.63
15.00
15.00
1.27
13.97
13.97
0.32
4.00
MAX
5.12
0.70
4.42
0.90
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 144
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 144 1112 REV A
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