05-08-1949

LGA Package
25-Lead (6.25mm × 6.25mm × 1.82mm)
(Reference LTC DWG # 05-08-1949 Rev Ø)
SEE NOTES
DETAIL A
aaa Z
E
Y
SEE NOTES
A
X
7
G
PIN 1
3
A
PIN “A1”
CORNER
b
4
MOLD
CAP
D
B
F
SUBSTRATE
C
e
D
E
5
Z
// bbb Z
PACKAGE TOP VIEW
H1
H2
aaa Z
Ø eee S Z X Y
2.540
0.000
1.270
0.3175
0.3175
1.270
2.540
1
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
1.270
0.000
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
Øb (25 PLACES)
2.540
3
PACKAGE BOTTOM VIEW
DETAIL B
DETAIL B
4
6. THE TOTAL NUMBER OF PADS: 25
0.3175
DIMENSIONS
0.3175
1.270
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
MIN
1.72
0.60
0.27
1.45
NOM
1.82
0.63
6.25
6.25
1.27
5.08
5.08
0.32
1.50
7
MAX
1.92
0.66
0.37
1.55
0.15
0.10
0.15
TOTAL NUMBER OF LGA PADS: 25
NOTES
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 25 0613 REV Ø
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