CDDFN6 Series

CHIP DIODES
Bourns Manufacturers Representatives
Corporate Distributor Product Managers
Americas Sales Team
Asia Sales Team
Europe Sales Team
FAE Team
Revised November 24, 2011
Additional Assembly/Test Location
for TVS Diode DFN Packages
To support increasing demand, secure continuity of supply and provide maximum flexibility to our customers,
Bourns is adding an additional Assembly/Test Location in China for the assembly/test of DFN packages for
our TVS Diode products.
The affected Bourns® part number using the DFN package is CDDFN6-0504P.
Qualification:
Below are the Qualification Information & Results using the DFN 1.6 x 1.6 - 6L package at the new assembly/test
location.
Qualification Information:
Die Technology
Product Name
Top Metal
Back Metal
Assembly Site
Pins/Package
Mold Compound
Die Attach
Bond Wire
L/F Material
Marking
Termination Finish
All Products
TVS Diode Products
CDDFN6-0504P
Al
AlNiAu
China
DFN 1.6 x 1.6 -6L
Sumitomo G770HCD
Sumitomo 84-3J
Multiple 1 Mil Au
Copper
Laser
Matte Sn (Pb Free)
ESD1116 rev.
Additional Assembly/Test Location for TVS Diode DFN Packages
Revised November 24, 2011
Page 2 of 2
Qualification Results:
Test Plan
Stress Test
Conditions
Moisture Induced Stress Sensitivity
HTRB
125 °C,1000 h
HTSL
150 °C, 1000 h
85 °C / 85 % RH,
PCT
1000 h
65 / +150 °C,
T Cycle
1000 cs
Solderability
8 h Steam
Lead Fatigue
Lead Pull
Lead Adhesion
Dimensions
Data Sheet
Flammability
3 mm
W/Bond Pull
Strength
Die Shear
X-Ray
-
Standard
J-STD-020
MIL STD 750
J-STD-22
Method
1048
A103
SS/Acc
Level3
76/0
22/0
Lot 1
CDDFN6-0504P
SS/fail
66/0
76/0
22/0
J-STD-22
A102
22/0
22/0
J-STD-22
A104
22/0
22/0
JESD22MIL STD 883
MIL STD 883
MIL STD 883
MIL STD 883
UL94-VO
B102E
2004
2004
2025
2025
5/0
22/0
22/0
15/0
5/0
5/0
8/0
8/0
8/0
5
MIL STD 883
2011
76/0
76/0
MIL STD 883
MIL STD 883
2019
2012
5/0
5/0
5/0
5/0
Samples subjected are preconditioned according to JESD22-A113 (260 °C).
Product Labeling:
Product marking is unchanged except for country code information. Labels will show the country of origin code.
Identification of the Changed Product:
Bourns maintains traceability back to source wafer lots and assembly sites for all products.
First Date Code from New Site:
1203
Impact on Form, Fit, Function and Reliability:
The package outline dimensions will continue to meet the current Bourns data sheet. Materials specified for
packaging are unchanged. Product ratings and electrical characteristics are unaffected by the change. There is no
impact on form, fit, function or reliability.
Last Date of Manufacture of Existing Product:
Bourns has no plans to discontinue assembly & test of products at its existing subcontract sites.
Implementation Date:
Assembly of product will begin January 2012.
Deliveries to customers may occur from May 2012 onwards.
If you have any questions, please contact our customer service teams in your region.
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