Data Sheet

NTS0104-Q100
Dual supply translating transceiver; open drain; auto
direction sensing
Rev. 2 — 23 May 2013
Product data sheet
1. General description
The NTS0104-Q100 is a 4-bit, dual supply translating transceiver with auto direction
sensing, that enables bidirectional voltage level translation. It features two 4-bit
input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A)
and VCC(B)). VCC(A) can be supplied with any voltage between 1.65 V and 3.6 V. VCC(B) can
be supplied with any voltage between 2.3 V and 5.5 V. The range in supply voltages
makes the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V,
3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to
VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance
OFF-state. This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Wide supply voltage range:
 VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V
 Maximum data rates:
 Push-pull: 50 Mbps
 IOFF circuitry provides partial Power-down mode operation
 Inputs accept voltages up to 5.5 V
 ESD protection:
 MIL-STD-883, method 3015 Class 2 exceeds 2500 V for A port
 MIL-STD-883, method 3015 Class 3B exceeds 15000 V for B port
 HBM JESD22-A114E Class 2 exceeds 2500 V for A port
 HBM JESD22-A114E Class 3B exceeds 15000 V for B port
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 Latch-up performance exceeds 100 mA per JESD 78B Class II
 Multiple package options
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
3. Applications
 I2C/SMBus
 UART
 GPIO
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature
range
Name
NTS0104PW-Q100 40 C to +125 C TSSOP14
Description
Version
plastic thin shrink small outline package;
14 leads; body width 4.4 mm
SOT402-1
NTS0104BQ-Q100 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal
SOT762-1
enhanced very thin quad flat package;
no leads; 14 terminals; body 2.5  3  0.85 mm
NTS0104UK-Q100
40 C to +125 C WLCSP12
wafer level chip-size package, 12 bumps; body NTS0104UK-Q100
1.20  1.60  0.56 mm
(Backside Coating included)
5. Marking
Table 2.
Marking
Type number
Marking code
NTS0104PW-Q100
NTS0104
NTS0104BQ-Q100
S0104
NTS0104UK-Q100
s04
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
6. Functional diagram
GATE BIAS
OE
A1
B1
A2
B2
GATE BIAS
A3
B3
GATE BIAS
A4
B4
VCC(B)
VCC(A)
GATE BIAS
001aan110
Fig 1.
Logic symbol
NTS0104_Q100
Product data sheet
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
7. Pinning information
7.1 Pinning
9&&$
WHUPLQDO
LQGH[DUHD
9&&%
1764
1764
$
%
9&&$
9&&%
$
%
$
%
$
%
$
%
$
$
%
$
%
QF
QF
QF
*1'
2(
*1'
%
*1'
2(
QF
DDD
7UDQVSDUHQWWRSYLHZ
DDD
(1) This is not a supply pin, the substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered the solder land should remain
floating or connected to GND.
Fig 2.
Pin configuration TSSOP14 (SOT402-1)
EDOO$
LQGH[DUHD
Fig 3.
Pin configuration DHVQFN14 (SOT762-1)
1764
1764
$
$
%
9&&%
$
%
%
%
9&&$
$
&
&
%
2(
$
'
'
%
*1'
$
7UDQVSDUHQWWRSYLHZ
7UDQVSDUHQWWRSYLHZ
DDD
Fig 4.
Pin configuration WLCSP12 package
NTS0104_Q100
Product data sheet
DDD
Fig 5.
Ball mapping for WLCSP12
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Ball
Description
SOT402-1 and SOT762-1
WLCSP12
VCC(A)
1
B2
A1, A2, A3, A4
2, 3, 4, 5
A3, B3, C3, D3 data input or output (referenced to VCC(A))
n.c.
6, 9
-
not connected
GND
7
D2
ground (0 V)
OE
8
C2
output enable input (active HIGH; referenced to VCC(A))
B4, B3, B2, B1
10, 11, 12, 13
D1, C1, B1, A1 data input or output (referenced to VCC(B))
VCC(B)
14
A2
supply voltage A
supply voltage B
8. Functional description
Table 4.
Function table[1]
Supply voltage
Input
Input/output
VCC(A)
VCC(B)
OE
An
Bn
1.65 V to VCC(B)
2.3 V to 5.5 V
L
Z
Z
1.65 V to VCC(B)
2.3 V to 5.5 V
H
input or output
output or input
GND[2]
GND[2]
X
Z
Z
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2]
When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode.
NTS0104_Q100
Product data sheet
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC(A)
supply voltage A
VCC(B)
supply voltage B
VI
input voltage
Conditions
output voltage
VO
Min
Max
Unit
0.5
+6.5
V
0.5
+6.5
V
A port and OE input
[1][2]
0.5
+6.5
V
B port
[1][2]
0.5
+6.5
V
Active mode
[1][2]
0.5
VCCO + 0.5
V
A port
0.5
+4.6
V
B port
0.5
+6.5
V
A or B port
Power-down or 3-state mode
[1]
IIK
input clamping current
VI < 0 V
50
-
mA
IOK
output clamping current
VO < 0 V
50
-
mA
-
50
mA
-
100
mA
[2]
IO
output current
VO = 0 V to VCCO
ICC
supply current
ICC(A) or ICC(B)
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
-
250
mW
Tamb = 40 C to +125 C
total power dissipation
Ptot
[3]
[1]
The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
VCCO is the supply voltage associated with the output.
[3]
For TSSOP14 packages: above 60 C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 C the value of Ptot derates linearly at 4.5 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions[1][2]
Symbol
Parameter
Conditions
Min
Max
Unit
VCC(A)
supply voltage A
1.65
3.6
V
VCC(B)
Tamb
supply voltage B
2.3
5.5
V
ambient temperature
40
+125
C
t/V
input transition rise and fall rate
-
10
ns/V
-
10
ns/V
A or B port; push-pull driving
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[1]
Hold the A and B sides of an unused I/O pair in the same state, either both at VCCI or both at GND.
[2]
VCC(A) must be less than or equal to VCC(B).
NTS0104_Q100
Product data sheet
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
11. Static characteristics
Table 7.
Typical static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
-
1
A
-
-
1
A
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
-
1
A
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
-
1
A
II
input leakage
current
IOZ
OFF-state output A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V;
current
VCC(B) = 2.3 V to 5.5 V
IOFF
power-off
leakage current
[1]
CI
input
capacitance
OE input; VCC(A) = 3.3 V; VCC(B) = 3.3 V
-
2
-
pF
CI/O
input/output
capacitance
A port
-
4
-
pF
B port
-
7
-
pF
A or B port; VCC(A) = 3.3 V; VCC(B) = 3.3 V
-
9
-
pF
[1]
VCCO is the supply voltage associated with the output.
Table 8.
Typical supply current
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
VCC(A)
VCC(B)
Unit
2.5 V
3.3 V
5.0 V
ICC(A)
ICC(B)
ICC(A)
ICC(B)
ICC(A)
ICC(B)
0.1
0.5
0.1
1.5
0.1
4.6
A
2.5 V
0.1
0.1
3.3 V
-
1.8 V
-
0.1
0.8
0.1
3.8
A
0.1
0.1
0.1
2.8
A
Table 9.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
HIGH-level
input voltage
40 C to +85 C
Conditions
40 C to +125 C
Min
Max
Min
Max
Unit
A port
VCC(A) = 1.65 V to 1.95 V;
VCC(B) = 2.3 V to 5.5 V
[1]
VCCI  0.2
-
VCCI  0.2
-
V
VCC(A) = 2.3 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[1]
VCCI  0.4
-
VCCI  0.4
-
V
[1]
VCCI  0.4
-
VCCI  0.4
-
V
0.65VCC(A)
-
0.65VCC(A)
-
V
B port
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
NTS0104_Q100
Product data sheet
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 9.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIL
LOW-level
input voltage
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Max
Min
Max
-
0.15
-
0.15
-
0.35VCC(A)
-
0.67VCCO
-
0.67VCCO
-
V
A or B port
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
0.35VCC(A) V
HIGH-level
output voltage
A or B port; IO = 20 A
LOW-level
output voltage
A or B port; IO = 1 mA
VI  0.15 V;
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
0.4
-
0.4
V
II
input leakage
current
OE input; VI = 0 V to 3.6 V;
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
2
-
12
A
IOZ
OFF-state
output current
A or B port; VO = 0 V or VCCO;
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
2
-
12
A
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
2
-
12
A
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
2
-
12
A
supply current
VI = 0 V or VCCI; IO = 0 A
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
2.4
-
15
A
VCC(A) = 3.6 V; VCC(B) = 0 V
-
2.2
-
15
A
VCC(A) = 0 V; VCC(B) = 5.5 V
-
1
-
8
A
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
12
-
30
A
VCC(A) = 3.6 V; VCC(B) = 0 V
-
1
-
5
A
VCC(A) = 0 V; VCC(B) = 5.5 V
-
1
-
6
A
-
14.4
-
45
A
VOH
VOL
ICC
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[2]
[2]
[2]
[1]
ICC(A)
ICC(B)
ICC(A) + ICC(B)
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[1]
VCCI is the supply voltage associated with the input.
[2]
VCCO is the supply voltage associated with the output.
NTS0104_Q100
Product data sheet
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NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
12. Dynamic characteristics
Table 10. Dynamic characteristics for temperature range 40 C to +85 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V  0.2 V
3.3 V  0.3 V
5.0 V  0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V  0.15 V
tPHL
HIGH to LOW
propagation delay
A to B
-
4.6
-
4.7
-
5.8
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
6.8
-
6.8
-
7.0
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
4.4
-
4.5
-
4.7
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
5.3
-
4.5
-
0.5
ns
ten
enable time
OE to A; B
tdis
disable time
-
200
-
200
-
200
ns
OE to A; no external load
[2]
-
35
-
35
-
35
ns
OE to B; no external load
[2]
-
35
-
35
-
35
ns
OE to A
-
230
-
230
-
230
ns
OE to B
-
200
-
200
-
200
ns
LOW to HIGH
output transition
time
A port
3.2
9.5
2.3
9.3
1.8
7.6
ns
B port
3.3
10.8
2.7
9.1
2.7
7.6
ns
HIGH to LOW
output transition
time
A port
2.0
5.9
1.9
6.0
1.7
13.3
ns
B port
2.9
7.6
2.8
7.5
2.8
10.0
ns
tsk(o)
output skew time
between channels
-
0.7
-
0.7
-
0.7
ns
tW
pulse width
data inputs
20
-
20
-
20
-
ns
fdata
data rate
-
50
-
50
-
50
Mbps
tTLH
tTHL
[3]
VCC(A) = 2.5 V  0.2 V
tPHL
HIGH to LOW
propagation delay
A to B
-
3.2
-
3.3
-
3.4
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
3.5
-
4.1
-
4.4
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
3.0
-
3.6
-
4.3
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
2.5
-
1.6
-
0.7
ns
ten
enable time
OE to A; B
tdis
tTLH
disable time
LOW to HIGH
output transition
time
NTS0104_Q100
Product data sheet
-
200
-
200
-
200
ns
OE to A; no external load
[2]
-
35
-
35
-
35
ns
OE to B; no external load
[2]
-
35
-
35
-
35
ns
OE to A
-
200
-
200
-
200
ns
OE to B
-
200
-
200
-
200
ns
A port
2.8
7.4
2.6
6.6
1.8
6.2
ns
B port
3.2
8.3
2.9
7.9
2.4
6.8
ns
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
9 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 10. Dynamic characteristics for temperature range 40 C to +85 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
tTHL
Conditions
VCC(B)
Unit
2.5 V  0.2 V
3.3 V  0.3 V
5.0 V  0.5 V
Min
Max
Min
Max
Min
Max
HIGH to LOW
output transition
time
A port
1.9
5.7
1.9
5.5
1.8
5.3
ns
B port
2.2
7.8
2.4
6.7
2.6
6.6
ns
tsk(o)
output skew time
between channels
-
0.7
-
0.7
-
0.7
ns
tW
pulse width
data inputs
20
-
20
-
20
-
ns
fdata
data rate
-
50
-
50
-
50
Mbps
[3]
VCC(A) = 3.3 V  0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
-
-
-
2.4
-
3.1
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
-
-
4.2
-
4.4
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
-
-
2.5
-
3.3
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
-
-
2.5
-
2.6
ns
ten
enable time
OE to A; B
-
-
-
200
-
200
ns
OE to A; no external load
[2]
-
-
-
35
-
35
ns
OE to B; no external load
[2]
-
-
-
35
-
35
ns
OE to A
-
-
-
260
-
260
ns
OE to B
-
-
-
200
-
200
ns
LOW to HIGH
output transition
time
A port
-
-
2.3
5.6
1.9
5.9
ns
B port
-
-
2.5
6.4
2.1
7.4
ns
HIGH to LOW
output transition
time
A port
-
-
2.0
5.4
1.9
5.0
ns
B port
-
-
2.3
7.4
2.4
7.6
ns
tsk(o)
output skew time
between channels
-
-
-
0.7
-
0.7
ns
tW
pulse width
data inputs
-
-
20
-
20
-
ns
fdata
data rate
-
-
-
50
-
50
disable time
tdis
tTLH
tTHL
[1]
[3]
Mbps
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[2]
Delay between OE going LOW and when the outputs are disabled.
[3]
Skew between any two outputs of the same package switching in the same direction.
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
10 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range 40 C to +125 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V  0.2 V
3.3 V  0.3 V
5.0 V  0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V  0.15 V
tPHL
HIGH to LOW
propagation delay
A to B
-
5.8
-
5.9
-
7.3
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
8.5
-
8.5
-
8.8
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
5.5
-
5.7
-
5.9
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
6.7
-
5.7
-
0.7
ns
ten
enable time
OE to A; B
tdis
disable time
-
200
-
200
-
200
ns
OE to A; no external load
[2]
-
45
-
45
-
45
ns
OE to B; no external load
[2]
-
45
-
45
-
45
ns
OE to A
-
250
-
250
-
250
ns
OE to B
-
220
-
220
-
220
ns
LOW to HIGH
output transition
time
A port
3.2
11.9
2.3
11.7
1.8
9.5
ns
B port
3.3
13.5
2.7
11.4
2.7
9.5
ns
HIGH to LOW
output transition
time
A port
2.0
7.4
1.9
7.5
1.7
16.7
ns
B port
2.9
9.5
2.8
9.4
2.8
12.5
ns
tsk(o)
output skew time
between channels
-
0.8
-
0.8
-
0.8
ns
tW
pulse width
data inputs
20
-
20
-
20
-
ns
fdata
data rate
-
50
-
50
-
50
Mbps
tTLH
tTHL
[3]
VCC(A) = 2.5 V  0.2 V
tPHL
HIGH to LOW
propagation delay
A to B
-
4.0
-
4.2
-
4.3
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
4.4
-
5.2
-
5.5
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
3.8
-
4.5
-
5.4
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
3.2
-
2.0
-
0.9
ns
ten
enable time
OE to A; B
-
200
-
200
-
200
ns
-
45
-
45
-
45
ns
tdis
tTLH
disable time
LOW to HIGH
output transition
time
NTS0104_Q100
Product data sheet
OE to A; no external load
[2]
OE to B; no external load
[2]
-
45
-
45
-
45
ns
OE to A
-
220
-
220
-
220
ns
OE to B
-
220
-
220
-
220
ns
A port
2.8
9.3
2.6
8.3
1.8
7.8
ns
B port
3.2
10.4
2.9
9.7
2.4
8.3
ns
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Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range 40 C to +125 C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
tTHL
Conditions
VCC(B)
Unit
2.5 V  0.2 V
3.3 V  0.3 V
5.0 V  0.5 V
Min
Max
Min
Max
Min
Max
HIGH to LOW
output transition
time
A port
1.9
7.2
1.9
6.9
1.8
6.7
ns
B port
2.2
9.8
2.4
8.4
2.6
8.3
ns
tsk(o)
output skew time
between channels
-
0.8
-
0.8
-
0.8
ns
tW
pulse width
data inputs
20
-
20
-
20
-
ns
fdata
data rate
-
50
-
50
-
50
Mbps
[3]
VCC(A) = 3.3 V  0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
-
-
-
3.0
-
3.9
ns
tPLH
LOW to HIGH
propagation delay
A to B
-
-
-
5.3
-
5.5
ns
tPHL
HIGH to LOW
propagation delay
B to A
-
-
-
3.2
-
4.2
ns
tPLH
LOW to HIGH
propagation delay
B to A
-
-
-
3.2
-
3.3
ns
ten
enable time
OE to A; B
-
-
-
200
-
200
ns
OE to A; no external load
[2]
-
-
-
45
-
45
ns
OE to B; no external load
[2]
-
-
-
45
-
45
ns
OE to A
-
-
-
280
-
280
ns
OE to B
-
-
-
220
-
220
ns
LOW to HIGH
output transition
time
A port
-
-
2.3
7.0
1.9
7.4
ns
B port
-
-
2.5
8.0
2.1
9.3
ns
HIGH to LOW
output transition
time
A port
-
-
2.0
6.8
1.9
6.3
ns
B port
-
-
2.3
9.3
2.4
9.5
ns
tsk(o)
output skew time
between channels
-
-
-
0.8
-
0.8
ns
tW
pulse width
data inputs
-
-
20
-
20
-
ns
fdata
data rate
-
-
-
50
-
50
disable time
tdis
tTLH
tTHL
[1]
[3]
Mbps
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[2]
Delay between OE going LOW and when the outputs are disabled.
[3]
Skew between any two outputs of the same package switching in the same direction.
NTS0104_Q100
Product data sheet
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Dual supply translating transceiver; open drain; auto direction sensing
13. Waveforms
VI
An, Bn
input
VM
GND
tPHL
VOH
tPLH
90 %
Bn, An
output
VM
10 %
VOL
tTHL
tTLH
001aal918
Measurement points are given in Table 12.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6.
The data input (An, Bn) to data output (Bn, An) propagation delay times
VI
OE input
VM
GND
tPLZ
output
LOW-to-OFF
OFF-to-LOW
tPZL
VCCO
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal919
Measurement points are given in Table 12.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7.
Table 12.
Enable and disable times
Measurement points[1][2]
Supply voltage
Input
Output
VCCO
VM
VM
VX
VY
1.8 V  0.15 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH  0.15 V
2.5 V  0.2 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH  0.15 V
3.3 V  0.3 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH  0.3 V
5.0 V  0.5 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH  0.3 V
[1]
VCCI is the supply voltage associated with the input.
[2]
VCCO is the supply voltage associated with the output.
NTS0104_Q100
Product data sheet
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Dual supply translating transceiver; open drain; auto direction sensing
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VCC
VI
RL
VO
G
DUT
CL
RL
001aal920
Test data is given in Table 13.
All input pulses are supplied by generators having the following characteristics: PRR  10 MHz; ZO = 50 ; dV/dt  1.0 V/ns.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 8.
Table 13.
Test circuit for measuring switching times
Test data
Supply voltage
Input
VCC(A)
VI[1]
t/V
CL
RL
VCCI
 1.0 ns/V
15 pF
50 k, 1 M open
VCC(B)
1.65 V to 3.6 V 2.3 V to 5.5 V
Load
VEXT
[2]
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ[3]
open
2VCCO
[1]
VCCI is the supply voltage associated with the input.
[2]
For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 M. For measuring enable and
disable times, RL = 50 k.
[3]
VCCO is the supply voltage associated with the output.
NTS0104_Q100
Product data sheet
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Dual supply translating transceiver; open drain; auto direction sensing
14. Application information
14.1 Applications
Voltage level-translation applications. The NTS0104-Q100 can be used in point-to-point
applications to interface between devices or systems operating at different supply
voltages. The device is primarily targeted at I2C or 1-wire which use open-drain drivers.
Although it may also be used in applications where push-pull drivers are connected to the
ports, the NTB0104-Q100 may be more suitable.
9
9
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Fig 9.
Typical operating circuit
14.2 Architecture
The architecture of the NTS0104-Q100 is shown in Figure 10. The device does not
require an extra input signal to control the direction of data flow from A to B or B to A.
VCC(A)
VCC(B)
T1
T2
ONE
SHOT
ONE
SHOT
10 kΩ
10 kΩ
GATE BIAS
T3
A
B
001aal965
Fig 10. Architecture of NTS0104-Q100 I/O cell (one channel)
The NTS0104-Q100 is a "switch" type voltage translator, it employs two key circuits to
enable voltage translation:
1. A pass-gate transistor (N-channel) that ties the ports together.
2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O
pins.
NTS0104_Q100
Product data sheet
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NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
The gate bias voltage of the pass gate transistor (T3) is set at approximately one
threshold voltage above the VCC level of the low-voltage side. During a LOW-to-HIGH
transition, the output one-shot accelerates the output transition. This acceleration is
achieved by switching on the PMOS transistors (T1, T2) bypassing the 10 k pull-up
resistors and increasing current drive capability. The one-shot is activated once the input
transition reaches approximately VCCI/2; it is de-activated approximately 50 ns after the
output reaches VCCO/2. During the acceleration time, the driver output resistance is
between approximately 50  and 70 . To avoid signal contention and minimize dynamic
ICC, wait for the one-shot circuit to turn-off before applying a signal in the opposite
direction. Pull-up resistors are included in the device for DC current sourcing capability.
14.3 Input driver requirements
As the NTS0104-Q100 is a switch type translator, properties of the input driver directly
affect the output signal. The external open-drain or push-pull driver applied to an I/O,
determines the static current sinking capability of the system. The maximum data rate,
HIGH-to-LOW output transition time (tTHL) and propagation delay (tPHL), are dependent
upon the output impedance and edge-rate of the external driver. The limits provided for
these parameters in the data sheet assume a driver with output impedance below 50  is
used.
14.4 Output load considerations
The maximum lumped capacitive load that can be driven is dependant upon the one-shot
pulse duration. In cases with very heavy capacitive loading, there is a risk that the output
does not reach the positive rail within the one-shot pulse duration.
To avoid excessive capacitive loading and to ensure correct triggering of the one-shot,
use short trace lengths and low capacitance connectors on NTS0104-Q100 PCB layouts.
To ensure low impedance termination and avoid output signal oscillations and one-shot
retriggering, control the length of the PCB trace. The PCB trace must limit the round-trip
delay of any reflection to within the one-shot pulse duration (approximately 50 ns).
14.5 Power-up
During operation VCC(A) must never be higher than VCC(B). However, during power-up
VCC(A)  VCC(B) does not damage the device. This means that either power supply can be
ramped up first. There is no special power-up sequencing required. The NTS0104-Q100
includes circuitry that disables all output ports when either VCC(A) or VCC(B) is switched off.
14.6 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW causes all
I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external
load) indicates the delay between when OE goes LOW and when outputs actually
become disabled. The enable time (ten) indicates the amount of time required for one
one-shot circuit to become operational after OE is taken HIGH. To ensure the
high-impedance OFF-state during power-up or power-down, tie pin OE to GND through a
pull-down resistor. The current-sourcing capability of the driver determines the minimum
value of the resistor.
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
16 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
14.7 Pull-up or pull-down resistors on I/Os lines
Each A port I/O has an internal 10 k pull-up resistor to VCC(A). Each B port I/O has an
internal 10 k pull-up resistor to VCC(B). If a smaller value of pull-up resistor is required,
add an external resistor in parallel to the internal 10 k. The smaller value, affects the VOL
level. When OE goes LOW, the internal pull-ups of the NTS0104-Q100 are disabled.
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
17 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
15. Package outline
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 11. Package outline SOT402-1 (TSSOP14)
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
18 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 12. Package outline SOT762-1 (DHVQFN14)
NTS0104_Q100
Product data sheet
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Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
19 of 24
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NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
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NTS0104_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
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Dual supply translating transceiver; open drain; auto direction sensing
16. Abbreviations
Table 14.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
GPIO
General Purpose Input Output
MIL
Military
HBM
Human Body Model
I2C
Inter-Integrated Circuit
MM
Machine Model
SMBus
System Management Bus
UART
Universal Asynchronous Receiver Transmitter
17. Revision history
Table 15.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NTS0104_Q100 v.2
20130523
Product data sheet
-
NTS0104_Q100 v.1
Modifications:
NTS0104_Q100 v.1
NTS0104_Q100
Product data sheet
•
added type numbers NTS0104PW-Q100 and NTS0104BQ-Q100.
20120807
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 May 2013
-
© NXP B.V. 2013. All rights reserved.
21 of 24
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Dual supply translating transceiver; open drain; auto direction sensing
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NTS0104_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
22 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NTS0104_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
23 of 24
NTS0104-Q100
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 15
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input driver requirements . . . . . . . . . . . . . . . . 16
Output load considerations . . . . . . . . . . . . . . . 16
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Enable and disable . . . . . . . . . . . . . . . . . . . . . 16
Pull-up or pull-down resistors on I/Os lines . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 23
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 May 2013
Document identifier: NTS0104_Q100