506CC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506CC
ISSUE A
1
SCALE 2:1
DATE 24 JUN 2014
A
D
PIN ONE
REFERENCE
B
L
L1
ÎÎ
ÎÎ
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
0.10 C
2X
0.10 C
2X
L
TOP VIEW
ÎÎ
ÎÎ
ÏÏ
MOLD CMPD
EXPOSED Cu
DETAIL B
A
0.10 C
A3
A1
0.08 C
A1
SIDE VIEW
NOTE 4
DETAIL A
D2
1
A3
DETAIL B
C
SEATING
PLANE
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
M
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.20 REF
0.18
0.38
−−−
0.15
0.14 REF
GENERIC
MARKING DIAGRAM*
L
8X
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
4
1
XX MG
G
E2
8
M
5
K
b
8X
e
e/2
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.70
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
0.50
0.20
1.00
2.30
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON67172E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8 2X2, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON67172E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. GASTELUM.
14 FEB 2012
A
ADDED DIMENSION M. REQ. BY D. GASTELUM.
24 JUN 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. A
Case Outline Number:
506CC
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