505AK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
CUDFN6 2x2, 0.65P
CASE 505AK
ISSUE O
DATE 08 JAN 2014
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25MM FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE
CONNECTED TO THE THERMAL PAD.
L
L
A B
D
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
0.10 C
ÉÉÉ ÉÉ
ÇÇÇÇÇ
ÇÇÇ
EXPOSED Cu
0.10 C
TOP VIEW
DETAIL B
0.10 C
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
6X
0.08 C
A1
NOTE 4
SIDE VIEW
DETAIL A
1
MOLD CMPD
D2
3
SEATING
PLANE
C
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MILLIMETERS
MIN
MAX
0.55
0.65
0.00
0.05
0.203 REF
0.20
0.30
2.00 BSC
1.25
1.45
2.00 BSC
0.55
0.75
0.65 BSC
0.25
0.35
0.15
---
RECOMMENDED
SOLDERING FOOTPRINT*
0.10 C A B
L
1.51
PACKAGE
OUTLINE
6X
0.53
E2
6
4
6X
e
BOTTOM VIEW
2.30
0.81
0.10 C A B
b
0.10
M
C A B
0.05
M
C
1
0.65
PITCH
6X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON81405F
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
CUDFN6 2X2, 0.65P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON81405F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. GASTELUM.
DATE
08 JAN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. O
Case Outline Number:
505AK
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