511BU

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 2x1.8, 0.5P
CASE 511BU
ISSUE O
DATE 18 JAN 2012
SCALE 4:1
D
PIN ONE
REFERENCE
2X
0.10 C
2X
ÍÍ
ÍÍ
ÍÍ
0.10 C
L
A
B
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
DETAIL B
A
NOTE 4
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ÉÉÉ
ÉÉÉ
ÉÉÉ
TOP VIEW
0.10 C
0.08 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
A1
A3
SIDE VIEW
C
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
1
e/2
DETAIL A
e
1
4
8
5
7X
L
BOTTOM VIEW
b
0.10
M
C A
0.05
M
C
XX MG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
L2
8X
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.80 BSC
0.50 BSC
0.45
0.55
--0.15
0.55
0.65
B
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
7X
PACKAGE
OUTLINE
0.73
2.10
0.83
1
8X
0.32
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON66644E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WDFN8, 2X1.8, 0.5 P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON66644E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. SHORT.
DATE
18 JAN 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. O
Case Outline Number:
511BU