567JH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP9, 1.60x1.76
CASE 567JH
ISSUE B
SCALE 4:1
ÈÈ
ÈÈ
PIN A1
REFERENCE
2X
E
A B
DATE 23 JAN 2014
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
D
DIM
A
A1
b
D
E
e
0.05 C
2X
0.05 C
TOP VIEW
BACKCOAT
A
0.10 C
0.08 C
9X
C
SIDE VIEW
PACKAGE
OUTLINE
SEATING
PLANE
e
b
0.05 C A B
RECOMMENDED
SOLDERING FOOTPRINT*
A1
A1
NOTE 3
MILLIMETERS
MIN
MAX
−−−
0.51
0.09
0.19
0.20
0.30
1.60 BSC
1.76 BSC
0.50 BSC
e
C
0.03 C
B
0.50
PITCH
9X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
A
1
2
3
BOTTOM VIEW
DOCUMENT NUMBER:
98AON79525F
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP9, 1.60X1.76
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON79525F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
28 OCT 2013
A
ADDED BACKSIDE COATING OPTION. REQ. BY E. KUROSE.
19 DEC 2013
B
UPDATED DIMENSIONS A AND A1. REQ. BY E. KUROSE.
23 JAN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. B
Case Outline Number:
567JH
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