567HY

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP15, 2.15x1.55
CASE 567HY
ISSUE B
DATE 30 APR 2015
SCALE 4:1
PIN A1
REFERENCE
ÈÈ
E
A
B
BACKSIDE
COATING
A3
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
4. BACKSIDE COATING IS OPTIONAL.
D
DETAIL A
0.05 C
2X
0.05 C
2X
DIM
A
A1
A3
b
D
E
e
TOP VIEW
DETAIL A
MILLIMETERS
MIN
MAX
−−−
0.65
0.16
0.26
0.025 REF
0.21
0.31
2.15 BSC
1.55 BSC
0.40 BSC
A
0.10 C
A1
0.08 C
NOTE 3
C
SIDE VIEW
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
A1
15X
PACKAGE
OUTLINE
e
b
0.05 C A B
0.03 C
E
e
0.40
PITCH
D
C
15X
0.40
PITCH
B
0.20
DIMENSIONS: MILLIMETERS
A
1
2
3
BOTTOM VIEW
DOCUMENT NUMBER:
98AON76308F
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP15, 2.15X1.55
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON76308F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
19 JUL 2013
A
CHANGED DIMENSION A TO 0.625. REQ. BY K. SAITO.
10 APR 2014
B
ADDED BACKSIDE COATING OPTION INFORMATION. REQ. BY K. OKADA.
30 APR 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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© Semiconductor Components Industries, LLC, 2015
April, 2015 − Rev. B
Case Outline Number:
567HY
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