MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC8−NB EP CASE 751BU ISSUE E 8 1 SCALE 1:1 DATE 01 APR 2015 D A 8 NOTE 5 F 2X 0.10 C D 5 NOTE 6 A1 E E1 NOTE 4 L2 L 2X 4 TIPS 0.20 C 4 1 NOTE 5 8X B TOP VIEW b 0.25 M C A-B D 2X D DETAIL A 8X 0.10 C A SEATING PLANE 0.10 C A-B NOTE 4 0.10 C C DETAIL A h B B e C SIDE VIEW END VIEW SEATING PLANE NOTE 7 F ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ b b1 G c c1 SECTION B−B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL CONDITION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSION E DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F. 5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE TOOLING FEATURES. DIM A A1 b b1 c c1 D E E1 e F G h L L2 MILLIMETERS MIN MAX 1.35 1.75 0.00 0.10 0.31 0.51 0.28 0.48 0.17 0.25 0.17 0.23 4.90 BSC 6.00 BSC 3.90 BSC 1.27 BSC 1.55 2.39 1.55 2.39 0.25 0.50 0.40 1.27 0.25 BSC GENERIC MARKING DIAGRAM* BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 8 XXXXXXXXX ALYWX G 2.60 2.60 1 8X 1.52 7.00 XXXXX A L Y W G 1 8X 1.27 PITCH 0.76 DIMENSION: MILLIMETERS *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON66222E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SOIC8−NB EP = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON66222E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA. 03 JAN 2012 A CORRECTED EXPOSED DIMENSIONS. REQ. BY I. CAMBALIZA. 12 APR 2012 B CORRECTED SIDE VIEW LABEL A TO REFLECT FROM TOP OF PACKAGE TO SEATING PLANE. REQ. BY I. CAMBALIZA. 30 AUG 2012 C CHANGED MAX VALUE FOR DIMENSIONS F AND G FROM 3.07 TO 2.39. REQ. BY B. LOFTS. 17 JUL 2013 D CHANGED EXPOSED PAD IN SOLDER FOOTPRINT TO 2.6X2.6. REQ. BY B. LOFTS. 23 JUL 2013 E CHANGED DIMENSION A1 MIN FROM −−− TO 0.00. REQ. BY B. LOFTS. 01 APR 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2015 April, 2015 − Rev. E Case Outline Number: 751BU