Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.3x3I
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2 5/15
2X 1.950
3.00
B
0.15
8
5
3.00
(4X)
6X 0.65
A
1.64 +0.10/ - 0.15
6
PIN 1
INDEX AREA
4
8X 0.30
8X 0.400 ± 0.10
TOP VIEW
6
PIN #1 INDEX AREA
1
4
0.10 M C A B
2.38
+0.10/ - 0.15
BOTTOM VIEW
SEE DETAIL "X"
( 2.38 )
( 1.95)
0.10 C
Max 0.80
C
0.08 C
SIDE VIEW
( 8X 0.60)
(1.64)
( 2.80 )
PIN 1
C
0 . 2 REF
5
(6x 0.65)
0 . 00 MIN.
0 . 05 MAX.
( 8 X 0.30)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1