Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L5.2x2.1
5 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 4/15
2.10
6
PIN #1 INDEX AREA
A
B
6
PIN 1
INDEX AREA
1
5
1
2.00
1.35
1.30 REF
2
0.65
0.30±0.05
(4X)
4
3
0.10
0.65
0.10 M C A B
5X 0 . 35 ± 0 . 05
TOP VIEW
BOTTOM VIEW
(0.65)
SEE DETAIL "X"
0.10 C
0 . 7 ± 0 . 05
C
( 5X 0 . 30 )
(0.65)
BASE PLANE
(1.35)
SEATING PLANE
0.08 C
SIDE VIEW
( 5X 0 . 55 )
C
0 . 2 REF
5
(1.95)
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends)..
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.