Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q128.14x20G
128 LEAD PLASTIC QUAD FLATPACK PACKAGE (PQFP)
Rev 0, 10/12
MILLIMETER
D
D1
D2
MIN
NOM
MAX
MIN
NOM
MAX
A
A
-
-
3.40
-
-
0.134
A2
A1
0.25
-
-
0.010
-
-
A2
2.50
2.72
4X
aaa C A-B D
e
L1
-B-
-A-
c
E
E1
E2
- 0.10 S
-D-
4X
bbb C A-B D
ccc M C A-B s D s
b
TOP VIEW
SEE DETAIL "X"
θ
D
23.20 BSC
0.913 BSC
20.00 BSC
0.787 BSC
E
17.20 BSC
0.677 BSC
E1
14.00 BSC
SIDE VIEW
0.551 BSC
R2
0.13
-
R1
0.13
-
-
0.005
-
-
θ
0°
-
7°
0°
-
7°
0.30 0.005
-
θ1
0°
-
-
0°
-
-
Alloy 42 L/F
θ2, θ3
7° REF
7° REF
Copper L/F
θ2, θ3
15° REF
15° REF
0.012
c
0.11
0.15
0.23 0.004 0.006 0.009
L
0.73
0.88
1.03 0.029 0.035 0.041
1.60 REF
-
0.063 REF
S
0.20
b
0.170 0.200 0.270 0.007 0.008 0.011
-
0.008
-
e
0.50 BSC
0.020 BSC
D2
18.50
0.728
E2
12.50
0.492
-
TOLERANCES OF FORM AND POSITION
-C- SEATING PLANE
ddd C
2.90 0.098 0.107 0.114
D1
L1
θ1
INCH
SYMBOL
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. Dimensions
D1 and E1 do include mold mismatch and are
determined at datum plane -H- .
θ2
R1
R2
-H-
GAUGE PLANE
S
θ3
L
0.25mm
2. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08mm total in
excess of the b dimension at maximum material
condition. Dambar cannot be located on the lower
radius or the lead foot.
3. Control dimensions are in millimeters.
DETAIL “X”
1