948BG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP28 9.7x4.4 EP
CASE 948BG
ISSUE O
DATE 08 FEB 2012
SCALE 1:1
NOTE 6
B
28
PIN ONE
LOCATION
E
1
2X 14 TIPS
TOP VIEW
0.05 C
A2
NOTE 4
DETAIL A
B
0.10 C
28X
b
0.10 C B A
C
SEATING
PLANE
NOTE 3
SIDE VIEW
M
c
A
28X
NOTE 8
0.20 C B A
NOTE 6
D
SECTION B−B
c
14
A
e
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
b1
c1
ÇÇÇÇ
ÇÇÇÇ
E1
NOTE 5
b
15
B
END VIEW
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL BE 0.07 MAX AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED
ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD IS 0.07.
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 PER SIDE.
DIMENSION D IS DETERMINED AT DATUM
PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 PER SIDE. DIMENSION E1 IS
DETERMINED AT DATUM PLANE H.
6. DATUMS A AND B TO BE DETERMINED AT
DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
8. SECTION B−B TO BE DETERMINED AT 0.10
TO 0.25 FROM THE LEAD TIP.
DIM
A
A1
A2
b
b1
c
c1
D
D2
E
E1
E2
e
L
L2
M
D2
H
L2
E2
A1
NOTE 7
L
C
GAUGE
PLANE
DETAIL A
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
28X
6.47
MILLIMETERS
MIN
MAX
−−−
1.20
0.00
0.15
0.80
1.05
0.19
0.30
0.19
0.25
0.09
0.20
0.09
0.16
9.60
9.80
5.21
6.17
6.40 BSC
4.30
4.50
1.44
2.40
0.65 BSC
0.45
0.75
0.25 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
1.15
XXXXX
XXXXG
ALYW
2.70
6.70
1
0.65
PITCH
28X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON67255E
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
TSSOP28 EP, 9.7X4.4MM, 0.65P
1
DOCUMENT NUMBER:
98AON67255E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. J. LIU.
DATE
08 FEB 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. O
Case Outline Number:
948BG
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