Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA3629
Light position controller
Product specification
File under Integrated Circuits, IC18
1996 Sep 04
Philips Semiconductors
Product specification
Light position controller
TDA3629
FEATURES
GENERAL DESCRIPTION
• Low positional error
The Light position controller (Leucht Weiten Steller, LWS)
is a monolithic integrated circuit intended to be used in
passenger cars. This device adapts the elevation of the
light beam of the head light of the car to a state defined by
the car driver using a potentiometer on the dashboard.
• Low noise sensitivity due to hysteresis
• Low supply current
• Thermally protected
• Broken wire and short-circuit indication on SET input
• Brake function by short-circuiting the motor
• Hysteresis level set externally.
QUICK REFERENCE DATA
SYMBOL
IP(ss)
PARAMETER
supply current, steady state
CONDITIONS
MIN.
TYP.
MAX.
UNIT
note 1
−
−
6
mA
−
IP − Im
supply current, motor active
Im < 900 mA
−
80
mA
Vm
output voltage
Im < 700 mA
VP − 2 −
.9
−
V
Im
output current
VP ≥ 12.3 V
670
−
−
mA
ISET
motor switch on current level
VP = 12 V
6
9
12
µA
Note
1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA3629
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
TDA3629T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
1996 Sep 04
2
Philips Semiconductors
Product specification
Light position controller
TDA3629
BLOCK DIAGRAM
VP1
VP2
handbook, full pagewidth
2(5)
PROTECTION
- OVER VOLTAGE
- UNDER VOLTAGE
- TEMPERATURE
TDA3629
7(12)
SUPPLY
SHORT-CIRCUIT
ISET
VP
BROKEN WIRE
SET
8(16)
3(6)
INPUT
STAGE
FB
WINDOWS
AND
COMPARATORS
1(1)
OUTPUT
STAGES VP
ISET
6(11)
Iref
5(9)
MGE632
Pin numbers in parenthesis represent the TDA3629T.
Fig.1 Block diagram.
1996 Sep 04
3
OUT1
OUT2
Philips Semiconductors
Product specification
Light position controller
TDA3629
PINNING
PIN
SYMBOL
DESCRIPTION
TDA3629
TDA3629T
FB
1
1
feedback input
VP1
2
5
supply voltage 1
OUT1
3
6
output 1
n.c.(1)
4
2 to 4, 7, 8, 10, 13 to 15
not connected
GND
5
9
ground
OUT2
6
11
output 2
VP2
7
12
supply voltage 2
SET
8
16
set input
Note
1. The pins which are not electrically connected should be connected to a copper area of the printed-circuit board which
is as large as possible to improve heat transfer.
handbook, halfpage
FB
1
16 SET
n.c.
2
15 n.c.
14 n.c.
handbook, halfpage
FB
1
VP1
2
OUT1
3
n.c.
4
8
SET
n.c.
3
7
VP2
n.c.
4
6
OUT2
VP1
5
12 VP2
5
GND
OUT1
6
11 OUT2
n.c.
7
10 n.c.
n.c.
8
9
TDA3629
13 n.c.
TDA3629T
MGE633
GND
MGE634
Fig.2 Pin configuration TDA3629.
1996 Sep 04
Fig.3 Pin configuration TDA3629T.
4
Philips Semiconductors
Product specification
Light position controller
TDA3629
FUNCTIONAL DESCRIPTION
The device is intended to control the elevation of the light
beam of a head light of a passenger car. The driver can
control the elevation of the light beam by rotating a
potentiometer on the dashboard (the setting
potentiometer). The device adapts the elevation of the light
beam by activating the control motor. The elevation of the
head light is fed back to the device by a second
potentiometer (the feedback potentiometer).
This feedback potentiometer is mechanically coupled to
the motor.
handbook, halfpage
100
position
(%)
The device operates only when the supply voltage is within
certain limits. The device is switched off outside these
boundaries. The under voltage detection detects whether
the supply voltage is below the under voltage threshold.
The motor will not be activated when this occurs, but it
remains short-circuited by the output stages.
The over voltage will switch off the total device when the
supply voltage is higher than the over voltage threshold.
0
0 VSET(min)
A thermal protection circuit becomes active if the junction
temperature exceeds a value of approximately 160 °C.
This circuit will reduce the motor current, which will result
in a lower dissipation and hence a lower chip temperature.
This condition will only occur when the motor is blocked at
high ambient temperature.
VSET(max) Vb
VSET (V)
Fig.4 Conversion gain.
A detection of a broken wire of the slider of the setting
potentiometer is included because it will be connected to
the device by a wire several meters long. This detection
circuit prevents the motor from rotating when the wire is
broken. In this event the brake will remain active.
The device is protected against electrical transients which
may occur in an automotive environment. The device will
shut off when positive transients on the battery line occur
(see Figs 7 and 8). The motor will not be short-circuited in
this event. The flyback diodes, illustrated in Fig.1, will
remain present. The state of the output stages at the
moment when the transient starts is preserved by internal
flip-flops. Negative transients on the battery line
(see Figs 7 and 8) will result in a set short-circuited to
ground fault detection, because it will result in a voltage at
the setting input which is below the short-circuited to
ground threshold. The device however discharges the
electrolytic capacitor during these transients. It will stop
functioning when the resulting supply voltage becomes too
low.
The protection of VSET to VP circuit prevents the motor
from rotating when the voltage at the VSET input is above
the threshold value. This can be used to detect whether
the wire from the slider of the setting potentiometer is
short-circuited to the battery line. A protection of VSET
short-circuited to ground is also present. The motor will be
stopped if VSET becomes lower than the threshold level.
The shaded areas in Fig.4 represent the parts where the
short-circuit protection stages are active. Figure 4 shows
that a position of 0 mm can not be reached, neither can a
position of 100%. The minimum position that can be
reached depends on the battery voltage Vb, although the
maximum position does not.
1996 Sep 04
MGE635
5
Philips Semiconductors
Product specification
Light position controller
TDA3629
The timing can be divided into several parts starting from
a steady state (see Fig.5, the starting point, and Fig.10 for
the application diagram): in this state (until T1) a large
reference current is active, indicated by the dotted lines.
When the setting potentiometer is rotated (started at T1
and indicated by VSET) and the input current ISET becomes
higher than the reference current Iref (at time T2), the motor
will start and the input current will decrease. At the same
time the reference current is switched to a low level.
During rotation of the motor the input current will decrease
until it becomes lower than this low reference current;
this occurs at time T4. At this time the brake becomes
active, the motor will stop and the reference current is set
to the higher value. The brake is realized by
short-circuiting the motor. In general: this system does not
use a linear adaptation strategy but an on-off strategy.
This results in high accuracy and low noise sensitivity.
The brake is active at any time during normal operation
when the motor is not active. The polarity of the feedback
potentiometer should be such that the voltage at the slider
of the feedback potentiometer increases when OUT1 is
high and OUT2 is low.
handbook, full pagewidth
V2
VSET
V1
V2
VFB
V1
ISET
0
Iref
absolute
motor
current
0
T1
T2
T3
T4
time
MGE636
Fig.5 Timing diagram.
1996 Sep 04
6
Philips Semiconductors
Product specification
Light position controller
TDA3629
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are defined with respect to ground.
Positive currents flow into the device. Values measured in Fig.10.
SYMBOL
VP
PARAMETER
CONDITIONS
supply voltage
MIN.
MAX.
UNIT
operating
8
18
V
non-operating
−0.3
+50
V
−0.3
VP + 0.3
V
−3
+3
kV
−55
+150
°C
Vn
voltage on any other pin
Ves
electrostatic handling
Tstg
storage temperature
Tamb
ambient temperature
−40
+105
°C
Tvj
virtual junction temperature
note 2
−50
+150
°C
Vb, tr
voltage transients on Vb
note 3
−150
+100
V
RL
load resistance
note 4
10
−
Ω
tblock
cumulative blocking time
Im = 700 mA
−
100
h
note 1
Notes
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
2. In accordance with IEC 747-1. An alternative definition of virtual junction temperature Tvj is:
Tvj = Tamb + Pd × Rth vj-amb, where Rth vj-amb is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits
the allowable combinations of power dissipation Pd and ambient temperature Tamb. Additional information is given in
section “Thermal aspects” in chapter “Test and application information”.
3. Wave forms illustrated in Figs 7 and 8 applied to the application diagram, Fig.10.
4. Vb = 13 V; Tamb = 25 °C; duration 50 ms maximum; non repetitive.
THERMAL CHARACTERISTICS
In accordance with IEC 747-1.
SYMBOL
Rth vj-amb
1996 Sep 04
PARAMETER
VALUE
UNIT
TDA3629
100
K/W
TDA3629T
105
K/W
thermal resistance from junction to ambient in free air
7
Philips Semiconductors
Product specification
Light position controller
TDA3629
CHARACTERISTICS
VP = 12 V; RL = 14 Ω. All voltages are defined with respect to ground. Positive currents flow into the device.
Values measured in Fig.10 with RSET = RFB = 20 kΩ; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP(min)
under voltage threshold
VP(max)
over voltage threshold
6
−
8
V
Tamb = 25 °C
18
−
22
V
Tamb = −40 to +105 °C
17.5
−
22.8
V
IP(ss)
supply current, steady state
note 1
−
−
6
mA
IP − Im
supply current, motor active
Im < 400 mA; note 2
−
−
40
mA
Im < 900 mA; note 2
−
−
80
mA
Setting input (SET)
VSET
operating voltage
1.5
−
0.95VP
V
ISET
input current
RSET > 20 kΩ
−250
−
+250
µA
VSET(sc)
wire short-circuited to ground
threshold
output stages switched off
−
−
1
V
wire short-circuited to battery
threshold
output stages switched off
VP
−
−
V
broken ground set pull-up
note 3
−
−
160
mV
∆VSET
Feedback input (FB)
VFB
voltage
IFB(max)
maximum input current
1.5
−
0.95VP
V
RFB > 20 kΩ
−250
−
+250
µA
Im < 700 mA;
Tamb = 25 °C; note 2
VP − 2.9 −
−
V
Im < 700 mA;
Tamb = −40 to +105 °C;
note 2
VP − 3.4 −
−
V
VP ≥ 12.3 V;
Tamb = 25 °C; note 2
670
−
−
mA
VP ≥ 12.3 V;
Tamb = −40 to +105 °C;
note 2
635
−
−
mA
VP = 12 V
6
9
12
µA
VP = 18 V
9
13
17
µA
−
2.5
−
µA
Motor outputs
Vm
Im
output voltage
output current
Reference current
ISET
motor switch-on level
motor switch-off level
1996 Sep 04
8
Philips Semiconductors
Product specification
Light position controller
TDA3629
Notes to the characteristics
1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP.
2. This is only valid when the temperature protection is not active.
3. ∆VSET is the difference in voltage on the set potentiometer between the situation when the ground wire is interrupted
(VSET, br) and voltage on the set potentiometer during normal operation (when VSET = 0.17Vb = 2.72 V).
The conditions for this test are:
RSET = 20 kΩ; Vb = 16 V; ∆VSET = VSET, br − 2.72 V; see Fig.6.
handbook, halfpage
+Vb
battery
830 Ω
REMAINDER OF
MODULE
390 Ω
+
170 Ω
RSET
ground
VSET, br
−
ground wire not connected
MGE637
The 170 Ω, 830 Ω and 390 Ω resistors form the setting potentiometer in its worst case position. The given situation (combination of Vb, RSET and the
position of the set potentiometer) forms the worst case situation. The given maximum of ∆VSET guarantees that any other module, connected to the
same set potentiometer, will not start to activate its motor, when its motor switch-on level is higher than 0.01Vb (RSET ≥ 20 kΩ).
Fig.6 Conditions for the test of note 3.
QUALITY SPECIFICATION
The quality of this device is in accordance with “SNW-FQ-611 part E”. The numbers of the quality specification can be
found in the “Quality reference Handbook”. The handbook can be ordered using the code 9397 750 00192.
1996 Sep 04
9
Philips Semiconductors
Product specification
Light position controller
TDA3629
TEST AND APPLICATION INFORMATION
Automotive transients
handbook, halfpage
112
Vb
(V)
PULSE 2
2 ms
12
0
time
0.5 ms
PULSE 1
−88
MGE638
Fig.7 Worst case transients on Vb (continued in Fig.8).
Worst case transients that may occur on the battery line Vb of the application (see Fig.10), are the pulses whose wave
forms and the corresponding values are as illustrated in Figs 7 and 8. The signal source which generates these pulses
(numbered pulses 1 and 2) has a series resistance (Ri) of 10 Ω. These pulses represent for instance the influence of
switching of inductors on the battery line. The signal source which generates pulses 3 and 4 has a series resistance of
50 Ω. These pulses represent for instance the influence of ignition on the battery line. Their repetition rate is 100 ms.
90 ms pause
handbook, full pagewidth
112
Vb
(V)
PULSE 3
10 ms
100 µs
12
0
time
100 µs
10 ms
PULSE 4
90 ms pause
MGE639
−138
Fig.8 Worst case transients on Vb (continued from Fig.7).
1996 Sep 04
10
Philips Semiconductors
Product specification
Light position controller
TDA3629
The resistor in the feedback input line (RFB) is present to
limit the current during the transients as illustrated in Figs 7
and 8. This resistor should have a value larger than 2 kΩ.
RSET can be chosen freely but must also be larger than
2 kΩ. A diode is placed in series with the supply line in both
applications to protect the device from reverse polarity
switching and from damage caused by pulses 1 and 3 in
Figs 7 and 8. In the present application a varistor is
included in the motor. The electrolytic capacitor of 47 µF
should have a very low ESR, for instance as low as 5 Ω at
a temperature of −40 °C. An extra ceramic capacitor
(approximately 100 nF) parallel to it is obligatory when this
can not be guaranteed.
Application diagrams and additional information
Two possible application diagrams are shown. The first
(see Fig.9) shows the best case: the lowest component
count. The second (see Fig.10) shows additional
components which may be necessary. Two capacitors are
added to meet EMC requirements (one on the VP pins, the
second one between the set and feedback input pins).
A third capacitor has been added across the motor to
suppress current spikes. The given values of these
capacitors have to be optimized by experiments carried
out on the total application. The resistors do not have to
have the same value. The voltage hysteresis is set by
means of RSET.
+Vb
handbook, full pagewidth
47
µF
43 V
VP1
PROTECTION
- OVER VOLTAGE
- UNDER VOLTAGE
- TEMPERATURE
TDA3629
VP2
SUPPLY
SHORT-CIRCUIT
ISET
BROKEN WIRE
+Vb
RSET
1 kΩ
+Vb
2.2 kΩ
SET
+
VSET
−
RFB
+
VFB
−
VP
OUT1
INPUT
STAGE
WINDOWS
AND
COMPARATORS
FB
ISET
OUTPUT
STAGES VP
Im
+
Vm
M
−
OUT2
Iref
MECHANICAL
TRANSMISSION
Fig.9 Best case application diagram.
1996 Sep 04
11
MGE640
Philips Semiconductors
Product specification
Light position controller
TDA3629
+Vb
handbook, full pagewidth
47
µF
43 V
VP1
PROTECTION
- OVER VOLTAGE
- UNDER VOLTAGE
- TEMPERATURE
TDA3629
100
nF
VP2
SUPPLY
SHORT-CIRCUIT
ISET
RSET
1 kΩ
+Vb
VP
BROKEN WIRE
+Vb
+
VSET
−
RFB
2.2 kΩ
SET
100
nF
OUT1
INPUT
STAGE
WINDOWS
AND
COMPARATORS
FB
+
VFB
−
OUTPUT
STAGES VP
ISET
Im
+
Vm
M
−
100
nF
OUT2
Iref
MECHANICAL
TRANSMISSION
MGE641
Fig.10 Worst case application diagram.
It is assumed that the device must be capable of moving
the motor from one end to the other in four equal steps and
that the total time needed for this excursion is 16 seconds.
After this excursion a pause is allowed before the same
pulses are used to return to the original position.
This operation is illustrated in Fig.11.
Thermal aspects
The dissipation of the device is the sum of two sources:
the supply current (IP − Im) times the supply voltage (VP)
plus the motor current (Im) times the output saturation
voltage (VP − Vm). In formula:
P = VP × ( IP – Im ) + Im × ( VP – Vm )
(IP − Im) is approximately equal to IP(ss) when the motor
is not running. It is obvious from the ratings that the
combination of VP = 18 V, (IP − Im) = 80 mA,
Im = 900 mA and (VP − Vm) = 2.5 V can not be
allowed at Tamb = 105 °C; see chapter “Limiting values”
note 2. But it is also improbable that the motor is
continuously driven, therefore the following assumptions
have been made.
1996 Sep 04
12
Philips Semiconductors
Product specification
Light position controller
TDA3629
Stereo operation
The default application will be when two modules are
driven by one set potentiometer. One module controls the
left head light, where the other one controls the right head
light. Each module is connected by three wires: the battery
line, the ground line and the set input wire. This can result
in two additional fault conditions: from one module the
battery line or the ground line can be broken, when the
other module is still connected. Assume that the left one
operates normally, where the right one has a fault. The
setting potentiometer will have extra loading when the
battery line is broken. This will result in a lower voltage at
the wiper of the setting potentiometer. Thus the left module
will start to regulate until a new equilibrium is reached.
The amount of extra loading can be influenced by the
external series resistor in the set input. These fault
conditions and their implications should be considered
when the total application is designed.
8s
handbook, halfpage
pause
4s
active
motor
inactive
time (s)
MGE642
The duration of the pause depends on the ambient temperature, see
Table 1.
Fig.11 Thermal transient test.
Table 1
Duration of the pauses
Tamb (°C)
PAUSE (s)
<95
60
95
180
95 to 105
300
Test diagram
All parameters in chapter “Characteristics” until this
section are measured at Tamb = 25 °C and are tested at
each device using the test set-up of Fig.12. The only
exceptions are parameters supply current (motor active)
and output voltage (motor output) where the 1 kΩ output
resistor is replaced by an appropriate current source.
The maximum allowable dissipated power P is then
0.77 W during the motor active periods in the event of a
DIP8 package being used. Dissipation pulses due to
starting and stopping the motor can be ignored because of
their short duration. This maximum allowable dissipated
power implies that the maximum continuous motor current
(Im) is approximately 250 mA during the motor active
periods when the supply voltage VP is 13 V. The maximum
allowable dissipated power P is 0.67 W during the motor
active periods in the event of a SO16 package being used.
This implies that the maximum continuous motor current
(Im) is approximately 220 mA during the motor active
periods when the supply voltage (VP) is 13 V.
1996 Sep 04
13
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
VP1
PROTECTION
- OVER VOLTAGE
- UNDER VOLTAGE
- TEMPERATURE
TDA3629
VP2
12 V
+
−
SUPPLY
SHORT-CIRCUIT
ISET
RSET =
20 kΩ
+
−
−
VP
SET
VSET
RFB =
20 kΩ
+
BROKEN WIRE
OUT1
INPUT
STAGE
WINDOWS
AND
COMPARATORS
FB
OUTPUT
STAGES VP
ISET
OUT2
VFB
Iref
MGE643
Fig.12 Test set-up (general).
1996 Sep 04
1 kΩ
14
Philips Semiconductors
Product specification
Light position controller
TDA3629
has to be verified, because the level setting may have an
overshoot and the device under test may have a latching
behaviour. The verification is achieved by switching off the
power supply for 1 s after degradation is first detected.
Then the supply is switched on and the degradation is
rechecked. If the second check also indicates a
degradation, then the values of RF level and frequency are
inserted into a data file for reporting. If the second check is
negative the level is further increased.
If no degradation occurs until the specified maximum test
level is reached, the maximum level is recorded together
with the frequency of that step.
IMMUNITY TO NARROW BAND ELECTROMAGNETIC
DISTURBANCES
Test procedure
GENERAL INFORMATION
The immunity is measured using a test procedure, which
is derived from the draft international standard
“ISO/DIS 11452”, parts 1 and 7, submitted for circulation
1992 June 14.
The test is carried out using a printed-circuit test board in
a test set-up, which is illustrated in Fig.13. The circuit
diagram of the test board is shown in Fig.14. The physical
layout of the test board is shown in Figs 15 to 17.
RECOMMENDED RF-VOLTAGE SETTING PROCEDURE
For a fast setting of the RF voltage to the required test level
step it is recommended that the substitution method is
used.
This method sets the actual test level with respect to level
values that have been filed in a pre-measurement.
The RF source in the test set-up is built from a low-power
RF generator and suitable amplifiers. In the recommended
pre-measurement the RF voltage at the injection point is
measured, while the signal generator outputs a constant
voltage level (e.g. 100 mV). Thus, the gain factor from the
output of the RF generator to the injection point can be
easily calculated.
In the pre-measurement the RF voltage at the injection
point is measured for each frequency step. Dividing this
measured voltage by 100 mV results in the gain factor for
this frequency. All gain factors together with their
frequency value are filed for use in the level setting of the
immunity tests.
In the immunity test routine, a required RF voltage test
level at a frequency step is obtained by setting the RF
signal generator to a level that is calculated by dividing the
required RF voltage test level by the gain factor of that
frequency.
PREPARATION OF TEST
The IC under test is mounted onto the printed-circuit test
board. The printed-circuit test board is mounted into the
faraday cage (RF-shielded 19 inch-rack) and connected to
the test equipment as shown in Fig.13. One of three RF
voltage injection points has to be chosen for injection,
while the others have to be connected to passive
terminations. The injection into the control loop via input
RFC is shown in Fig.13.
After the set-up is completed, the feedback voltage is
selected by the appropriate setting of a jumper in the
jumper field J1 (see Fig.14) and the battery voltage is
switched on. With no RF voltage injected the correct
operation of the system is verified by turning the SET
potentiometer (see Fig.13) left and right (or vice-versa).
The outputs OUT1 and OUT2 will switch to on-state
(absolute differential voltage Vdiff = 3 to 5 V DC) in both
turn directions. If the device under test functions correctly,
the potentiometer is set to a position where the absolute
voltage difference between the slider connection of the
potentiometer and the jumper J1 is less than 5 mV.
After adjustment, the absolute differential output voltage
Vdiff has to be below 100 mV. Having reached this
condition the immunity test may be started.
Test conditions
The test is carried out using the test procedure as
mentioned before and under the conditions mentioned in
Table 2.
TEST OF IMMUNITY
For the test of immunity the RF voltage is injected into the
test board and Vdiff is monitored for degradation. Vdiff is
degraded if its actual value exceeds the maximum value
described in Table 2. In the test routine the frequency is
varied in steps from the start frequency to the stop
frequency (see Table 2). Within each frequency step the
level of injected RF voltage is incremented by steps to the
maximum test level, which is specified in Table 2.
Each step level is held constant for the dwell time. After the
dwell time has elapsed, the degradation of the absolute
output voltage is checked. If a degradation is detected it
1996 Sep 04
15
Philips Semiconductors
Product specification
Light position controller
Table 2
TDA3629
General test conditions for immunity measurements
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
General
Tamb
ambient temperature
18
−
28
12.5
−
13.5
V
0
1.0
V
−
250
−
kHz
Vbat
battery voltage
Vdiff
absolute differential output voltage
(DC value)
fstart
start frequency
fstop
stop frequency
fn
frequency steps
VIL(rms)
immunity voltage level (RMS value)
oC
−
1 000
−
MHz
from 250 kHz to 1 MHz
−
−
100
kHz
from 1 to 10 MHz; 9 steps
(logarithmic): n = 0 to 8
−
note 1 −
from 10 to 200 MHz
−
−
2
MHz
from 200 to 1000 MHz
−
−
20
MHz
from 250 kHz to 1 MHz
5
−
−
V
from 1 MHz to 5 MHz
10
−
−
V
from 5 MHz to 1 GHz
15
−
−
V
V
MHz
VTL(max)
maximum test voltage level
−
24
−
VSTART(rms)
voltage start level (RMS value)
2
4
6
V
VSTEP(rms)
voltage level step (RMS value)
−
2
−
V
QTL
relative accuracy of test level
−10
−
+10
%
tdwell
dwell time
2
−
−
s
RF-voltage characteristic; note 2
fM(AM)
AM modulation frequency
constant peak level
−
1
−
kHz
mD
modulation depth
constant peak level
−
0
−
%
Notes
1. The typical value is 1 × 10
n
--9
2. For definition see “ISO/DIS 11452-1”, annex B.
1996 Sep 04
16
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
FARADAY CAGE
LIGHT POSITION CONTROL
IMMUNITY TEST BOARD
CONTROL
RFC
OUT1
100 Ω
50
nF
50 Ω
50
Vdiff
nF
−
+
V
digital
RFS
100 Ω
50
nF
50
nF
Vbat
50 Ω
RF
+13 V
GND
100 Ω
620 Ω
50
nF
SET
1 kΩ
RFG
OUT2
50 Ω
MGE853
RF
RF
digital V
TEST CONTROL
AND
DATA AQUISITION
RFC is the RF voltage injection point to control path.
RFG is the RF voltage injection point to ground.
RFS is the RF voltage injection point to battery voltage (+13 V).
For all decoupling filters Z >> 150 Ω.
Fig.13 Test set-up for immunity test.
1996 Sep 04
17
Philips Semiconductors
Product specification
Light position controller
TDA3629
D1
Vbat
handbook, full pagewidth
+13 V
C2
47 nF
1N4005
RFS
n.c. VP1 VP2 n.c.
R7
1.2 kΩ
n.c.
R1 SET
CONTROL
R6
820 Ω
SET
15 kΩ
C1
R2 FB 100 nF
C3
47 nF
RFC
J1
10
5
12
15
2
14
n.c.
16
IC1
FB
1
6
OUT1
TDA3629T
20 kΩ
n.c.
R5
820 Ω
C6
47 µF
(50 V)
D2
BZT03/C43
C5
1.0 nF
3
11
OUT2
OUT2
OUT1
1
n.c.
4
7
R4
1.2 kΩ
8
13
9
R8
510 Ω
R9
510 Ω
n.c. n.c. n.c. GND
GND
C4
47 nF
OUT2
RFG
OUT1
MGE852
Feedback voltage setting J1: amount of voltage difference between J1 and SET input adjusted by potentiometer setting to <50 mV (see also Fig.13).
Fig.14 Circuit diagram of the test board.
Figs 15 to 17 show the layout of the immunity test board used for the evaluation.
1996 Sep 04
18
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
D1
C6
R7
D2
C1
R6
R8
OUT2
R9
OUT1
CONTROL
C2
RFS
GND
R4
C3
RFC
30 50 70%
C4
R1
R2
+13 V
R5
RFG
C5
IC1
J1
MGE854
Fig.15 Component placement of the printed-circuit board.
handbook, full pagewidth
MGE855
Fig.16 Top view of printed-circuit board.
1996 Sep 04
19
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
MGE856
Fig.17 Bottom view of printed-circuit board.
Test results
MGE858
30
handbook, full pagewidth
VRF(rms)
(V)
20
(1)
device accepted
device not accepted
(2)
10
(3)
(4)
0
10−1
1
10
102
frequency (MHz)
103
(1) Feedback voltage is 30%.
(2) Feedback voltage is 50%.
(3) Feedback voltage is 70%.
(4) Immunity level.
Fig.18 Typical immunity results with respect to setting of jumper 1 (30, 50 and 70%) RF input to RFC.
1996 Sep 04
20
Philips Semiconductors
Product specification
Light position controller
TDA3629
MGE857
30
handbook, full pagewidth
VRF(rms)
(V)
(1)
20
device accepted
device not accepted
(2)
10
(3)
0
10−1
1
10
102
frequency (MHz)
103
(1) RF voltage injection point to ground and to battery voltage.
(2) RF voltage injection point to control path.
(3) Immunity level.
Fig.19 Typical immunity results with respect to RF injection points, with jumper 1 set to 50%.
The typical immunity results of the TDA3629T are shown in Fig.18. The RF voltage was injected into the control line
(see also Figs 13 and 14). This injection point is the most sensitive one that could be found. This is underlined by the
comparison results shown in Fig.19.
1996 Sep 04
21
Philips Semiconductors
Product specification
Light position controller
TDA3629
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT97-1
050G01
MO-001AN
1996 Sep 04
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
22
Philips Semiconductors
Product specification
Light position controller
TDA3629
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0098 0.39
0.014 0.0075 0.38
0.16
0.15
0.050
0.24
0.23
0.041
0.039
0.016
0.028
0.020
0.01
0.01
0.004
0.028
0.012
inches
0.069
0.0098 0.057
0.0039 0.049
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
1996 Sep 04
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
91-08-13
95-01-23
23
o
8
0o
Philips Semiconductors
Product specification
Light position controller
TDA3629
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Sep 04
24
Philips Semiconductors
Product specification
Light position controller
TDA3629
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Sep 04
25
Philips Semiconductors
Product specification
Light position controller
TDA3629
NOTES
1996 Sep 04
26
Philips Semiconductors
Product specification
Light position controller
TDA3629
NOTES
1996 Sep 04
27
Philips Semiconductors – a worldwide company
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Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1996
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
617021/1200/01/pp28
Date of release: 1996 Sep 04
Document order number:
9397 750 01139
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