Data Sheet

PRH601
Multi-frequency integrated reader solution
Rev. 3.3 — 10 March 2016
219233
Product data sheet
COMPANY PUBLIC
1. Introduction
The PRH601 is an integrated RF Identification reader module for contactless
communication at 13.56 MHz and 125 kHz. It implements an additional 32-bit ARM
CortexM0 microcontroller core.
The package contains three dies:
1. LPC1227FBD48/301
2. HTRC11001T/02EE
3. CLRC66301HN1
Not all pins of the LPC1227 specified in the data sheet are available at the reader module.
Please refer to Section 9 “Pinning information”.
The device does not implement any interconnection inside the package. This enables
access to all signals during system development. The device can be replaced by a
integrated reader module PRH601 if no 125 kHz functionality is required. A re-design of
the PCB is not required in this case.
2. General description
2.1 HTRC110
The HITAG Reader Chip HTRC110 is intended for use with transponders, which are
based on the HITAG silicon (HT1ICS3002x or HT2ICS2002x). In addition the IC supports
other 125 kHz transponder types using amplitude modulation for the write operation and
AM/PM for the read operation. The receiver parameters (gain factors, filter cutoff
frequencies) can be optimized to system and transponder requirements.
The HTRC110 is designed for easy integration into RF-identification readers.
State-of-the-art technology allows almost complete integration of the necessary building
blocks. A powerful antenna driver/modulator together with a low-noise adaptive sampling
time demodulator, programmable filters/amplifier and digitizer build the complete
transceiver unit, required to design high-performance readers. A three-pin microcontroller
interface is employed for programming the HTRC110 as well as for the bidirectional
communication with the transponders. The three-wire interface can be changed into a
two-wire interface by connecting the data input and the data output. Tolerance dependent
zero amplitude modulation caused severe problems in envelope detector systems,
resulting in the need of very low tolerance reader antennas. These problems are solved
by the new Adaptive Sampling Time technique (AST).
PRH601
NXP Semiconductors
Multi-frequency integrated reader solution
2.2 CLRC663
The CLRC663 is a highly integrated transceiver IC for contactless communication at
13.56 MHz. This transceiver IC utilizes an outstanding modulation and demodulation
concept completely integrated for different kinds of contactless communication methods
and protocols at 13.56 MHz.
The CLRC663 transceiver ICs support following different operating modes:
•
•
•
•
•
•
•
Reader/Writer mode supporting ISO/IEC 14443A/MIFARE
Reader/Writer mode supporting ISO/IEC 14443B
Reader/Writer mode supporting FeliCa scheme
Reader/Writer mode supporting ISO/IEC 15693
Reader/Writer mode supporting ICODE EPC UID/ EPC OTP
Reader/Writer mode supporting ISO/IEC 18000-3 Mode 3
NFC P2P Initiator
The CLRC663 internal transmitter is able to drive a reader/writer antenna designed to
communicate with ISO/IEC 14443A/MIFARE cards and transponders without additional
active circuitry. The receiver module provides a robust and efficient implementation for
demodulation and decoding signals from ISO 14443A/MIFARE compatible cards and
transponders. The digital module manages the complete ISO 14443A framing and error
detection (parity and CRC) functionality. The CLRC663 supports MIFARE 1K, MIFARE
4K, MIFARE Ultralight, MIFARE, Ultralight C, MIFARE PLUS and MIFARE DESFire
products. The CLRC663 supports contactless communication and uses MIFARE higher
transfer speeds up to 848 kBd in both directions.
The CLRC663 supports all layers of the ISO/IEC 14443B reader/writer communication
scheme, given correct implementation of additional components, like oscillator, power
supply, coil etc. and provided that standardized protocols, e.g. like ISO/IEC 14443-4
and/or ISO/IEC 14443B anticollision are correctly implemented.
Enabled in Reader/Writer mode for FeliCa, the CLRC663 transceiver IC supports the
FeliCa communication scheme. The receiver part provides a robust and efficient
implementation of the demodulation and decoding circuitry for FeliCa coded signals. The
digital part handles the FeliCa framing and error detection like CRC. The CLRC663
supports contactless communication using FeliCa Higher transfer speeds up to 424 kbit/s
in both directions. The CLRC663 supports vicinity protocol according to ISO/IEC15693,
EPC UID and ISO/IEC 18000-3 mode 3. The complete vicinity product family of NXP is
supported and enable a readability for mid-ranger reader applications.
The following host interfaces are provided:
• Serial Peripheral Interface (SPI)
• Serial UART (similar to RS232 with voltage levels dependent on pin voltage supply)
• I2C-bus interface (two versions are implemented: I2C and I2CL)
PRH601
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 10 March 2016
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PRH601
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2.3 LPC1227
The LPC1227 are ARM Cortex-M0 based microcontrollers for embedded applications
featuring a high level of integration and low power consumption. The ARM Cortex-M0 is a
next generation core that offers system enhancements such as enhanced debug features
and a higher level of support block integration. In addition to the ARM Cortex-M0, the
LPC1X features an event handler API to limit the interrupt load of the ARM Cortex-M0
CPU and to allow for additional power-savings by off-loading event handling from the
main CPU.
The LPC1227 operates at CPU frequencies of up to 33 MHz and include up to 128 kB of
flash memory and 8 kB of data memory.
Not all connections of the LPC1227 product are implemented by the PRH600.
3. Features and benefits




The PRH601 is integrating multiple functions in a single small formfactor package.
Reduced PCB size for development of systems with small physical dimensions
Multi frequence reader support available in single package
Integrated microcontroller allows implementation of customer firmware
4. Applications
 Small formfactor access systems
 Industrial devices with high RF performance requirements
 Multi frequency applications with 125 kHz and 13.56 MHz support
5. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VDDL(PC1227)
Min
Typ
Max
Unit
supply voltage LPC1227
3.0
3.3
3.6
V
VDD(CLRC663)
supply voltage CLRC663
3.0
5.0
5.5
V
VDD(HTCRC110)
supply voltage HRTC110
4.5
5.0
5.5
V
Tamb
ambient temperature
25
+25
+70
C
[1]
Conditions
Refer to the specification of integrated products for quick reference data details
6. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
PRH601HL/C1
LQFP100
plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
PRH601
Product data sheet
COMPANY PUBLIC
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Multi-frequency integrated reader solution
7. Marking
Table 3.
Marking codes
Type number
Marking code
PR601HL/C1
1st line
product type
2nd line
1st die diffusion number
3rd line
weekcode
4th line
2nd and 3rd die diffusion number
5th line (optional)
additional information
8. Block diagram
interfaces
and supply
CLRC663
HTRC110
interfaces
and supply
LPC1227
interfaces
and supply
aaa-002213
Fig 1.
PRH601
Product data sheet
COMPANY PUBLIC
Block diagram
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9. Pinning information
9.1 Pinning
Table 4.
PRH601
Product data sheet
COMPANY PUBLIC
Pin allocation table
Pin
Symbol
Connection
1
PIO0_10
LPC1227
2
PIO0_11
LPC1227
3
PIO0_12
LPC1227
4
nRESET/PIO0_13
LPC1227
5
PIO0_14
LPC1227
6
PIO0_15
LPC1227
7
PIO0_16
LPC1227
8
PIO0_17
LPC1227
9
PIO0_18
LPC1227
10
PIO0_30
LPC1227
11
PIO0_31
LPC1227
12
PIO1_0
LPC1227
13
PIO1_1
LPC1227
14
GND
all
15
PIO1_2
LPC1227
16
PIO1_3/WAKEUP
LPC1227
17
PIO1_4
LPC1227
18
PIO1_5
LPC1227
19
PIO1_6
LPC1227
20
VSS
LPC1227
21
VDD(3V3)
LPC1227
22
RTCXOUT
LPC1227
23
RTCXIN
LPC1227
24
VDDIO
LPC1227
25
VSSIO
LPC1227
26
CEXT
HTRC110
27
DGND
HTRC110
28
RX
HTRC110
29
VSS
HTRC110
30
TX2
HTRC110
31
VDD
HTRC110
32
TX1
HTRC110
33
MODE
HTRC110
34
AVDD
CLRC663
35
AUX1
CLRC663
36
AUX2
CLRC663
37
RXP
CLRC663
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Multi-frequency integrated reader solution
Table 4.
PRH601
Product data sheet
COMPANY PUBLIC
Pin allocation table …continued
Pin
Symbol
Connection
38
RXN
CLRC663
39
VMID
CLRC663
40
TX2
CLRC663
41
TVSS
CLRC663
42
GND
CLRC663
43
TX1
CLRC663
44
TVDD
CLRC663
45
XTAL1
CLRC663
46
n.c.
-
47
XTAL2
CLRC663
48
n.c.
-
49
PD
CLRC663
50
n.c.
-
51
CLKOUT
CLRC663
52
SCL
CLRC663
53
SDA
CLRC663
54
PVDD
CLRC663
55
IFSEL0
CLRC663
56
IFSEL1
CLRC663
57
IF0
CLRC663
58
IF1
CLRC663
59
IF2
CLRC663
60
IF3
CLRC663
61
IRQ
CLRC663
62
GND
CLRC663
63
TDO
CLRC663
64
TDI
CLRC663
65
TMS
CLRC663
66
TCK
CLRC663
67
SIGIN
CLRC663
68
SIGOUT
CLRC663
69
DVDD
CLRC663
70
VDDS
CLRC663
71
XTAL1
HTRC110
72
XTAL2
HTRC110
73
SCLK
HTRC110
74
DIN
HTRC110
75
DOUT
HTRC110
76
XTALIN
LPC1227
77
XTALOUT
LPC1227
78
VREF_COMP
LPC1227
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Table 4.
Pin allocation table …continued
Pin
Symbol
Connection
79
PIO0_19
LPC1227
80
PIO0_20
LPC1227
81
PIO0_21
LPC1227
82
PIO0_22
LPC1227
83
PIO0_23
LPC1227
84
PIO0_24
LPC1227
85
PIO0_25
LPC1227
86
PIO0_26
LPC1227
87
PIO0_27
LPC1227
88
GND
all
89
PIO0_28
LPC1227
90
PIO0_29
LPC1227
91
PIO0_0
LPC1227
92
PIO0_1
LPC1227
93
PIO0_2
LPC1227
94
PIO0_3
LPC1227
95
PIO0_4
LPC1227
96
PIO0_5
LPC1227
97
PIO0_6
LPC1227
98
PIO0_7
LPC1227
99
PIO0_8
LPC1227
100
PIO0_9
LPC1227
9.2 Pin description
For a description of the detailed pin functionality refer to the relevant product data sheet.
VSS and GND refer to the same signal and need all be connected.
10. Functional description
The functionality of this device is defined by the functionality of the three chips CLRC663,
HTRC110 and LPC1227. No internal connection of the devices had been implemented
except for the GND signal. All external available GND signals need to be connected. A
design making use of this device shall consider a sufficient low thermal resistance
between package and environment. All pins are recommended to be connected to defined
signal levels. A PCB design using the PRH600 shall make use of state of the art design
practices to ensure a sufficient heat dissipation. For a detailed functionality refer to the
latest product specifications of the CLRC663, HTRC110 and LPC1227.
PRH601
Product data sheet
COMPANY PUBLIC
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Rev. 3.3 — 10 March 2016
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11. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
ambient temperature
25 C
-
2.0
W
VESD
electrostatic discharge voltage
human body model; all
pins
1500
-
V
12. Characteristics
Table 6.
Characteristics [1]
Symbol
Parameter
VDD(LPC)
supply voltage of LPC1227die
Conditions
Min
Typ
Max
Unit
3.0
3.3
3.6
V
VDD(CLRC)
supply voltage of CLRC663 die
3.0
5.0
5.5
V
Tamb
ambient temperature
25
+25
+70
C
IDD(TVDD)
TVDD supply current
-
100
200
mA
[1]
CLRC663 die transmitter
supply current
For a detailed information of the characteristics refer to the data sheets of the packaged products
PRH601
Product data sheet
COMPANY PUBLIC
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13. Package outline
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
pin 1 index
L
100
detail X
26
1
25
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
1.15
0.85
1.15
0.85
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Fig 2.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
Package outline LQFP100 (SOT407-1)
PRH601
Product data sheet
COMPANY PUBLIC
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14. Handling information
Moisture Sensitivity Level (MSL) evaluation has been performed according to
SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 2 which
means 260 C convection reflow temperature.
Dry pack is required.
1 year out-of-pack floor life at maximum ambient temperature 30 C/ 85 % RH.
15. Packing information
The straps around the package of
stacked trays inside the plano-box
have sufficient pre-tension to avoid
loosening of the trays.
strap 46 mm from corner
tray
ESD warning preprinted
chamfer
barcode label (permanent)
PIN 1
barcode label (peel-off)
chamfer
QA seal
PIN 1
Hyatt patent preprinted
In the traystack (2 trays)
only ONE tray type* allowed
*one supplier and one revision number.
printed plano box
001aaj740
Fig 3.
Packing information 1 tray
16. Abbreviations
Table 7.
PRH601
Product data sheet
COMPANY PUBLIC
Abbreviations
Acronym
Description
AST
Adaptive Sampling Time technique
EPC
Electronic Product Code
OTP
One Time Programmable
SPI
Serial Peripheral Interface
UID
Unique IDentification
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17. Glossary
Die — unpackaged chip of a product
18. References
1.
[1]
Data sheet — CLRC663, Contactless reader IC, BU-ID Document number 1711**1
[2]
Data sheet — HTRC110, HITAG reader chip, BU-ID Document number 0370**
[3]
Data sheet — LPC122x, 32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash
and 8 kB SRAM
** .. document version number
PRH601
Product data sheet
COMPANY PUBLIC
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19. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PRH601 v. 3.3
20160310
Product data sheet
-
PRH601 v. 3.2
Modifications:
PRH601 v. 3.2
Modifications:
PRH601 v. 3.1
Modifications:
PRH601 v. 3.0
Modifications:
PRH601 v.1.1
Modifications:
PRH601 v.1.0
PRH601
Product data sheet
COMPANY PUBLIC
•
Table 6 “Characteristics
20160111
•
-
PRH601 v. 3.1
Product data sheet
-
PRH601 v. 3.0
-
PRH601 v. 1.1
Pin names 13 and 15 corrected
Section 20.4 “Licenses”. updated
Product data sheet
Figure 1 “Block diagram”: corrected from LPC1127 into LPC1227
Data sheet status changed to “Product data sheet”
20121024
•
Product data sheet
Descriptive title changed
20121112
•
•
TVDD supply current values added
Section 2.2 “CLRC663”: License statement updated
20151006
•
•
•
[1]”:
Objective data sheet
-
PRH601 v.1.0
-
-
General update
20120315
Objective data sheet
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20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PRH601
Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
20.4 Licenses
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481
does not convey an implied license under any patent right infringed by
implementation of any of those standards. Purchase of NXP
Semiconductors IC does not include a license to any NXP patent (or other
IP right) covering combinations of those products with other products,
whether hardware or software.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.5 Trademarks
This NXP Semiconductors IC is ISO/IEC 14443 Type B
software enabled and is licensed under Innovatron’s
Contactless Card patents license for ISO/IEC 14443 B.
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
ICODE and I-CODE — are trademarks of NXP B.V.
MIFARE Plus — is a trademark of NXP B.V.
MIFARE Ultralight — is a trademark of NXP B.V.
DESFire — is a trademark of NXP Semiconductors N.V.
I2C-bus — logo is a trademark of NXP B.V.
HITAG — is a trademark of NXP B.V.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PRH601
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 10 March 2016
219233
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 15
PRH601
NXP Semiconductors
Multi-frequency integrated reader solution
22. Contents
1
2
2.1
2.2
2.3
3
4
5
6
7
8
9
9.1
9.2
10
11
12
13
14
15
16
17
18
19
20
20.1
20.2
20.3
20.4
20.5
21
22
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . . 1
HTRC110 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
CLRC663 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
LPC1227. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features and benefits . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Handling information. . . . . . . . . . . . . . . . . . . . 10
Packing information . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 March 2016
219233