MATERIAL DECLARATION SHEET Material Number CD214C-T5.0A~170A, 5.0CA~170CA Product Line Semiconductor Products Compliance Date 2011/01/01 RoHS Compliant No. Yes Construction Element(subpart) MSL 1 Homogeneous Material Material weight [mg] 1 Dice Silicon 4.829 2 Die attach (Solder) solder paste 9.170 3 Lead frame / Leads / Disc N/A 110.667 4 Molding Compound (Plastic Package Only) Epoxy material 112.150 5 Plating Matte-Tin Total weight 1.275 238.091 This Document was updated on: Headquarters Riverside CA Homogeneous CASRN Material\ if applicable Substances Silicon 7440-21-3 Phosphorus 7723-14-0 Boron 7440-42-8 Nickel 7440-02-0 Lead 7439-92-1 Silicon dioxide 7631-86-9 Aluminum oxide 1344-28-1 Tin 7440-31-5 Lead 7439-92-1 Silver 7440-22-4 Copper 7440-50-8 Iron 7439-89-6 Phosphorus 7723-14-0 Silica 14808-60-7 Epoxy resin 25928-94-3 Phenolic resin-A,-B 9003-35-4 Hydroxide metal N/A Carbon black 1333-86-4 Tin 7440-31-5 Materials Mass % 60.1800% 0.0100% 0.0100% 14.8000% 12.5000% 10.0000% 2.5000% 5.000% 92.500% 2.500% 99.800% 0.150% 0.050% 76.000% 9.000% 8.000% 6.000% 1.000% 100.000% Material Mass % of total unit wt 1.221% 0.0002% 0.0002% 0.300% 0.254% 0.203% 0.0507% 0.193% 3.563% 0.096% 46.388% 0.070% 0.023% 35.799% 4.239% 3.768% 2.826% 0.471% 0.536% Subpart mass of total wt. (%) 2.028% 3.851% 46.481% 47.104% 0.536% 2015/02/09 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET (EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2