MATERIAL DECLARATION SHEET Material Number SMCJ5.0A~350A, SMCJ5.0CA~170CA Product Line Semiconductors Compliance Date 2011/01/01 RoHS Compliant No. Yes Construction Element (subpart) MSL 1 Homogeneous Material Material weight [mg] 1 Dice Silicon 4.829 2 Die attach (Solder) Solder paste 9.170 3 Lead frame / Leads / Disc N/A 110.667 4 Molding Compound (Plastic Package Only) Epoxy material 112.150 5 Plating Matte-Tin Total weight 1.275 238.091 This Document was updated on: Homogeneous Material\ Substances Silicon Phosphorous Boron Nickel CASRN if applicable 7440-21-3 7723-14-0 7440-42-8 7440-02-0 Lead-containing glass 7439-92-1 Silicon dioxide 7631-86-9 Aluminum oxide 1344-28-1 Tin 7440-31-5 Lead 7439-92-1 Silver 7440-22-4 Copper 7440-50-8 Iron 7439-89-6 Phosphorus 7723-14-0 Silica 14808-60-7 Epoxy resin 25928-94-3 Phenolic resin-A,-B 9003-35-4 Hydroxide metal 21645-51-2 Carbon black 1333-86-4 Tin 7440-31-5 Materials Mass % 60.18 0.01 0.01 14.80 12.50 10.00 2.50 5.00 92.50 2.50 99.80 0.15 0.05 76.00 9.00 8.00 6.00 1.00 100.00 Material Mass % of total unit wt 1.2205 0.0002 0.0002 0.3001 0.2535 0.2028 0.0507 0.192 3.563 0.096 46.388 0.070 0.023 35.80 4.239 3.768 2.826 0.471 0.536 Subpart mass of total wt. (%) 2.028 3.851 46.481 47.104 0.536 2015/02/09 (EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead); 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1