Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 18 January 2016, 12:25 GMT Diotec Semiconductor AG DUNS-Nummer: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations Autorisiert durch: Udo Steinebrunner, Product Manager, - Deklaration gilt ab: 1 May 2004 [Approved on 23 January 2014, 06:50 GMT] Materialien und Stoffe Verwendung/Andordnung Material group Chip (die) Other inorganic materials Encapsulation Glass % w/w des Materials im Artikel 1.50000% 15.00000% Leadfinish Tin plating 23.50000% Leadframe Copper alloys 60.00000% Substances in the material CAS Number % w/w des Stoffs im Artikel Platinum 7440-06-4 2.50000% Silver 7440-22-4 8.00000% Silicon 7440-21-3 89.50000% Potassium oxide (K2O) 12136-45-7 4.20000% Lead silicate 10099-76-0 95.80000% Tin 7440-31-5 100.00000% Iron 7439-89-6 2.00000% Copper 7440-50-8 98.00000% Beigefügte Artikelliste Part number Artikelbezeichnung Artikelmasse Artikelmasse UoM SOD-80C/Glass MiniMELF Diode SMD 0.04 g Page 1 Report generated: 18 January 2016, 12:25 GMT