Aug-15 No. Part Name 1 Substrate 2 Solder Paste 3 Components 3(i) FC-DFN Active Ics Clip 4 LTM4650 144LD BGA-PBF 16mm X 16mm X 5.01mm (TABLE OF MATERIAL DECLARATION) This Package is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+) polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Material Mass Material Name Materials Analysis (element) CAS Number Weight (gram) (gram) Circuit Board 0.3121 105391-33-1 Bismaleimide/Triazine Resin/Filler Substances (Silica 1156-51-0/9003-36-5/21645-51-2 0.06996 Crystalline) non-disclosure Continuous Filament Fiber Glass 65997-17-3 0.06204 Copper Metal 7440-50-8 0.15025 Zinc 7440-66-6 0.00001 Chromium(III) oxide 1308-38-9 0.00001 Silver coated Copper powder 7440-50-8 0.00158 Epoxy Resin non-disclosure 0.00023 1-Cyanoethyl-2-Undecylimidazole 23996-16-9 0.00002 Curing reagent *non-disclosure 0.00003 Acrylic Resin non-disclosure 0.01401 Copper Compounds 147-14-8 0.00006 Barium Compounds 7727-43-7 0.00735 Silica amorphous 7631-86-9 0.00009 Talc;not containing fibers like asbestos 14807-96-6 0.00085 Aromatic carbonyl compounds non-disclosure 0.00080 Cyanoguanidine 461-58-5 0.00002 Amine compounds non-disclosure 0.00010 Leveling agent and others non-disclosure 0.00032 Nickel 7440-02-0 0.00379 Gold 7440-57-5 0.00049 7440-38-2 Ecotoxic substances 0.00005 7440-28-0 Alloy 0.0178 Tin (Sn) 7440-31-5 0.01692 Antimony (Sb) 7440-36-0 0.00089 Passive/Active 1.3041 Iron Powder (Fe) 7439-89-6 1.02660 Copper (Cu) 7440-50-8 0.25007 Nickel (Ni) 7440-02-0 0.00343 Tin (Sn) 7440-31-5 0.00850 Ceramic (Ba) Compounds 12047-27-7 0.01551 0.2180 Silicon Silicon (Si) 7440-21-3 0.00246 Copper Clip Copper (Cu) 7440-50-8 0.04859 Leadfinish Plating Solder Paste Alloy Encapsulation Epoxy Resin Lead frame Lead frame Wire Active Ics Copper Silicon 0.0013 Iron (Fe) Zinc (Zn) Tin (Sn) Silver (Ag) Lead (Pb) Silver (Ag) Tin (Sn) Epoxy resin Carbon black Silica (Si) Copper (Cu) Iron (Fe) Zinc (Zn) Copper (Cu) Silicon (Si) 7439-89-6 7440-66-6 7440-31-5 7440-22-4 7439-92-1 7440-22-4 7440-31-5 29690-82-2 1333-86-4 60676-86-0 7440-50-8 7439-89-6 7440-66-6 7440-50-8 7440-21-3 0.00120 0.00006 0.00228 0.00017 0.00352 0.00009 0.00007 0.00928 0.00018 0.08067 0.06770 0.00167 0.00008 0.00002 0.00132 Materials Analysis (weight %) 22.42 19.88 48.15 0.00 0.00 0.51 0.07 0.01 0.01 4.49 0.02 2.35 0.03 0.27 0.26 0.01 0.03 0.10 1.22 0.16 0.02 95.00 5.00 78.72 19.18 0.26 0.65 1.19 1.13 22.29 0.55 0.03 1.05 0.08 1.62 0.04 0.03 4.26 0.08 37.00 31.05 0.76 0.04 0.01 100.00 5 6 Wire Solder Ball Gold Alloy 0.0013 0.2408 7 8 Cu Frame Encapsulation Cu Epoxy Resin 0.3311 1.4019 Total Package Weight 3.8285 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts Gold (Au) Tin (Sn) Silver (Ag) Copper (Cu) Cu Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide 7440-57-5 7440-31-5 7440-22-4 7440-50-8 7440-50-8 60676-86-0 non-disclosure non-disclosure 14808-60-7 1333-86-4 non-disclosure 0.00130 0.23240 0.00722 0.00120 0.33114 1.08224 0.12477 0.12477 0.04206 0.00701 0.02103 99.99 96.50 3.00 0.50 100.00 77.20 8.90 8.90 3.00 0.50 1.50