Jul-13 LTM4609-141 LD 15mm X 15mm X 2.82mm (TABLE OF MATERIAL DECLARATION) The LTM4609 is RoHS compliant per EU RoHS Directive 2003/95/EC. No. 1 3 4 5 6 8 Note: It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Weight Material Mass Materials Analysis Part Name Material Name Materials Analysis (element) CAS Number (gram) (gram) (weight %) Substrate Circuit Board 0.1453 Barium Compounds 7727-43-7 0.00218 1.500 Filler Substances (Silica non-disclosure 0.05801 39.915 Crystalline) Copper Metal 7440-50-8 0.08138 56.000 Copper Compounds 1328-53-6 0.00003 0.018 Ecotoxic substances 7439-92-1 0.00000 0.000 Gold metal or alloy 7440-57-5 0.00067 0.460 Nickel 7440-02-0 0.00305 2.100 Zinc 7440-66-6 0.00001 0.007 Solder Paste Alloy 0.0216 Sn 7440-31-5 0.02049 95.000 Sb 7440-36-0 0.00108 5.000 0.1331 Nickel 7440-02-0 0.01009 7.579 Passive/Active Tin (Sn) 7440-31-5 0.00316 2.371 Components Copper (Cu) 7440-50-8 0.03931 29.529 Ceramic 12047-27-7 0.08017 60.221 glass 1517-36-8 0.00027 0.199 Epoxy non-disclosure 0.00013 0.101 Active Ics Silicon 0.0183 Silicon 7440-21-3 0.01829 100.000 Wire Gold 0.0029 Au 7440-57-5 0.00294 99.990 1.1702 Fused Silica 60676-86-0 0.89643 76.607 Encapsulation Epoxy Resin Epoxy Resin non-disclosure 0.11233 9.600 Phenol Resin non-disclosure 0.10335 8.832 Crytalline Silica 14808-60-7 0.03484 2.977 Carbon Black 1333-86-4 0.00581 0.497 Metal Hydroxide non-disclosure 0.01742 1.489 Total Package Weight 1.4914 Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts