318A

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−143
CASE 318A−06
ISSUE U
DATE 07 SEP 2011
SCALE 4:1
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM­
UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO­
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE.
5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
e
D
A
GAUGE
PLANE
E
SEATING
PLANE
L
L2
DETAIL A
E1
b1
e1
B
3X
b
0.20
TOP VIEW
H
c
A
A1
c
0.10 C
C
SIDE VIEW
C A-B D
M
DETAIL A
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
0.80
1.12
0.01
0.15
0.30
0.51
0.76
0.94
0.08
0.20
2.80
3.05
2.10
2.64
1.20
1.40
1.92 BSC
0.20 BSC
0.35
0.70
0.25 BSC
DIM
A
A1
b
b1
c
D
E
E1
e
e1
L
L2
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT
1.92
XXX MG
G
1
4X
0.75
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
2.70
0.20
3X
0.96
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.54
DIMENSIONS: MILLIMETERS
STYLE 1:
PIN 1.
2.
3.
4.
COLLECTOR
EMITTER
EMITTER
BASE
STYLE 2:
PIN 1.
2.
3.
4.
SOURCE
DRAIN
GATE 1
GATE 2
STYLE 3:
PIN 1.
2.
3.
4.
GROUND
SOURCE
INPUT
OUTPUT
STYLE 4:
PIN 1.
2.
3.
4.
STYLE 7:
PIN 1.
2.
3.
4.
SOURCE
GATE
DRAIN
SOURCE
STYLE 8:
PIN 1.
2.
3.
4.
SOURCE
GATE
DRAIN
N/C
STYLE 9:
PIN 1.
2.
3.
4.
GND
IOUT
VCC
VREF
STYLE 10:
PIN 1. DRAIN
2. N/C
3. SOURCE
4. GATE
DOCUMENT NUMBER:
STATUS:
98ASB42227B
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
OUTPUT
GROUND
GROUND
INPUT
SOT−143
http://onsemi.com
1
STYLE 5:
PIN 1.
2.
3.
4.
SOURCE
DRAIN
GATE 1
SOURCE
STYLE 6:
PIN 1.
2.
3.
4.
GND
RF IN
VREG
RF OUT
STYLE 11:
PIN 1. SOURCE
2. GATE 1
3. GATE 2
4. DRAIN
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ASB42227B
PAGE 2 OF 2
ISSUE
U
REVISION
REDREW TO JEDEC STANDARDS. ADDED SOLDER FOOTPRINT. REQ. BY D.
TRUHITTE.
DATE
07 SEP 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 06U
Case Outline Number:
318A
Similar pages