INTERSIL EL5128

EL5128
®
Data Sheet
May 4, 2007
Dual VCOM Amplifier & Gamma Reference
Buffer
The EL5128 integrates two VCOM amplifiers with a single
gamma reference buffer. Operating on supplies ranging from
5V to 15V, while consuming only 2.0mA, the EL5128 has a
bandwidth of 12MHz (-3dB) and provides common mode
input ability beyond the supply rails, as well as rail-to-rail
output capability. This enables the amplifier to offer
maximum dynamic range at any supply voltage. The EL5128
also features fast slewing and settling times, as well as a
high output drive capability of 30mA (sink and source).
The EL5128 is targeted at TFT-LCD applications, including
notebook panels, monitors, and LCD-TVs. It is available in
the 10 Ld MSOP package and is specified for operation over
the -40°C to +85°C temperature range.
Pinout
VINA- 2
- +
+ -
VINA+ 3
VS+ 4
• Dual VCOM amplifier
• Single gamma reference buffer
• 12MHz -3dB bandwidth
• Supply voltage = 4.5V to 16.5V
• Low supply current = 2.0mA
• High slew rate = 10V/µs
• Unity-gain stable
• Beyond the rails input capability
• Rail-to-rail output swing
• Ultra-small package
• Pb-Free Plus Anneal Available (RoHS Compliant)
• TFT-LCD drive circuits
• Notebook displays
10 VOUTB
• LCD desktop monitors
9 VINB-
• LCD-TVs
8 VINB+
Ordering Information
7 VS-
VINC 5
Features
Applications
EL5128
(10 LD MSOP)
TOP VIEW
VOUTA 1
FN7000.3
6 VOUTC
PART
NUMBER
PART
MARKING
TAPE &
REEL
PACKAGE
PKG.
DWG. #
EL5128CY
2
-
10 Ld MSOP MDP0043
(3.0mm)
EL5128CY-T7
2
7”
10 Ld MSOP MDP0043
(3.0mm)
EL5128CY-T13
2
13”
10 Ld MSOP MDP0043
(3.0mm)
EL5128CYZ
(Note)
BAAAA
-
10 Ld MSOP MDP0043
(3.0mm)
(Pb-free)
EL5128CYZ-T7
(Note)
BAAAA
7”
10 Ld MSOP MDP0043
(3.0mm)
(Pb-free)
EL5128CYZ-T13 BAAAA
(Note)
13”
10 Ld MSOP MDP0043
(3.0mm)
(Pb-free)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003, 2004, 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL5128
Absolute Maximum Ratings (TA = +25°C)
Thermal information
Supply Voltage between VS+ and VS- . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS- - 0.5V, VS + 0.5V
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . 30mA
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at
the specified temperature and are pulsed tests, therefore: TJ = TC = TA
VS+ = +5V, VS- = -5V, RL = 10kΩ and CL = 10pF to 0V, TA = +25°C Unless Otherwise Specified
Electrical Specifications
PARAMETER
DESCRIPTION
CONDITION
MIN
TYP
MAX
UNIT
12
mV
INPUT CHARACTERISTICS
VOS
Input Offset Voltage
VCM = 0V
2
TCVOS
Average Offset Voltage Drift
(Note 1)
5
IB
Input Bias Current
VCM = 0V
2
RIN
Input Impedance
1
GΩ
CIN
Input Capacitance
1.35
pF
CMIR
Common-Mode Input Range
(VCOM amps)
CMRR
Common-Mode Rejection Ratio
(VCOM amps) for VIN from -5.5V to +5.5V
50
70
dB
AVOL
Open-Loop Gain
-4.5V ≤ VOUT ≤ +4.5V (VCOM amps)
75
95
dB
AV
Voltage Gain
-4.5V ≤ VOUT ≤ +4.5V
-5.5
µV/°C
50
+5.5
0.995
nA
V
1.005
V/V
-4.85
V
OUTPUT CHARACTERISTICS
VOL
Output Swing Low
IL = -5mA
VOH
Output Swing High
IL = 5mA
ISC
IOUT
-4.92
4.85
4.92
V
Short Circuit Current
±120
mA
Output Current
±30
mA
80
dB
POWER SUPPLY PERFORMANCE
PSRR
Power Supply Rejection Ratio
VS is moved from ±2.25V to ±7.75V
60
IS
Supply Current (per amplifier)
No load
660
1000
µA
DYNAMIC PERFORMANCE
SR
Slew Rate (Note 2)
-4.0V ≤ VOUT ≤ +4.0V, 20% to 80%
10
V/µs
tS
Settling to +0.1% (AV = +1)
(AV = +1), VO = 2V step
500
ns
BW
-3dB Bandwidth
RL = 10kΩ, CL = 10pF
12
MHz
GBWP
Gain-Bandwidth Product
RL = 10kΩ, CL = 10pF (VCOM amps)
8
MHz
PM
Phase Margin
RL = 10kΩ, CL = 10pF (VCOM amps)
50
°
CS
Channel Separation
f = 5MHz
75
dB
NOTES:
1. Measured over operating temperature range.
2. Slew rate is measured on rising and falling edges.
2
FN7000.3
May 4, 2007
EL5128
VS+ = +5V, VS- = 0V, RL = 10kΩ and CL = 10pF to 2.5V, TA = +25°C Unless Otherwise Specified
Electrical Specifications
PARAMETER
DESCRIPTION
CONDITION
MIN
TYP
MAX
UNIT
10
mV
INPUT CHARACTERISTICS
VOS
Input Offset Voltage
VCM = 2.5V
2
TCVOS
Average Offset Voltage Drift
(Note 3)
5
IB
Input Bias Current
VCM = 2.5V
2
RIN
Input Impedance
1
GΩ
CIN
Input Capacitance
1.35
pF
CMIR
Common-Mode Input Range
CMRR
Common-Mode Rejection Ratio
for VIN from -0.5V to +5.5V
45
66
dB
AVOL
Open-Loop Gain
0.5V ≤ VOUT ≤+ 4.5V
75
95
dB
AV
Voltage Gain
0.5V ≤ VOUT ≤+ 4.5V
0.995
-0.5
µV/°C
50
+5.5
nA
V
1.005
V/V
150
mV
OUTPUT CHARACTERISTICS
VOL
Output Swing Low
IL = -5mA
VOH
Output Swing High
IL = +5mA
ISC
IOUT
80
4.85
4.92
V
Short Circuit Current
±120
mA
Output Current
±30
mA
80
dB
POWER SUPPLY PERFORMANCE
PSRR
Power Supply Rejection Ratio
VS is moved from 4.5V to 15.5V
60
IS
Supply Current (per amplifier)
No load
660
1000
µA
DYNAMIC PERFORMANCE
SR
Slew Rate (Note 4)
1V ≤ VOUT ≤ 4V, 20% to 80%
10
V/µs
tS
Settling to +0.1% (AV = +1)
(AV = +1), VO = 2V step
500
ns
BW
-3dB Bandwidth
RL = 10kΩ, CL = 10pF
12
MHz
GBWP
Gain-Bandwidth Product
RL = 10kΩ, CL = 10pF
8
MHz
PM
Phase Margin
RL = 10kΩ, CL = 10pF
50
°
CS
Channel Separation
f = 5MHz
75
dB
NOTES:
3. Measured over operating temperature range.
4. Slew rate is measured on rising and falling edges.
3
FN7000.3
May 4, 2007
EL5128
VS+ = +15V, VS- = 0V, RL = 10kΩ and CL = 10pF to 7.5V, TA = +25°C Unless Otherwise Specified
Electrical Specifications
PARAMETER
DESCRIPTION
CONDITION
MIN
TYP
MAX
UNIT
14
mV
INPUT CHARACTERISTICS
VOS
Input Offset Voltage
VCM = 7.5V
2
TCVOS
Average Offset Voltage Drift
(Note 5)
5
IB
Input Bias Current
VCM = 7.5V
2
RIN
Input Impedance
1
GΩ
CIN
Input Capacitance
1.35
pF
CMIR
Common-Mode Input Range
CMRR
Common-Mode Rejection Ratio
for VIN from -0.5V to +15.5V
53
72
dB
AVOL
Open-Loop Gain
0.5V ≤ VOUT ≤ 14.5V
75
95
dB
AV
Voltage Gain
0.5V ≤ VOUT ≤ 14.5V
0.995
-0.5
µV/°C
50
+15.5
nA
V
1.005
V/V
150
mV
OUTPUT CHARACTERISTICS
VOL
Output Swing Low
IL = -5mA
VOH
Output Swing High
IL = +5mA
ISC
IOUT
80
14.85
14.92
V
Short Circuit Current
±120
mA
Output Current
±30
mA
80
dB
POWER SUPPLY PERFORMANCE
PSRR
Power Supply Rejection Ratio
VS is moved from 4.5V to 15.5V
60
IS
Supply Current (per amplifier)
No load
660
1000
µA
DYNAMIC PERFORMANCE
SR
Slew Rate (Note 6)
1V ≤ VOUT ≤ 14V, 20% to 80%
10
V/µs
tS
Settling to +0.1% (AV = +1)
(AV = +1), VO = 2V step
500
ns
BW
-3dB Bandwidth
RL = 10kΩ, CL = 10pF
12
MHz
GBWP
Gain-Bandwidth Product
RL = 10kΩ, CL = 10pF
8
MHz
PM
Phase Margin
RL = 10kΩ, CL = 10pF
50
°
CS
Channel Separation
f = 5MHz
75
dB
NOTES:
5. Measured over operating temperature range.
6. Slew rate is measured on rising and falling edges.
4
FN7000.3
May 4, 2007
EL5128
Typical Performance Curves
70
21
VS=±5V
VS=±5V
5
0
-5
0
50
100
2.0
0.0
-2.0
150
-50
DIE TEMPERATURE (°C)
0
50
100
150
DIE TEMPERATURE (°C)
FIGURE 3. INPUT OFFSET VOLTAGE vs TEMPERATURE
FIGURE 4. INPUT BIAS CURRENT vs TEMPERATURE
-4.91
VS=±5V
IOUT=5mA
4.96
4.95
4.94
OUTPUT LOW VOLTAGE (V)
4.97
OUTPUT HIGH VOLTAGE (V)
19
FIGURE 2. INPUT OFFSET VOLTAGE DRIFT
INPUT BIAS CURRENT (nA)
INPUT OFFSET VOLTAGE (mV)
FIGURE 1. INPUT OFFSET VOLTAGE DISTRIBUTION
-50
17
INPUT OFFSET VOLTAGE DRIFT, TCVOS (µV/°C)
INPUT OFFSET VOLTAGE (mV)
10
15
1
12
8
10
6
4
2
-0
-2
-4
0
-6
0
-8
10
-10
200
13
20
11
400
30
9
600
40
7
800
50
5
1000
TYPICAL
PRODUCTION
DISTRIBUTION
60
3
1200
VS=±5V
QUANTITY (AMPLIFIERS)
TYPICAL
PRODUCTION
DISTRIBUTION
VS=±5V
1600 T =25°C
A
1400
-12
QUANTITY (AMPLIFIERS)
1800
-4.92
VS=±5V
IOUT=-5mA
-4.93
-4.94
-4.95
-4.96
-4.97
4.93
-50
0
50
100
150
DIE TEMPERATURE (°C)
FIGURE 5. OUTPUT HIGH VOLTAGE vs TEMPERATURE
5
-50
0
50
100
150
DIE TEMPERATURE (°C)
FIGURE 6. OUTPUT LOW VOLTAGE vs TEMPERATURE
FN7000.3
May 4, 2007
EL5128
Typical Performance Curves
(Continued)
VS=±5V
RL=10kΩ
10.40
SLEW RATE (V/µs)
OPEN-LOOP GAIN (dB)
100
90
80
VS=±5V
10.35
10.30
10.25
-50
0
50
100
150
0
-50
FIGURE 7. OPEN-LOOP GAIN vs TEMPERATURE
150
100
FIGURE 8. SLEW RATE vs TEMPERATURE
700
VS=±5V
TA=25°C
0.55
SUPPLY CURRENT
PER AMPLIFIER (µA)
SUPPLY CURRENT (mA)
50
DIE TEMPERATURE (°C)
DIE TEMPERATURE (°C)
0.5
600
500
400
0.45
300
-50
0
50
100
150
0
200
5
-80
50
-130
GAIN
0
-180
VS=±5V, TA=25°C RL=10kΩ to
GND CL=12pF to GND
100
1K
10K
100K
1M
10M
-230
100M
FREQUENCY (Hz)
FIGURE 11. OPEN LOOP GAIN AND PHASE vs FREQUENCY
6
MAGNITUDE (NORMALIZED) (dB)
-30
PHASE
PHASE (°)
GAIN (dB)
FIGURE 10. SUPPLY CURRENT PER AMPLIFIER vs SUPPLY
VOLTAGE
20
100
-50
10
20
15
SUPPLY VOLTAGE (V)
FIGURE 9. SUPPLY CURRENT PER AMPLIFIER vs
TEMPERATURE
150
10
5
DIE TEMPERATURE (°C)
10kΩ
0
1kΩ
560Ω
-5
-10
150Ω
CL=10pF
AV=1
VS=±5V
-15
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 12. FREQUENCY RESPONSE FOR VARIOUS RL
FN7000.3
May 4, 2007
EL5128
Typical Performance Curves
(Continued)
200
RL=10kΩ
AV=1
10 VS=±5V
OUTPUT IMPEDANCE (Ω)
MAGNITUDE (NORMALIZED) (dB)
20
12pF
0
50pF
-10
100pF
-20
1000pF
-30
100K
1M
160
120
80
40
0
10K
100M
10M
AV=1
VS=±5V
TA=25°C
FIGURE 14. CLOSED LOOP OUTPUT IMPEDANCE vs
FREQUENCY
12
80
10
60
8
CMRR (dB)
MAXIMUM OUTPUT SWING (VP-P)
10M
FREQUENCY (Hz)
FIGURE 13. FREQUENCY RESPONSE FOR VARIOUS CL
6
4
2
VS=±5V
TA=25°C
AV=1
RL=10kΩ
CL=12pF
DISTORTION <1%
0
10K
40
20
VS=±5V
TA=25°C
100K
1M
0
100
10M
1K
FREQUENCY (Hz)
80
VOLTAGE NOISE (nV/√Hz)
40
20
VS=±5V
TA=25°C
1K
1M
10M
600
PSRR-
0
100
100K
FIGURE 16. CMRR vs FREQUENCY
PSRR+
60
10K
FREQUENCY (Hz)
FIGURE 15. MAXIMUM OUTPUT SWING vs FREQUENCY
PSRR (dB)
1M
100K
FREQUENCY (Hz)
10K
100K
1M
FREQUENCY (Hz)
FIGURE 17. PSRR vs FREQUENCY
7
10M
100
10
1
100
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 18. INPUT VOLTAGE NOISE SPECTRAL DENSITY vs
FREQUENCY
FN7000.3
May 4, 2007
EL5128
Typical Performance Curves
(Continued)
-60
0.010
0.009
0.007
X-TALK (dB)
THD+ N (%)
0.008
0.006
0.005
0.004
VS=±5V
RL=10kΩ
AV=1
VIN=1VRMS
0.003
0.002
MEASURED CHANNEL A TO B
VS=±5V
R =10kΩ
-80 AL =1
V
VIN=220mVRMS
-100
-120
0.001
1K
10K
-140
1K
100K
10K
FIGURE 19. TOTAL HARMONIC DISTORTION + NOISE vs
FREQUENCY
1M
6M
V =±5V
90 AS =1
V
RL=10kΩ
VIN=±50mV
70 T =25°C
A
FIGURE 20. CHANNEL SEPARATION vs FREQUENCY
RESPONSE
STEP SIZE (V)
OVERSHOOT (%)
100K
FREQUENCY (Hz)
FREQUENCY (Hz)
50
30
4 VS=±5V
AV=1
3 RL=10kΩ
2 CL=12pF
TA=25°C
1
0.1%
0
-1
-2
0.1%
-3
-4
10
10
100
1K
LOAD CAPACITANCE (pF)
FIGURE 21. SMALL-SIGNAL OVERSHOOT vs LOAD
CAPACITANCE
1V
1µs
0
200
400
600
800
SETTLING TIME (ns)
FIGURE 22. SETTLING TIME vs STEP SIZE
50mV
200ns
VS=±5V
TA=25°C
AV=1
RL=10kΩ
CL=12pF
VS=±5V
TA=25°C
AV=1
RL=10kΩ
CL=12pF
FIGURE 23. LARGE SIGNAL TRANSIENT RESPONSE
8
FIGURE 24. SMALL SIGNAL TRANSIENT RESPONSE
FN7000.3
May 4, 2007
EL5128
Pin Descriptions
PIN
NUMBER
PIN NAME
1
VOUTA
PIN FUNCTION
EQUIVALENT CIRCUIT
Amplifier A Output
VS+
GND
VS-
CIRCUIT 1
2
VINA-
Amplifier A Inverting Input
VS+
VS-
CIRCUIT 2
3
VINA+
Amplifier A Non-Inverting Input
(Reference Circuit 2)
4
VS+
Positive Power Supply
5
VINC
Amplifier C
(Reference Circuit 2)
6
VOUTC
Amplifier C Output
(Reference Circuit 2)
7
VS-
8
VINB+
Amplifier B Non-Inverting Input
(Reference Circuit 2)
9
VINB-
Amplifier B Inverting Input
(Reference Circuit 2)
10
VOUTB
Amplifier B Output
(Reference Circuit 1)
Negative Power Supply
9
FN7000.3
May 4, 2007
EL5128
Applications Information
diodes placed in the input stage of the device begin to
conduct and over-voltage damage could occur.
Product Description
The EL5128 voltage feedback amplifier/buffer combination is
fabricated using a high voltage CMOS process. It exhibits
rail-to-rail input and output capability, it is unity gain stable,
and has low power consumption (500µA per amplifier).
These features make the EL5128 ideal for a wide range of
general-purpose applications. Connected in voltage follower
mode and driving a load of 10kΩ and 12pF, the EL5128 has
a -3dB bandwidth of 12MHz while maintaining a 10V/µs slew
rate.
1V
1V
Operating Voltage, Input, and Output
The EL5128 is specified with a single nominal supply voltage
from 5V to 15V or a split supply with its total range from 5V
to 15V. Correct operation is guaranteed for a supply range of
4.5V to 16.5V. Most EL5128 specifications are stable over
both the full supply range and operating temperatures of
-40°C to +85°C. Parameter variations with operating voltage
and/or temperature are shown in the typical performance
curves.
The input common-mode voltage range of the amplifiers
extends 500mV beyond the supply rails. The output swings
of the EL5128 typically extend to within 80mV of positive and
negative supply rails with load currents of 5mA. Decreasing
load currents will extend the output voltage range even
closer to the supply rails. Figure 25 shows the input and
output waveforms for the device in the unity-gain
configuration. Operation is from ±5V supply with a 10kΩ load
connected to GND. The input is a 10VP-P sinusoid. The
output voltage is approximately 9.985VP-P.
INPUT
VS=±5V AV=1
TA=25°C VIN=10VP-P
100µs
VS=±2.5V
TA=25°C
AV=1
VIN=6VP-P
FIGURE 26. OPERATION WITH BEYOND-THE-RAILS INPUT
Short Circuit Current Limit
The EL5128 will limit the short circuit current to ±120mA if
the output is directly shorted to the positive or the negative
supply. If an output is shorted indefinitely, the power
dissipation could easily increase such that the device may
be damaged. Maximum reliability is maintained if the output
continuous current never exceeds ±30mA. This limit is set by
the design of the internal metal interconnects.
Driving Capacitive Loads
The EL5128 can drive a wide range of capacitive loads. As
load capacitance increases, however, the -3dB bandwidth of
the device will decrease and the peaking increase. The
amplifiers drive 10pF loads in parallel with 10kΩ with just
1.5dB of peaking, and 100pF with 6.4dB of peaking. If less
peaking is desired in these applications, a small series
resistor (usually between 5Ω and 50Ω) can be placed in
series with the output. However, this will obviously reduce
the gain slightly. Another method of reducing peaking is to
add a “snubber” circuit at the output. A snubber is a shunt
load consisting of a resistor in series with a capacitor. Values
of 150Ω and 10nF are typical. The advantage of a snubber is
that it does not draw any DC load current or reduce the gain.
OUTPUT
Power Dissipation
FIGURE 25. OPERATION WITH RAIL-TO-RAIL INPUT AND
OUTPUT
Output Phase Reversal
The EL5128 is immune to phase reversal as long as the
input voltage is limited from (VS-) -0.5V to (VS+) +0.5V.
Figure 26 shows a photo of the output of the device with the
input voltage driven beyond the supply rails. Although the
device's output will not change phase, the input's overvoltage should be avoided. If an input voltage exceeds
supply voltage by more than 0.6V, electrostatic protection
10
With the high-output drive capability of the EL5128 amplifier,
it is possible to exceed the 125°C “absolute-maximum
junction temperature” under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for the application to determine if load
conditions need to be modified for the amplifier to remain in
the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
T JMAX - T AMAX
P DMAX = --------------------------------------------Θ JA
FN7000.3
May 4, 2007
EL5128
where:
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
• TJMAX = Maximum junction temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
P DMAX = Σi × [ V S × I SMAX + ( V S + - V OUT i ) × I LOAD i ]
POWER DISSIPATION (W)
• TAMAX= Maximum ambient temperature
0.6
0.5
486mW
0.4
M
SO
P1
20
0
6°°
CC//
W
W
θ
JJAA
=
0.3
0.2
0.1
0
0
when sourcing, and:
P DMAX = Σi × [ V S × I SMAX + ( V OUT i - V S - ) × I LOAD i ]
25
75 85
50
100
125
AMBIENT TEMPERATURE (°C)
FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
when sinking.
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
where:
1
• VS = Total supply voltage
• ISMAX = Maximum supply current per amplifier
• VOUTi = Maximum output voltage of the application
• ILOADi = Load current
If we set the two PDMAX equations equal to each other, we
can solve for RLOADi to avoid device overheat. Figures 27
and 28 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be
found graphically, based on the package type and the
ambient temperature. By using the previous equation, it is a
simple matter to see if PDMAX exceeds the device's power
derating curves. To ensure proper operation, it is important
to observe the recommended derating curves in Figures 27
and 28.
POWER DISSIPATION (W)
0.9
870mW
0.8
0.7
θ
M
JA
=
0.6
11
0.5
SO
5°
P1
0
C/
W
0.4
0.3
0.2
0.1
0
0
25
50
75 85
100
125
AMBIENT TEMPERATURE (°C)
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5128 can provide gain at high frequency. As with any
high-frequency device, good printed circuit board layout is
necessary for optimum performance. Ground plane
construction is highly recommended, lead lengths should be
as short as possible and the power supply pins must be well
bypassed to reduce the risk of oscillation. For normal single
supply operation, where the VS- pin is connected to ground,
a 0.1µF ceramic capacitor should be placed from VS+ to pin
to VS- pin. A 4.7µF tantalum capacitor should then be
connected in parallel, placed in the region of the amplifier.
One 4.7µF capacitor may be used for multiple devices. This
same capacitor combination should be placed at each
supply pin to ground if split supplies are to be used.
11
FN7000.3
May 4, 2007
EL5128
Mini SO Package Family (MSOP)
0.25 M C A B
D
MINI SO PACKAGE FAMILY
(N/2)+1
N
E
MDP0043
A
E1
MILLIMETERS
PIN #1
I.D.
1
B
(N/2)
e
H
C
SEATING
PLANE
0.10 C
N LEADS
SYMBOL
MSOP8
MSOP10
TOLERANCE
NOTES
A
1.10
1.10
Max.
-
A1
0.10
0.10
±0.05
-
A2
0.86
0.86
±0.09
-
b
0.33
0.23
+0.07/-0.08
-
c
0.18
0.18
±0.05
-
D
3.00
3.00
±0.10
1, 3
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
e
0.65
0.50
Basic
-
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
N
8
10
Reference
-
0.08 M C A B
b
Rev. D 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
L1
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
SEE DETAIL "X"
A2
GAUGE
PLANE
L
A1
0.25
3° ±3°
DETAIL X
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12
FN7000.3
May 4, 2007