S1D-K SERIES_B1603.pdf

S1D-K - S1M-K
Taiwan Semiconductor
CREAT BY ART
1A, 200V - 1000V Surface Mount Rectifiers
FEATURES
- Glass passivated chip junction
- Ideal for automated placement
- Low forward voltage drop
- High surge current capability
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
DO-214AC (SMA)
Case: DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code
S1D
S1G
S1J
S1K
S1M
-K
-K
-K
-K
-K
S1D
S1G
S1J
S1K
S1M
UNIT
Maximum repetitive peak reverse voltage
VRRM
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
200
400
600
800
1000
V
Maximum average forward rectified current
IF(AV)
1
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
VF
1.1
V
Maximum instantaneous forward voltage (Note 1)
@1A
Maximum reverse current @ rated VR
TJ=25°C
TJ=125°C
IR
1
50
μA
Typical reverse recovery time (Note 2)
trr
1.5
μs
Typical junction capacitance (Note 3)
CJ
12
pF
RθJL
RθJA
30
85
°C/W
TJ
- 55 to +175
°C
TSTG
- 55 to +175
°C
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Version: B1603
S1D-K - S1M-K
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE
PACKING CODE
PART NO.
PACKAGE
PACKING
SMA
1,800 / 7" Plastic reel
SMA
7,500 / 13" Paper reel
SUFFIX
R3
S1x-K
(Note 1, 2)
G
R2
Note 1: "x" defines voltage from 200V (S1D-K) to 1000V (S1M-K)
Note 2: Whole series with green compound
EXAMPLE
PREFERRED
PART NO.
S1M-K R3G
PART NO.
PACKING CODE
S1M-K
R3
PACKING CODE
DESCRIPTION
SUFFIX
G
Green compound
RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
1
0.8
0.6
0.4
RESISTIVE OR
INDUCTIVE LOAD
0.2
0
0
25
50
75
100
125
150
175
INSTANTANEOUS REVERSE CURRENT
(μA)
AVERAGE FORWARD CURRENT (A)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
1.2
10
TJ=125°C
1
0.1
TJ=75°C
0.01
TJ=25°C
0.001
0
LEAD TEMPERATURE (oC)
PEAK FORWARD SURGE URRENT
(A)
100
8.3ms Single Half Sine Wave
10
1
1
10
NUMBER OF CYCLES AT 60 Hz
100
140
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT
(A)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
20
40
60
80
100
120
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
10
1
Pulse Width=300μs
1% Duty Cycle
0.1
0.4
0.6
0.8
1
1.2
1.4
FORWARD VOLTAGE (V)
1.6
1.8
2
Version: B1603
S1D-K - S1M-K
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
CAPACITANCE (pF)
100
10
f=1.0MHz
Vsig=50mVp-p
1
0.01
0.1
1
10
100
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
A
1.27
1.58
0.050
0.062
B
4.06
4.60
0.160
0.181
C
2.29
2.83
0.090
0.111
D
1.99
2.50
0.078
0.098
E
0.90
1.41
0.035
0.056
F
4.95
5.33
0.195
0.210
G
0.05
0.20
0.002
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.68
0.066
B
1.52
0.060
C
3.93
0.155
D
2.41
0.095
E
5.45
0.215
MARKING DIAGRAM
P/N =
Marking code
G=
Green Compound
YW =
Date Code
F=
Factory Code
Version: B1603
S1D-K - S1M-K
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
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sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
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merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: B1603