152AS

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201)
CASE 152AS
ISSUE A
SCALE 8:1
2X
E
0.06 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
D
0.06 C
DETAIL A
DETAIL A
A
A1
SIDE VIEW
MILLIMETERS
MIN
MAX
0.24
0.30
0.00
0.01
0.04 REF
0.20
0.25
0.30 BSC
0.60 BSC
0.40 BSC
0.10
0.18
GENERIC
MARKING DIAGRAM*
0.05 C
0.05 C
DIM
A
A1
A3
b
D
E
e
L
A3
TOP COAT
TOP VIEW
2X
DATE 23 JAN 2014
C
X
SEATING
PLANE
X = Specific Device Code
e
1
2X
L
2
2X
b
0.05 C A B
BOTTOM VIEW
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
MOUNTING FOOTPRINT*
0.28
0.75
0.28
0.30
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON78832F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DSN2, 0.6X0.3, 0.4P, (0201)
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON78832F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
08 OCT 2013
A
CHANGED DIMENSIONS B AND L MAX VALUES. REQ. BY D. TRUHITTE.
23 JAN 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. A
Case Outline Number:
152AS