514AB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−923
CASE 514AB−01
ISSUE C
STYLE 1
DATE 11 MAR 2011
STYLE 2
SCALE 8:1
D
−X−
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
A
c
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
DIM
A
b
c
D
E
HE
L
L2
GENERIC
MARKING DIAGRAM*
SIDE VIEW
2X
2X
L
L2
SOLDERING FOOTPRINT*
1.20
2X
XM
XM
STYLE 1
STYLE 2
X
M
BOTTOM VIEW
2X
0.36
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
PACKAGE
OUTLINE
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
STYLE 2:
NO POLARITY
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON23284D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
SOD−923, 1.0X0.6X0.37, MAX HEIGHT
0.40
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23284D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. DAUGHERTY.
29 AUG 2006
A
CHANGED DIMENSION A VALUES. REQ. BY D. TRUHITTE.
23 JAN 2007
B
CREATED CATHODE AND NON−CATHODE BAND VERSIONS.
REQ. BY J. DAUGHERTY.
07 MAR 2007
C
ADDED BOTTOM VIEW AND DIMENSION L2. MODIFIED SOLDER FOOTPRINT.
REQ. BY D. TRUHITTE.
11 MAR 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 01C
Case Outline Number:
514AB
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