VS-HFA210NJ60CPbF Datasheet

VS-HFA210NJ60CPbF
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Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 210 A
FEATURES
Lug
terminal
anode 1
• Very low Qrr and trr
Lug
terminal
anode 2
• UL approved file E222165
• Designed and qualified for industrial level
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
Base common
cathode
TO-244
BENEFITS
• Reduced RFI and EMI
• Reduced snubbing
DESCRIPTION
HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dIF/dt simplifies
the calculations of losses in the operating conditions.
The softness of the recovery eliminates the need for a
snubber in most applications. These devices are ideally
suited for power converters, motors drives and other
applications where switching losses are significant portion
of the total losses.
PRODUCT SUMMARY
IF(AV)
210 A
VR
600 V
IF(DC) at TC
120 A at 100 °C
Package
TO-244 (TO-244AB)
Circuit
Two diodes common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Cathode to anode voltage
SYMBOL
TEST CONDITIONS
MAX.
UNITS
600
V
VR
TC = 25 °C
235
Continuous forward current
IF
TC = 100 °C
120
Single pulse forward current
IFSM
Limited by junction temperature
600
Non-repetitive avalanche energy
EAS
L = 100 μH, duty cycle limited by maximum TJ
2.2
TC = 25 °C
463
TC = 100 °C
185
Maximum power dissipation
Operating junction and storage
temperature range
PD
TJ, TStg
A
mJ
W
-55 to +150
°C
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
Cathode to anode 
breakdown voltage
SYMBOL
VBR
TEST CONDITIONS
IR = 100 μA
IF = 105 A
Maximum forward voltage
VFM
IF = 210 A
See fig. 1
IF = 105 A, TJ = 125 °C
MIN.
TYP.
MAX.
600
-
-
-
1.38
1.9
-
1.6
2.25
-
1.3
1.56
UNITS
V
Maximum reverse leakage current
IRM
TJ = 125 °C, VR = 480 V
See fig. 2
-
1.8
6.0
Junction capacitance
CT
VR = 200 V
See fig. 3
-
200
300
pF
Series inductance
LS
From top of terminal hole to mounting plane
-
6.0
-
nH
mA
Revision: 26-Mar-14
Document Number: 94062
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VS-HFA210NJ60CPbF
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time (fig. 5)
trr
Peak recovery current (fig. 6)
IRRM
Reverse recovery charge (fig. 7)
Qrr
Peak rate of recovery current (fig. 8)
dI(rec)M/dt
TEST CONDITIONS
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V
-
35
-
UNITS
TJ = 25 °C
-
90
140
TJ = 125 °C
-
160
240
-
10
18
-
15
30
-
450
1300
TJ = 125 °C
-
1200
3600
TJ = 25 °C
-
310
-
TJ = 125 °C
-
240
-
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-55
-
150
°C
-
-
0.27
-
-
0.135
-
0.10
-
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
IF = 105 A
dIF/dt = 200 A/μs
VR = 200 V
ns
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage temperature range
per leg
Thermal resistance, junction to case
RthJC
per module
RthCS
Typical thermal resistance, case to heatsink
Weight
°C/W
K/W
-
68
-
g
-
2.4
-
oz.
Mounting torque (1)
30 (3.4)
-
40 (4.6)
Mounting torque center hole
12 (1.4)
-
18 (2.1)
Terminal torque
30 (3.4)
-
40 (4.6)
Vertical pull
-
-
80
2" lever pull
-
-
35
N m
(lbf in)
lbf in
10 000
1000
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Note
(1) Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf in steps until desired or maximum torque limits are reached

100
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
0.2
0.7
1.2
1.7
2.2
2.7
3.2
1000
TJ = 125 °C
100
10
TJ = 25 °C
1
0.1
100
200
300
400
500
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current (Per Leg)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
600
Revision: 26-Mar-14
Document Number: 94062
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA210NJ60CPbF
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Vishay Semiconductors
CT - Junction Capacitance (pF)
10 000
100
200 A, 125 °C
105 A, 125 °C
40 A, 125 °C
IRRM (A)
1000
TJ = 25 °C
10
200 A, 25 °C
105 A, 25 °C
40 A, 25 °C
100
10
10
100
1
100
1000
1000
VR - Reverse Voltage (V)
dIF/dt (A/µs)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
Fig. 6 - - Typical Recovery Current vs. dIF/dt (Per Leg)
160
4000
140
3500
120
3000
100
DC
Qrr (nC)
Maximum Allowable
Case Temperature (°C)
1
80
60
2500
40 A, 125 °C
1500
1000
20
500
0
50
100
150
200
105 A, 125 °C
2000
40
0
200 A, 125 °C
200 A, 25 °C
105 A, 25 °C
0
100
250
IF(AV) - DC Forward Current (A)
40 A, 25 °C
1000
dIF/dt (A/µs)
Fig. 4 - Maximum Allowable Case Temperature vs.
DC Forward Current (Per Leg)
Fig. 7 - - Typical Stored Charge vs. dIF/dt (Per Leg)
240
10 000
200 A, 125 °C
160
dI(rec)M/dt (A/µs)
trr (ns)
200
105 A, 125 °C
40 A, 125 °C
120
80
200 A, 25 °C
200 A, 25 °C
105 A, 25 °C
40 A, 25 °C
1000
105 A, 25 °C
200 A, 125 °C
105 A, 125 °C
40 A, 125 °C
40 A, 25 °C
40
100
1000
100
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg)
Fig. 8 - - Typical dI(rec)M/dt vs. dIF/dt (Per Leg)
Revision: 26-Mar-14
Document Number: 94062
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA210NJ60CPbF
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Vishay Semiconductors
ZthJC - Thermal Response
1
0.1
0.01
Single pulse
(thermal response)
0.001
0.00001
0.0001
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
0.001
0.01
1
0.1
10
t1 - Rectangular Pulse Duration (s)
Fig. 9 - - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 10 - - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 11 - Reverse Recovery Waveform and Definitions
Revision: 26-Mar-14
Document Number: 94062
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA210NJ60CPbF
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Vishay Semiconductors
L = 100 µH
IL(PK)
High-speed
switch
D.U.T.
Freewheel
diode
Rg = 25 Ω
+
Current
monitor
Decay
time
Vd = 50 V
V(AVAL)
VR(RATED)
Fig. 12 - Avalanche Test Circuit and Waveforms
ORDERING INFORMATION TABLE
Device code
VS- HFA
1
2
210
NJ
60
C
PbF
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
HEXFRED® family, electron irradiated
3
-
Average current rating
4
-
NJ = TO-244
5
-
Voltage rating (60 = 600 V)
6
-
C = Common cathode
7
-
Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95021
Revision: 26-Mar-14
Document Number: 94062
5
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-244
DIMENSIONS in millimeters (inches)
35 (1.37) REF.
13 (0.51)
7 (0.27)
6 (0.23)
17.5 (0.69)
16.5 (0.65)
40 (1.57)
80 (3.15)
Ø 5.2 (Ø 0.20)
3
12.6 (0.5)
Ø 7.2 (Ø 0.28)
(2 places)
3
1
2
21 (0.82)
20 (0.78)
¼" - 20 UNC
9.6 (0.37) MIN.
93 (3.66) MAX.
Revision: 24-Apr-15
Document Number: 95021
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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