HI5731 Data Sheet October 2, 2015 12-Bit, 100MSPS, High Speed D/A Converter Features • Pb-free Available as an Option The HI5731 is a 12-bit, 100MSPS, D/A converter which is implemented in the Intersil BiCMOS 10V (HBC-10) process. Operating from +5V and -5.2V, the converter provides -20.48mA of full scale output current and includes an input data register and bandgap voltage reference. Low glitch energy and excellent frequency domain performance are achieved using a segmented architecture. The digital inputs are TTL/CMOS compatible and translated internally to ECL. All internal logic is implemented in ECL to achieve high switching speed with low noise. The addition of laser trimming assures 12-bit linearity is maintained along the entire transfer curve. PART NUMBER HI5731BIPZ (No longer available, recommended replacement: HI5731BIBZ) (See Note) -40 to 85 HI5731BIBZ (See Note) -40 to 85 • Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 100MSPS • Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .650mW • Integral Linearity Error . . . . . . . . . . . . . . . . . . . . 0.75 LSB • Low Glitch Energy . . . . . . . . . . . . . . . . . . . . . . . . . 3.0pV-s • TTL/CMOS Compatible Inputs • Improved Hold Time . . . . . . . . . . . . . . . . . . . . . . . . 0.25ns • Excellent Spurious Free Dynamic Range Applications • Cellular Base Stations Ordering Information TEMP. RANGE (°C) FN4070.10 PACKAGE 28 Ld PDIP (Pb-free) PKG. DWG. # • GSM Base Stations • Wireless Communications • Direct Digital Frequency Synthesis E28.6 • Signal Reconstruction • Test Equipment • High Resolution Imaging Systems 28 Ld SOIC (Pb-free) M28.3 • Arbitrary Waveform Generators NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. 1 Pinout HI5731 (PDIP, SOIC) TOP VIEW 1 28 DGND D10 2 27 AGND D11 (MSB) D9 3 26 REF OUT D8 4 25 CTRL OUT D7 5 24 CTRL IN D6 6 23 RSET D5 7 22 AVEE D4 8 21 IOUT D3 9 20 IOUT D2 10 19 ARTN D1 11 18 DVEE D0 (LSB) 12 17 DGND NC 13 16 DVCC NC 14 15 CLOCK CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas LLC Copyright © Intersil Americas Inc. 2002, 2004,2015. All Rights Reserved HI5731 Typical Application Circuit +5V HI5731 0.01F DVCC (16) D11 D11 (MSB) (1) D10 D10 (2) D9 D9 (3) D8 D8 (4) D7 D7 (5) D6 D6 (6) D5 D5 (7) D4 D4 (8) D3 D3 (9) D2 D2 (10) D1 D1 (11) D0 D0 (LSB) (12) 0.1F (24) CTRL IN (25) CTRL OUT -5.2V (AVEE) (26) REF OUT D/A OUT (21) IOUT 64 64 (20) IOUT (23) RSET 976 (19) ARTN CLK (15) (27) AGND 50 DGND (17, 28) (22) AVEE DVEE (18) 0.01F 0.01F 0.1F 0.1F - 5.2V (AVEE) - 5.2V (DVEE) Functional Block Diagram (LSB) D0 D1 D2 D3 8 LSBs CURRENT CELLS D4 12-BIT MASTER REGISTER D5 D6 DATA BUFFER/ LEVEL SHIFTER R2R NETWORK ARTN SLAVE REGISTER 227 D7 227 D8 15 D9 15 UPPER 4-BIT DECODER D10 15 SWITCHED CURRENT CELLS IOUT (MSB) D11 IOUT REF CELL CTRL IN CLK + OVERDRIVEABLE VOLTAGE REFERENCE AVEE AGND DVEE 2 DGND DVCC - REF OUT RSET 25 CTRL OUT HI5731 Absolute Maximum Ratings Thermal Information Digital Supply Voltage VCC to DGND . . . . . . . . . . . . . . . . . . . +5.5V Negative Digital Supply Voltage DVEE to DGND . . . . . . . . . . -5.5V Negative Analog Supply Voltage AVEE to AGND, ARTN. . . . . -5.5V Digital Input Voltages (D11-D0, CLK) to DGND . . . . . DVCC to -0.5V Internal Reference Output Current. . . . . . . . . . . . . . . . . . . . 2.5mA Voltage from CTRL IN to AVEE . . . . . . . . . . . . . . . . . . . . 2.5V to 0V Control Amplifier Output Current . . . . . . . . . . . . . . . . . . . . . 2.5mA Reference Input Voltage Range. . . . . . . . . . . . . . . . . .-3.7V to AVEE Analog Output Current (IOUT) . . . . . . . . . . . . . . . . . . . . . . . . . 30mA Thermal Resistance (Typical, Note 1) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Maximum Junction Temperature HI5731BIx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications AVEE , DVEE = -4.94 to -5.46V, VCC = +4.75 to +5.25V, VREF = Internal TA = 25oC for All Typical Values HI5731BI TA = -40oC TO 85oC PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 12 - - Bits SYSTEM PERFORMANCE Resolution Integral Linearity Error, INL (Note 4) (“Best Fit” Straight Line) - 0.75 1.5 LSB Differential Linearity Error, DNL (Note 4) - 0.5 1.0 LSB Offset Error, IOS (Note 4) - 20 75 A Full Scale Gain Error, FSE (Notes 2, 4) - 1 10 % Full Scale Gain Drift With Internal Reference - 50 - ppm FSR/oC Offset Drift Coefficient (Note 3) - - 0.05 A/oC - 20.48 - mA (Note 3) -1.25 - 0 V Throughput Rate (Note 3) 100 - - MSPS Output Voltage Full Scale Step Settling Time, tSETT , Full Scale To 0.5 LSB Error Band RL = 50 (Note 3) - 20 - ns Singlet Glitch Area, GE (Peak) RL = 50(Note 3) - 5 - pV-s - 3 - pV-s Full Scale Output Current, IFS Output Voltage Compliance Range DYNAMIC CHARACTERISTICS Doublet Glitch Area, (Net) Output Slew Rate RL = 50,DAC Operating in Latched Mode (Note 3) - 1,000 - V/s Output Rise Time RL = 50,DAC Operating in Latched Mode (Note 3) - 675 - ps Output Fall Time RL = 50,DAC Operating in Latched Mode (Note 3) - 470 - ps Spurious Free Dynamic Range within a Window (Note 3) fCLK = 10MSPS, fOUT = 1.23MHz, 2MHz Span - 85 - dBc fCLK = 20MSPS, fOUT = 5.055MHz, 2MHz Span - 77 - dBc fCLK = 40MSPS, fOUT = 16MHz, 10MHz Span - 75 - dBc fCLK = 50MSPS, fOUT = 10.1MHz, 2MHz Span - 80 - dBc fCLK = 80MSPS, fOUT = 5.1MHz, 2MHz Span - 78 - dBc fCLK = 100MSPS, fOUT = 10.1MHz, 2MHz Span - 79 - dBc 3 HI5731 Electrical Specifications AVEE , DVEE = -4.94 to -5.46V, VCC = +4.75 to +5.25V, VREF = Internal TA = 25oC for All Typical Values (Continued) HI5731BI TA = -40oC TO 85oC PARAMETER TEST CONDITIONS Spurious Free Dynamic Range to Nyquist (Note 3) MIN TYP MAX UNITS fCLK = 40MSPS, fOUT = 2.02MHz, 20MHz Span - 70 - dBc fCLK = 80MSPS, fOUT = 2.02MHz, 40MHz Span - 70 - dBc fCLK = 100MSPS, fOUT = 2.02MHz, 50MHz Span - 69 - dBc REFERENCE/CONTROL AMPLIFIER Internal Reference Voltage, VREF (Note 4) -1.27 -1.23 -1.17 V Internal Reference Voltage Drift (Note 3) - 175 - V/oC Internal Reference Output Current Sink/Source Capability (Note 3) -125 - +50 A Internal Reference Load Regulation IREF = 0 to IREF = -125A - 50 - V Input Impedance at REF OUT pin (Note 3) - 1.4 - k Amplifier Large Signal Bandwidth (0.6VP-P) Sine Wave Input, to Slew Rate Limited (Note 3) - 3 - MHz Amplifier Small Signal Bandwidth (0.1VP-P) Sine Wave Input, to -3dB Loss (Note 3) - 10 - MHz Reference Input Impedance (Note 3) - 12 - k Reference Input Multiplying Bandwidth (CTL IN) RL = 50, 100mV Sine Wave, to -3dB Loss at IOUT (Note 3) - 200 - MHz DIGITAL INPUTS (D9-D0, CLK, INVERT) Input Logic High Voltage, VIH (Note 4) 2.0 - - V Input Logic Low Voltage, VIL (Note 4) - - 0.8 V Input Logic Current, IIH (Note 4) - - 400 A Input Logic Current, IIL (Note 4) - - 700 A Digital Input Capacitance, CIN (Note 3) - 3.0 - pF TIMING CHARACTERISTICS Data Setup Time, tSU See Figure 1 (Note 3) 3.0 2.0 - ns Data Hold Time, tHLD See Figure 1 (Note 3) 0.5 0.25 - ns Propagation Delay Time, tPD See Figure 1 (Note 3) - 4.5 - ns CLK Pulse Width, tPW1, tPW2 See Figure 1 (Note 3) 3.0 - - ns POWER SUPPLY CHARACTERISTICS IEEA (Note 4) - 42 50 mA IEED (Note 4) - 70 85 mA ICCD (Note 4) - 13 20 mA Power Dissipation (Note 4) - 650 - mW Power Supply Rejection Ratio VCC 5%, VEE 5% - 5 - A/V NOTES: 2. Gain Error measured as the error in the ratio between the full scale output current and the current through RSET (typically 1.28mA). Ideally the ratio should be 16. 3. Parameter guaranteed by design or characterization and not production tested. 4. All devices are 100% tested at 25oC. 5. Dynamic Range must be limited to a 1V swing within the compliance range. 4 HI5731 Timing Diagrams 50% CLK GLITCH AREA = 1/2 (H x W) V D11-D0 HEIGHT (H) 1/2 LSB ERROR BAND IOUT t(ps) WIDTH (W) tSETT tPD FIGURE 1. FULL SCALE SETTLING TIME DIAGRAM tPW1 FIGURE 2. PEAK GLITCH AREA (SINGLET) MEASUREMENT METHOD tPW2 50% CLK tSU tSU tHLD tSU tHLD tHLD D11-D0 tPD IOUT tPD tPD FIGURE 3. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM 5 HI5731 Typical Performance Curves 680 -1.21 CLOCK FREQUENCY DOES NOT ALTER POWER DISSIPATION -1.23 (V) (mW) 640 -1.25 600 -1.27 560 -1.29 -50 -30 -10 10 30 50 70 90 -50 TEMPERATURE -30 -10 10 30 50 70 90 TEMPERATURE FIGURE 4. TYPICAL POWER DISSIPATION OVER TEMPERATURE FIGURE 5. TYPICAL REFERENCE VOLTAGE OVER TEMPERATURE 1.5 0.8 0.4 (LSB) (LSB) 0.5 -0.5 0.0 -0.4 -0.8 1.5 0 600 1200 1800 2400 3000 3600 400 4200 1000 1600 2200 2800 3400 4000 CODE CODE FIGURE 6. TYPICAL INL FIGURE 7. TYPICAL DNL ATTEN 20dB RL -10.0dBm 28 10dB/ MKR -87.33dB -73kHz fC = 10MSPS (A) 24 20 S 16 12 C -40 -20 -0 20 40 60 80 TEMPERATURE FIGURE 8. OFFSET CURRENT OVER TEMPERATURE 6 100 CENTER 1.237MHz SPAN 2.000MHz FIGURE 9. SPURIOUS FREE DYNAMIC RANGE = 87.3dBc HI5731 Typical Performance Curves ATTEN 20dB RL -10.0dBm 10dB/ (Continued) MKR -76.16dB -53kHz ATTEN 20dB RL -10.0dBm 10dB/ MKR -75.17dB -70kHz fC = 40MSPS fC = 20MSPS S C C CENTER 5.055MHz SPAN 2.000MHz FIGURE 10. SPURIOUS FREE DYNAMIC RANGE = 76.16dBc ATTEN 20dB RL -10.0dBm 10dB/ CENTER 16.00MHz SPAN 10.00MHz FIGURE 11. SPURIOUS FREE DYNAMIC RANGE = 75.17dBc MKR -81.67dB -953kHz ATTEN 20dB RL -10.0dBm 10dB/ fC = 50MSPS MKR -77.00dB -93kHz fC = 80MSPS S C C CENTER 10.100MHz FIGURE 12. SPURIOUS FREE DYNAMIC RANGE = -81.67dBc ATTEN 20dB RL -10.0dBm CENTER 5.097MHz SPAN 2.000MHz 10dB/ FIGURE 13. SPURIOUS FREE DYNAMIC RANGE = 77dBc MKR -85.60dB -33kHz ATTEN 20dB RL -10.0dBm fC = 100MSPS S C C SPAN 2.000MHz FIGURE 14. SPURIOUS FREE DYNAMIC RANGE = -85.60dBc 7 10dB/ MKR -85.50dB 73kHz fC = 100MSPS S CENTER 2.027MHz SPAN 2.000MHz CENTER 5.000MHz SPAN 2.000MHz FIGURE 15. SPURIOUS FREE DYNAMIC RANGE = 85.5dBc HI5731 Typical Performance Curves ATTEN 20dB RL -10.0dBm (Continued) MKR -80.50dB -807kHz 10dB/ ATTEN 20dB RL -10.0dBm 10dB/ fC = 100MSPS MKR -72.17dB -467kHz fC = 100MSPS S C CENTER 10.133MHz SPAN 2.000MHz CENTER 26.637MHz FIGURE 16. SPURIOUS FREE DYNAMIC RANGE = 80.5dBc ATTEN 20dB RL -10.0dBm FIGURE 17. SPURIOUS FREE DYNAMIC RANGE = 72.17dBc MKR -71.16dB 2.99MHz 10dB/ ATTEN 20dB RL -10.0dBm fC = 40MSPS fO = 2.02MHz S C C STOP FREQUENCY 20MHz START FREQUENCY 500kHz FIGURE 18. SPURIOUS FREE DYNAMIC RANGE = 71.16dBc ATTEN 20dB RL -10.0dBm 10dB/ MKR -70.00dB 4.13MHz S C STOP FREQUENCY 50MHz FIGURE 20. SPURIOUS FREE DYNAMIC RANGE = 70dBc 8 MKR -70.50dB 1.98MHz STOP FREQUENCY 40MHz FIGURE 19. SPURIOUS FREE DYNAMIC RANGE = 70.5dBc fC = 100MSPS fO = 2.02MHz START FREQUENCY 500kHz 10dB/ fC = 80MSPS fO = 2.02MHz S START FREQUENCY 500kHz SPAN 2.000MHz HI5731 Pin Descriptions PIN NUMBER 1-12 PIN NAME PIN DESCRIPTION D11 (MSB) thru Digital Data Bit 11, the Most Significant Bit thru Digital Data Bit 0, the Least Significant Bit. D0 (LSB) 15 CLK 13, 14 NC Data Clock Pin DC to 100MSPS. 16 DVCC Digital Logic Supply +5V. 17, 28 DGND Digital Ground. 18 DVEE -5.2V Logic supply. No Connect. 23 RSET External resistor to set the full scale output current. IFS = 16 x (VREF OUT / RSET). Typically 976. 27 AGND Analog Ground supply current return pin. 19 ARTN Analog Signal Return for the R/2R ladder. 21 IOUT Current Output Pin. 20 IOUT Complementary Current Output Pin. 22 AVEE -5.2V Analog Supply. 24 CTRL IN Input to the current source base rail. Typically connected to CTRL OUT and a 0.1F capacitor to AVEE . Allows external control of the current sources. 25 CTRL OUT Control Amplifier Out. Provides precision control of the current sources when connected to CTRL IN such that IFS = 16 x (VREF OUT / RSET). 26 REF OUT -1.23V (Typ) bandgap reference voltage output. Can sink up to 125A or be overdriven by an external reference capable of delivering up to 2mA. Detailed Description The HI5731 is a 12-bit, current out D/A converter. The DAC can convert at 100MSPS and runs on +5V and -5.2V supplies. The architecture is an R/2R and segmented switching current cell arrangement to reduce glitch. Laser trimming is employed to tune linearity to true 12-bit levels. The HI5731 achieves its low power and high speed performance from an advanced BiCMOS process. The HI5731 consumes 650mW (typical) and has an improved hold time of only 0.25ns (typical). The HI5731 is an excellent converter for use in communications applications and high performance instrumentation systems. to minimize reflections and clock noise into the part proper termination should be used. In PCB layout clock runs should be kept short and have a minimum of loads. To guarantee consistent results from board to board controlled impedance PCBs should be used with a characteristic line impedance ZO of 50. To terminate the clock line, a shunt terminator to ground is the most effective type at a 100MSPS clock rate. A typical value for termination can be determined by the equation: RT = ZO , Digital Inputs The HI5731 is a TTL/CMOS compatible D/A. Data is latched by a Master register. Once latched, data inputs D0 (LSB) thru D11 (MSB) are internally translated from TTL to ECL. The internal latch and switching current source controls are implemented in ECL technology to maintain high switching speeds and low noise characteristics. for the termination resistor. For a controlled impedance board with a ZO of 50, the RT = 50. Shunt termination is best used at the receiving end of the transmission line or as close to the HI5731 CLK pin as possible. ZO = 50 Decoder/Driver The architecture employs a split R/2R ladder and Segmented Current source arrangement. Bits D0 (LSB) thru D7 directly drive a typical R/2R network to create the binary weighted current sources. Bits D8 thru D11 (MSB) pass thru a “thermometer” decoder that converts the incoming data into 15 individual segmented current source enables. This split architecture helps to improve glitch, thus resulting in a more constant glitch characteristic across the entire output transfer function. Clocks and Termination The internal 12-bit register is updated on the rising edge of the clock. Since the HI5731 clock rate can run to 100MSPS, 9 CLK HI5731 DAC RT = 50 FIGURE 21. CLOCK LINE TERMINATION Rise and Fall times and propagation delay of the line will be affected by the Shunt Terminator. The terminator should be connected to DGND. Noise Reduction To reduce power supply noise, separate analog and digital power supplies should be used with 0.1F and 0.01F ceramic capacitors placed as close to the body of the HI5731 HI5731 as possible on the analog (AVEE ) and digital (DVEE ) supplies. The analog and digital ground returns should be connected together back at the device to ensure proper operation on power up. The VCC power pin should also be decoupled with a 0.1F capacitor. Reference The internal reference of the HI5731 is a -1.23V (typical) bandgap voltage reference with 175V/oC of temperature drift (typical). The internal reference is connected to the Control Amplifier which in turn drives the segmented current cells. Reference Out (REF OUT) is internally connected to the Control Amplifier. The Control Amplifier Output (CTRL OUT) should be used to drive the Control Amplifier Input (CTRL IN) and a 0.1F capacitor to analog VEE. This improves settling time by providing an AC ground at the current source base node. The Full Scale Output Current is controlled by the REF OUT pin and the set resistor (RSET). The ratio is: IOUT (Full Scale) = (VREF OUT /RSET) x 16, The internal reference (REF OUT) can be overdriven with a more precise external reference to provide better performance over temperature. Figure 22 illustrates a typical external reference configuration. required. The lower input bandwidth can be calculated using the following formula: 1 C IN = -------------------------------------------. 2 1400 f IN For multiplying frequencies above 100kHz, the CTRL IN pin can be driven directly as seen in Figure 24. HI5731 CTRL OUT 200 VIN C1 C2 AVEE CTRL IN 50 FIGURE 24. HIGH FREQUENCY MULTIPLYING BANDWIDTH CIRCUIT The nominal input/output relationship is defined as: V IN I OUT = -------------- . 80 In order to prevent the full scale output current from exceeding 20.48mA, the RSET resistor must be adjusted according to the following equation: 16V REF R SET = ----------------------------------------------------------------------------------------------- . V IN PEAK I OUT (FULL SCALE) – ----------------------------- 80 HI5731 -1.25V (26) REF OUT R -5.2V The circuit in Figure 24 can be tuned to adjust the lower cutoff frequency by adjusting capacitor values. Table 1 below illustrates the relationship. FIGURE 22. EXTERNAL REFERENCE CONFIGURATION TABLE 1. CAPACITOR SELECTION Multiplying Capability The HI5731 can operate in two different multiplying configurations. For frequencies from DC to 100kHz, a signal of up to 0.6VP-P can be applied directly to the REF OUT pin as shown in Figure 23. HI5731 CTRL OUT CTRL IN 0.01F C1 C2 100kHz 0.01F 1F >1MHz 0.001F 0.1F Also, the input signal must be limited to 1VP-P to avoid distortion in the DAC output current caused by excessive modulation of the internal current sources. Outputs AVEE REF OUT VIN fIN CIN (OPTIONAL) RSET FIGURE 23. LOW FREQUENCY MULTIPLYING BANDWIDTH CIRCUIT The signal must have a DC value such that the peak negative voltage equals -1.25V. Alternately, a capacitor can be placed in series with REF OUT if DC multiplying is not 10 The outputs IOUT and IOUT are complementary current outputs. Current is steered to either IOUT or IOUT in proportion to the digital input code. The sum of the two currents is always equal to the full scale current minus one LSB. The current output can be converted to a voltage by using a load resistor. Both current outputs should have the same load resistor (64 typically). By using a 64 load on the output, a 50 effective output resistance (ROUT) is achieved due to the 227 (15%) parallel resistance seen looking back into the output. This is the nominal value of the R2R ladder of the DAC. The 50 output is needed for matching the output with a 50 line. The load resistor should HI5731 be chosen so that the effective output resistance (ROUT) matches the line resistance. The output voltage is: as glitch when changing the DAC output. Units are typically specified in picoVolt-seconds (pV-s). VOUT = IOUT x ROUT. HI5731 IOUT is defined in the reference section. IOUT is not trimmed to 12 bits, so it is not recommended that it be used in conjunction with IOUT in a differential-to-single-ended application. The compliance range of the output is from 1.25V to 0V, with a 1VP-P voltage swing allowed within this range. TABLE 2. IOUT (mA) IOUT (mA) 1111 1111 1111 -20.48 0 1000 0000 0000 -10.24 -10.24 0000 0000 0000 0 -20.48 Settling Time SCOPE 64 INPUT CODING vs CURRENT OUTPUT INPUT CODE (D11-D0) 100MHz LOW PASS FILTER (21) IOUT 50 FIGURE 25. GLITCH TEST CIRCUIT a (mV) The settling time of the HI5731 is measured as the time it takes for the output of the DAC to settle to within a ± 1/2 LSB error band of its final value during a full scale (code 0000... to 1111.... or 1111... to 0000...) transition. All claims made by Intersil with respect to the settling time performance of the HI5731 have been fully verified by the National Institute of Standards and Technology (NIST) and are fully traceable. Glitch The output glitch of the HI5731 is measured by summing the area under the switching transients after an update of the DAC. Glitch is caused by the time skew between bits of the incoming digital data. Typically, the switching time of digital inputs are asymmetrical meaning that the turn off time is faster than the turn on time (TTL designs). Unequal delay paths through the device can also cause one current source to change before another. In order to minimize this, the Intersil HI5731 employes an internal register, just prior to the current sources, which is updated on the clock edge. Lastly, the worst case glitch on traditional D/A converters usually occurs at the major transition (i.e., code 2047 to 2048). However, due to the split architecture of the HI5731, the glitch is moved to the 255 to 256 transition (and every subsequent 256 code transitions thereafter). This split R/2R segmented current source architecture, which decreases the amount of current switching at any one time, makes the glitch practically constant over the entire output range. By making the glitch a constant size over the entire output range this effectively integrates this error out of the end application. In measuring the output glitch of the HI5731 the output is terminated into a 64 load. The glitch is measured at any one of the current cell carry (code 255 to 256 transition or any multiple thereof) throughout the DACs output range. The glitch energy is calculated by measuring the area under the voltage-time curve. Figure 26 shows the area considered 11 GLITCH ENERGY = (a x t)/2 t (ns) FIGURE 26. MEASURING GLITCH ENERGY Applications Bipolar Applications To convert the output of the HI5731 to a bipolar 4V swing, the following applications circuit is recommended. The reference can only provide 125A of drive, so it must be buffered to create the bipolar offset current needed to generate the -2V output with all bits ‘off’. The output current must be converted to a voltage and then gained up and offset to produce the proper swing. Care must be taken to compensate for the voltage swing and error. 5k REF OUT (26) - + - 5k 1/ CA2904 2 + 1/ CA2904 2 0.1F HI5731 60 240 240 50 IOUT (21) - VOUT + HFA1100 FIGURE 27. BIPOLAR OUTPUT CONFIGURATION HI5731 Interfacing to the HSP45106 NCO-16 The HSP45106 is a 16-bit, Numerically Controlled Oscillator (NCO). The HSP45106 can be used to generate various modulation schemes for Direct Digital Synthesis (DDS) applications. Figure 28 shows how to interface an HI5731 to the HSP45106. Interfacing to the HSP45102 NCO-12 The HSP45102 is a 12-bit, Numerically Controlled Oscillator (NCO). The HSP45102 can be used to generate various modulation schemes for Direct Digital Synthesis (DDS) applications. Figure 29 shows how to interface an HI5731 to the HSP45102. This high level block diagram is that of a basic PSK modulator. In this example the encoder generates the PSK waveform by driving the Phase Modulation Inputs (P1, P0) of the HSP45102. The P1-0 inputs impart a phase shift to the carrier wave as defined in Table 2. TABLE 3. PHASE MODULATION INPUT CODING P1 P0 PHASE SHIFT (DEGREES) 0 0 0 0 1 90 1 0 270 1 1 180 The data port of the HSP45102 drives the 12-bit HI5731 DAC which converts the NCO output into an analog waveform. The output filter connected to the DAC can be tailored to remove unwanted spurs for the desired carrier frequency. The controller is used to load the desired center frequency and control the HSP45102. The HI5731 coupled with the HSP45102 make an inexpensive PSK modulator with Spurious Free performance down to -76dBc. Definition of Specifications Integral Linearity Error, INL, is the measure of the worst case point that deviates from a best fit straight line of data values along the transfer curve. Differential Linearity Error, DNL, is the measure of the error in step size between adjacent codes along the converter’s transfer curve. Ideally, the step size is 1 LSB from one code to the next, and the deviation from 1 LSB is known as DNL. A DNL specification of greater than -1 LSB guarantees monotonicity. Feedthru, is the measure of the undesirable switching noise coupled to the output. Output Voltage Full Scale Settling Time, is the time required from the 50% point on the clock input for a full scale step to settle within an 1/2 LSB error band. Output Voltage Small Scale Settling Time, is the time required from the 50% point on the clock input for a 100mV 12 step to settle within an 1/2 LSB error band. This is used by applications reconstructing highly correlated signals such as sine waves with more than 5 points per cycle. Glitch Area, GE, is the switching transient appearing on the output during a code transition. It is measured as the area under the curve and expressed as a picoVolt-time specification (typically pV-s). Differential Gain, AV, is the gain error from an ideal sine wave with a normalized amplitude. Differential Phase, , is the phase error from an ideal sine wave. Signal to Noise Ratio, SNR, is the ratio of a fundamental to the noise floor of the analog output. The first 5 harmonics are ignored, and an output filter of 1/2 the clock frequency is used to eliminate alias products. Total Harmonic Distortion, THD, is the ratio of the DAC output fundamental to the RMS sum of the harmonics. The first 5 harmonics are included, and an output filter of 1/2 the clock frequency is used to eliminate alias products. Spurious Free Dynamic Range, SFDR, is the amplitude difference from a fundamental to the largest harmonically or non-harmonically related spur. A sine wave is loaded into the D/A and the output filtered at 1/2 the clock frequency to eliminate noise from clocking alias terms. Intermodulation Distortion, IMD, is the measure of the sum and difference products produced when a two tone input is driven into the D/A. The distortion products created will arise at sum and difference frequencies of the two tones. IMD can be calculated using the following equation: 20Log (RMS of Sum and Difference Distortion Products) IMD = ------------------------------------------------------------------------------------------------------------------------------------------------------- . RMS Amplitude of the Fundamental HI5731 U2 33MSPS CLK BASEBAND BIT STREAM K9 C11 B11 ENCODER C10 A11 F10 F9 F11 H11 G11 G9 J11 G10 D10 VCC CONTROLLER J10 K11 B8 A8 B6 B7 A7 C7 C6 A6 A5 C5 A4 B4 A3 A2 B3 A1 B10 B9 A10 E11 E9 VCC H10 K2 J2 V CC CLK MOD2 MOD1 U1 MOD0 PMSEL DACSTRB ENPOREG ENOFREG ENCFREG ENPHAC ENTIREG INHOFR INITPAC INITTAC TEST PARSER BINFMT C15_MSB C4 C13 C12 C11 C10 C9 C8 C7 C6 C5 C4 C3 C2 C1 C0 A2 A1 A0 CS WR FILTER SIN15 SIN14 SIN13 SIN12 SIN11 SIN10 SIN9 SIN8 SIN7 SIN6 SIN5 SIN4 SIN3 SIN2 SIN1 SIN0 COS15 COS14 COS13 COS12 COS11 COS10 COS9 COS8 COS7 COS6 COS5 COS4 COS3 COS2 COS1 COS0 PACI TICO L1 K3 L2 L3 L4 J5 K5 L5 K6 J6 J7 L7 L6 L8 K8 L9 L10 C2 B1 C1 D1 E3 E2 E1 F2 F3 G3 G1 G2 H1 H2 J1 K1 VCC 16 1 2 3 4 5 6 7 8 9 10 11 12 15 R4 50 DVCC IOUT D11 (MSB) D10 IOUT D9 D8 D7 CNTRL IN D6 D5 D4 CNTRL OUT D3 D2 D1 D0 (LSB) REF OUT CLK RSET 28 DGND 17 DGND ARET R1 21 64 R2 20 64 24 25 0.1F C1 0.01F 26 R3 23 976 19 18 AVEE DVEE 22 -5.2V_A HI5731 L1 -5.2V_D 10H -5.2V_A L2 10H B2 OES OEC HSP45106 FIGURE 28. MODULATOR USING THE HI5731 AND THE HSP45106 16-BIT NCO 13 C2 AVSS 27 -5.2V_D TO RF UP-CONVERT STAGE -5.2V_A -5.2V_A HI5731 FILTER U2 U1 BASEBAND BIT STREAM 40MSPS I CLK ENCODER Q 16 19 20 18 17 12 9 CONTROLLER CONTROL BUS 14 13 10 11 VCC CLK P1 P0 LOAD# TXFR# ENPHAC# SEL_L/M# OUT11 OUT10 OUT9 OUT8 OUT7 OUT6 OUT5 OUT4 OUT3 OUT2 OUT1 OUT0 16 DVCC IOUT 1 2 3 4 5 6 7 8 9 10 11 12 6 5 4 3 2 1 28 27 26 25 24 23 D11 (MSB) D10 IOUT D9 D8 D7 CNTRL IN D6 D5 CNTRL OUT D4 D3 D2 D1 D0 (LSB) REF OUT 15 CLK SCLK R4 50 SD 28 DGND 17 DGND SFTEN# RSET ARET R1 21 64 R2 20 64 24 25 C2 0.1F C1 0.01F 26 R3 23 976 19 AVSS 27 MSB/LSB# HSP45102 -5.2V_D 18 DV EE L1 -5.2V_D 10H AVEE 22 -5.2V_A HI5731 L2 -5.2V_A 10H FIGURE 29. PSK MODULATOR USING THE HI5731 AND THE HSP45102 12-BIT NCO 14 TO RF UP-CONVERT STAGE -5.2V_A -5.2V_A HI5731 Die Characteristics DIE DIMENSIONS PASSIVATION 161.5 mils x 160.7 mils x 19 mils Type: Sandwich Passivation Undoped Silicon Glass (USG) + Nitride Thickness: USG - 8kÅ, Nitride - 4.2kÅ Total 12.2kÅ + 2kÅ METALLIZATION Type: AlSiCu Thickness: M1 - 8kÅ, M2 - 17kÅ SUBSTRATE POTENTIAL (POWERED UP) VEED Metallization Mask Layout D9 D10 D11 DGND REF OUT D8 AGND HI5731 CTRL OUT D7 CTRL IN D6 RSET D5 AVEE D4 IOUT D3 IOUT D2 ARTN D1 D0 15 CLK DVCC DGND DVEE HI5731 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION October 2, 2015 FN4070.10 CHANGE - Updated Ordering Information Table on page 1. - Added Revision History. - Added About Intersil Verbiage. - Updated POD M28.3 to latest revision changes are as follow: Added land pattern. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. 16 HI5731 Dual-In-Line Plastic Packages (PDIP) E28.6 (JEDEC MS-011-AB ISSUE B) N 28 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL -B- -C- SEATING PLANE A2 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MAX NOTES - 0.250 - 6.35 4 0.015 - 0.39 - 4 A2 0.125 0.195 3.18 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 - D 1.380 1.565 D1 0.005 - A L D1 MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 35.1 39.7 5 - 5 0.13 E 0.600 0.625 15.24 15.87 6 E1 0.485 0.580 12.32 14.73 5 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC 6 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. eB - 0.700 - 17.78 7 L 0.115 0.200 2.93 5.08 4 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. N 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 17 28 28 9 Rev. 1 12/00 HI5731 Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1 B C 0.10(0.004) 0.25(0.010) M C A M B S MAX MILLIMETERS MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 e -C- MIN 0.05 BSC h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 10.00 - 0.394 N 0.419 1.27 BSC H 28 0o 10.65 - 28 8o 0o 7 8o Rev. 1, 1/13 NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. TYPICAL RECOMMENDED LAND PATTERN (1.50mm) 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. (9.38mm) 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) (1.27mm TYP) (0.51mm TYP) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems. Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 18