Datasheet

Flat panel sensor
C9732DK-11
For soft X-ray imaging, cassette type with USB 2.0 interface
Large photodiode area: 120 × 120 mm
The C9732DK-11 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution,
large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17
keV. The device shape is thin cassette which incorporate on-chip high-resolution scintillator and a control board. An on-board
USB 2.0 interface can realize fast data transfer with the C9732DK-11.
Features
Applications
2400 × 2400 pixels (50 μm pitch)
X-ray imaging (optimized to 17 keV)
High resolution
14-bit digital output (USB 2.0 interface)
High-speed imaging: 1 frame/s
No dead area (insensitive area) due to seamless structure
Compatible with Hamamatsu API (DCAM-API)
Structure
The C9732DK-11 is comprised of a sensor board and a control board. Mounted on the sensor board is a CMOS image sensor chip made up of a
two-dimensional photodiode array, row-scanning vertical shift register, and 8 charge amplifier arrays. Each charge amplifier array has a horizontal
shift register and consists of 300 ch charge amplifiers with CDS circuit.
CsI scintillator is directly deposited on the two-dimensional photodiode array. X-rays incident on the scintillator are converted to fluorescence,
which then enters the two-dimensional photodiode array where electric charge is accumulated in each pixel according to the light intensity. The
accumulated charge on each row is sequentially selected by the row-scanning vertical shift register, transferred to the amplifiers through the data
line, and converted to a voltage signal. Then an analog signal is sent out from each amplifier array by scanning the horizontal shift register.
The control board converts the analog signal into a 14-bit digital signal, which is then output to a PC through the USB 2.0 interface.
Sensor board
2399 2400
2401
4799 4800
Vertical shift register
Pixel number
1 2
Photodiode
array
with directly
deposited CsI
scintillator
5759999
Charge amp array
No. 1
(with horizontal shift
register, 300 ch)
5760000
External power supply
A.vdd, D.vdd (not attached)
Timing
pulse
generator
Charge amp array
No. 8
(with horizontal shift
register, 300 ch)
Oscillator
TrgIn
TrgOut
Bias
generator
Buffer
amp
Processing
amp
A/D
FIFO
USB IC
Buffer
amp
Processing
amp
A/D
Video data
Flat panel control
(USB 2.0 interface)
FIFO
Control board
Note: Signals are read out in order of pixel number.
KACCC031
KACCC0310EC
www.hamamatsu.com
1
Flat panel sensor
C9732DK-11
Structure
Parameter
Pixel size
Photodiode area
Number of pixels
Number of active pixels
Readout
Video output
TrgIn, TrgOut
Scintillator
Specification
50 × 50
120 × 120
2400 × 2400
2368 × 2340
Charge amplifier array
USB 2.0, 14-bit
TTL
Direct deposition CsI
Unit
μm
mm
pixels
pixels
-
Absolute maximum ratings (Ta=25 °C)
Parameter
Supply voltage for digital circuitry (+5 V)
Supply voltage for analog circuitry (+5 V)
Operating temperature*1
Storage temperature*1
Incident X-ray energy
Symbol
D.vdd
A.vdd
Topr
Tstg
-
Value
+6.0
+6.0
0 to +40
-10 to +60
35
Unit
V
V
°C
°C
kVp
*1: No condensation
Specifications (Ta=25 °C, A.vdd=5.0 V, D.vdd=5.0 V)
Parameter
Frame rate max.
Frame rate
Noise (rms)*2
Sensitivity*3
Resolution*4
Saturation charge
Dynamic range
Defect line*5
Adjacent defect line
Blemish*6
Non-uniformity of sensitivity*6
Defect cluster*6
Bright line output adjacent to a defect line (vertical)*6
Bright line output adjacent to a defect line (horizontal)*6
Output offset*7
Symbol
Sf(max)
Sf
N(rms)
S
Reso
Csat
-
Min.
0.95
52 (5.9)
9
-
Typ.
1
0.5 to Sf(max)
1250
65 (7.4)
10
6.4
5100
Not allowed
260
Max.
16
1
600
4
105
120
800
Unit
frames/s
frames/s
electrons
LSB/mR (LSB/μGy)
line pairs/mm
M electrons
lines
line pair
μm
%
%
%
LSB
*2: Internal trigger mode at Sf(max)
*3: Mo target 30 kV, without filter
*4: Spatial frequency at CTF=5 %
*5: A defect line is a horizontal or vertical line containing 4 or more cosecutive pixels located at the opposite side of an amplifier array or a shift
register, that produce 1/8 of the average sensitivity of the surrounding pixels.
*6: See P.8, “Description of terms”
*7: Average of all active pixels at Sf(max)
Note: X-ray energy range is less than 35 kVp (17 keV Mo source).
2
Flat panel sensor
C9732DK-11
Resolution
(Ta=25 °C, A.vdd=5.0 V, D.vdd=5.0 V)
100
90
80
CTF (%)
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
Spatial frequency (line pairs/mm)
KACCB0154EB
Timing chart
External trigger mode
To acquire images in external trigger mode, input an external trigger pulse as shown below.
When used in synchronization with a pulsed X-ray source, X-rays should be irradiated during the Txray period.
Frame time (Tvc to Tvc2)
Recommendation: 50% of frame time
ExtTrgIO
(TTL)
Tvc - Tdelay
Txray
X-ray
KACCC0659EB
(Typ.)
Parameter
Tdelay (Delay time)
Tvc (Cycle time min.)
Tvc2 (Cycle time max.)
Value
830
1000
2000
Unit
μs
ms
ms
Note: The number of significant figures is two. (except Tvc)
3
Flat panel sensor
C9732DK-11
Accessories
O Power cable (terminated with a JSTJ-C9-2C plug at one end and open at the other end; 2 m; see Table 1.)
O External trigger cable (terminated with an FGG.0B.304.CLAD56 plug at one end and open at the other end; 5 m; see Table 2.)
O Earth cable (AWG18; 4 m)
System requirements
To operate the C9732DK-11 at full performance, the following system and peripherals are required.
O PC (recommended system requirements)
· PC: Precision T5600 standard model (Dell)
· OS: See “Compatibility Note.pdf” in “http://www.dcamapi.com”.
· CPU: Intel®Xenon® Processor E5-2620
(15 M Cache, 2.00 GHz, 7.20 GT/s Intel® QPI)
· Memory: 4 GB (2 GB × 2) for 32-bit OS
8 GB (2 GB × 4) for 64-bit OS
DDR RDIMM memory (1600 MHz, ECC)
· Microsoft.net Framework: Version 2.0 and later
O Power source: A.vdd = +5.0 ± 0.1 V (1100 mA), D.vdd = +5.0 ± 0.1 V (350 mA)
· The voltages described above are specified at the flat panel sensor side.
· Please use a low noise series power supply. (Avoid using a switching power supply.)
· Install a noise filter on the AC power input line to prevent surges on the AC line.
· Always ground the ground terminal to avoid the effects of noise from peripheral devices.
O DCAM-API (digital camera application programming interface): produced by Hamamatsu
· The driver software, DLL are included in DCAM-API. DCAM-SDK which includes function manuals and sample software can be
provided to OEM users.
· The latest version of DCAM-API can be downloaded from “http://dcam-api.com”
O USB cable: mini-B type
4
Flat panel sensor
C9732DK-11
[Table 1] Pin assignment and cable color for 9-pin power receptacle
Pin No.
1
2
3
4
5
6
7
8
9
Color
Yellow
Blue
Gray
Black
Red
Green
Purple
White
Brown
Signal
Digital GND
Digital GND
Analog GND
Analog GND
Analog GND
Digital +5 V
Digital +5 V
Analog +5 V
Analog +5 V
9-pin receptacle: DE-9PF-N made by JAE (Japan Aviation Electronics Industry, Limited)
Mating plug: JST J-C9-2C made by JST Mfg. Co., Ltd.
[Table 2] Pin assignment and color cable for 4-pin trigger cable
Pin No.
1
2
3
4
Color
Blue
Orange
Green
Brown
Signal
TrgIn
Digital GND
TrgOut
Digital GND
Note
Twist pair
Twist pair
4-pin receptacle: ECG.0B.304.CLL made by LEMO S.A.
Mating plug: FGG.0B.304.CLAD56 made by LEMO S.A.
[Table 3] Trigger mode
Trigger mode
External trigger mode
TrgIn (See Table 2)
Rectangular signal
Internal trigger mode
High or Open
Note
The integration time is controlled through Lemo 4-pin trigger cable.
The integration time is controlled by DCAM command without Lemo
4-pin trigger cable.
[Table 4] Trigger mode selection by DCAM-API
Function: BOOL dcam_setpropertyvalue(HDCAM h, int32 iProp, double fValue);
Trigger mode
External trigger mode
Internal trigger mode
Internal trigger mode
(exposure time)
iProp
DCAM_IDPROP_TRIGGERSOURCE
DCAM_IDPROP_TRIGGERSOURCE
fValue
DCAMPROP_TRIGGERSOURCE__EXTERNAL
DCAMPROP_TRIGGERSOURCE__INTERNAL
DCAM_IDPROP_EXPOSURETIME
Exposuretime(sec)
Note: The iProp which is not indicated in this table cannot be used.
5
Flat panel sensor
C9732DK-11
Connection
After installing DCAM-API in a PC with a USB 2.0 port, connect the C9732DK-11 to that PC.
OS +
Image acquisition
software
Video output
(14-bit digital)
USB2.0
X-ray source
PC/AT
(Rear view)
Monitor
USB
FRAME TRG POWER
GND I/O SOURCE
CMOS FLAT PANEL SENSOR C9732DK-11
TrgIn
Trgout
Voltage source
(A.vdd, D.vdd)
C9732DK-11
KACCC0544EA
6
Flat panel sensor
C9732DK-11
Dimensional outline (unit: mm, tolerance: ±1 mm unless otherwise noted)
14.5
FRAME TRG POWER
GND I/O SOURCE
CMOS FLAT PANEL SENSOR C9732DK-11
USB
(2367, 2339)
Screw hole *
9
8.1
Screw *
hole
(6 ×) M3 depth 4
(0, 0)
73
266
C1.3
166 ± 0.5
50 ± 0.5
4 ± 0.5 31 ± 0.5
261 ± 0.5
1.7
Active area 117
193
Active area 118.4
20 10.3 15 9.5 25 12.7
7
155.5 ± 0.5
14.5
Scintillator
to top cover
5.0
Dimensional outline (C9732DK-11, unit: mm)
Top cover material including window is carbon fiber (1.0 mm thickness).
Weight: 1.2 kg
* M3 screw hole for fixing USB plug to flat panel sensor.
The depth of the hole: 7 mm
KACCA0277EA
Notice
· Do not subject the flat panel sensors to strong vibration or shock (Strong shock such as drop impacts may cause permanent damage
to these sensors).
· Users must take responsibility for implementing X-ray shielding safety measures to avoid the risk of X-ray exposure.
· Data listed in this datasheet is defined at the time of shipment. Characteristics may vary somewhat due to exposure to X-rays so take
proper countermeasures such as making periodic image correction.
· This product is warranted for a period of 12 months after the date of the shipment. The warranty is limited to replacement or repair of
any defective product due to defects in workmanship or materials used in manufacture. The warranty does not cover loss or damage
caused by natural disaster, misuse (including modifications and any use not complying with the environment, application, usage and
storage conditions described in this datasheet), or total X-ray radiation dose over 45000 R (390 Gy) even within the warranty period
[incident X-ray energy: less than 35 kVp (17 keV Mo source)].
7
Flat panel sensor
C9732DK-11
Description of terms
Blemish
Length of pixel cluster which has less than 90 % of the average sensitivity of the surrounding pixels.
Column
Bright line output adjacent to a defect line
A B C D E F G H I
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
The relative sensitivity ratio “a/b” should be 105 % or less for vertical lines, 120 % or less
for horizontal lines, where “a” and “b” are defined as follows:
Note that the average sensitivity of the bright line is calculated from the region adjacent to
the defect region in the defect line.
Row
a: Average sensitivity of bright line (Line A) adjacent to defect line
b: Average sensitivity of standard line (Line B) adjacent to Line A
Example: See the right figure
Defect region in defect line: From pixel (J, 1) to pixel (J, 15)
a: Average sensitivity from pixel (I, 1) to pixel (I, 15) or from pixel (K, 1) to pixel (K, 15)
b: Average sensitivity from pixel (H, 1) to pixel (H, 15) or from pixel (L, 1) to pixel (L, 15)
J K L M N O P Q R S
Line B
(Column H, L)
Line A
(Column I, K)
Defect line
(Column J)
KACCC0385EB
Defect cluster
Formed with more than 3 × 3 pixels which have less
than 1/8 of the average sensitivity of the surrounding pixels.
This is defined as defect cluster.
Normal pixel
This is not defined as defect cluster.
Defective pixel
KACCC0384EB
Nonuniformity of sensitivity
16 × 16 segments are 16 × 16-divided active area excluded 1 mm from the whole edge. Xij is defined as the average sensitivity of
each segment.
Uniformity of sensitivity is calculated as following equation.
Nonunifomity of sensitivity =
σ
x
σ: standard deviation of 16 × 16 “Xij”
x : average value of 16 × 16 “Xij”
20
146 pixels 138 pixels pixels
20
144 pixels 144 pixels pixels
1 mm
20
pixels 146 pixels 146 pixels
···········
···········
Active area
20
pixels 140 pixels 144 pixels
···········
16 segments
16 segments
···········
1 mm
···········
1 mm
1 mm
Active area
KACCC0447EA
8
Flat panel sensor
C9732DK-11
Information described in this material is current as of February, 2015.
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always
contact us for the delivery specification sheet to check the latest specifications.
Type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or
a suffix "(Z)" which means developmental specifications.
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product
use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741
China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Cat. No. KACC1177E06 Feb. 2015 DN
9
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