ESD8V0L1B-02LRH Data Sheet (611 KB, EN)

ESD8V0L...
Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): up to ± 25 KV (contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): up to 2.5 A (8/20 µs)
• Smallest form factor down to 1.0 x 0.6 x 0.4 mm
• Max. working voltage: -8 / +14 V or +8 / -14 V
• Ultra low dynamic resistance down to 0.3 Ω
• Very low capacitance down to 2 pF
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.4 nH
• Pb-free (RoHS compliant) package
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0L1B-02EL
ESD8V0L1B-02LRH
ESD8V0L2B-03L
D1
1
1
2
3
2
D2
Type
ESD8V0L1B-02EL
ESD8V0L1B-02LRH
ESD8V0L2B-03L
Package
TSLP-2-18
TSLP-2-17
TSLP-3-1
Configuration
1 channel, bi-directional
1 channel, bi-directional
2 channels, bi-directional
1
Marking
E7
B3
B3
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ESD8V0L...
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
ESD contact discharge1)
VESD
Value
kV
ESD8V0L1B...
25
ESD8V0L2B..., between all pins
15
Peak pulse current (tp = 8 / 20 µs)2)
Unit
A
Ipp
ESD8V0L1B...
2.5
ESD8V0L2B...
1
Operating temperature range
Top
-55...125
Storage temperature
Tstg
-65...150
°C
1V
ESD according to IEC61000-4-2
2I
pp according to IEC61000-4-5
2
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ESD8V0L...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
-8
-
14
I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B...
14.5
-
-
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B...
8.5
-
-
I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B...
14.5
-
-
I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B...
8.5
-
-
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B...
23
-
-
-
<1
50
Characteristics
Reverse working voltage
VRWM
Breakdown voltage
V(BR)
Reverse current
IR
V
nA
VR = 3 V, between all pins
Clamping voltage (contact)1)
V
VCL
VESD = +15 kV , from pin 1 to 2, ESD8V0L1B...
-
21
-
VESD = -15 kV, from pin 1 to 2, ESD8V0L1B...
-
16
-
VESD = +15 kV , from pin 1/2 to 3, ESD8V0L2B...
-
26
-
VESD = -15 kV , from pin 1/2 to 3, ESD8V0L2B...
-
20
-
Line capacitance2)
pF
CT
VR = 0 V, f = 1 MHz, ESD8V0L1B...
-
8.5
13
from pin 1/2 to 3
-
4
7
from pin 1 to 2, pin 3 is not connected
-
2
4
VR = 0 V, f = 1 MHz, ESD8V0L2B...,
Dynamic resistance ( tp=30ns )
Ω
RD
ESD8V0L1B...
-
0.3
-
ESD8V0L2B...
-
0.6
-
1V
ESD according to IEC61000-4-2
2Total
capacitance line to ground
3
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ESD8V0L...
Reverse current IR = ƒ(VR )
TA = Parameter
Diode capacitance CT = ƒ (VR)
f = 1MHz
10 1
10
pF
nA
8
TA = 85°C
7
IR
CT
10 0
TA = 25°C
ESD8V0L1B...
ESD8V0L2B..., pins 1/2 to 3
ESD8V0L2B..., pins 1 to 2
6
5
4
10
-1
3
2
1
10 -2
0
2
4
6
8
10
V
0
0
14
VR
5
V
15
VR
4
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ESD8V0L...
Connector
Application example ESD8V0L2B...
2 channels, bi-directional
2 protected signal lines, level up to
-8V/+14V
I/O
I/O
1
ESD sensitive
device
2
3
The protection diode should be placed very
close to the location where the ESD or
other transients can occur to keep loops
and inductances as small as possible.
Pin 3 should be connected directly to a
ground plane on the board.
Connector
Application example ESD8V0L2B...
1 high-speed channel, bi-directional
Protected high-speed signal line, level up to
±22V (bi-directional)
I/O
ESD sensitive
device
2
3
1
Pin 1 (or pin 2) should be
connected directly to a
ground plane on the board.
Pin 3 is not connected.
Connector
Application example ESD8V0L1B...
1 channel, bi-directional
Protected signal line, level up to
-8/+14V or +8/-14 V
I/O
ESD sensitive
device
2
Pin 1 (or Pin 2) should be connected directly to a
ground plane on the board.
1
5
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TSLP-2-17 (mm)
ESD8V0L...
Package Outline
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1
1
0.25 ±0.035 1)
2
1±0.05
0.65 ±0.05
2
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.35
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Stencil apertures
Marking Layout (Example)
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
Cathode
marking
8
1.16
4
0.76
6
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TSLP-2-18 (mm)
7
ESD8V0L...
2013-02-06
TSLP-3-1 (mm)
ESD8V0L...
Package Outline
Bottom view
0.4 +0.1
0.6 ±0.05
0.5 ±0.035
2
1 ±0.05
3
0.65 ±0.05
3
1)
2
1
1)
0.05 MAX.
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
1
0.25 ±0.035
1)
Top view
1)
1) Dimension applies to plated terminal
Foot Print
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.275
0.6
0.355
For board assembly information please refer to Infineon website "Packages"
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BFR193L3
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
1.16
Pin 1
marking
8
4
0.76
8
2013-02-06
ESD8V0L...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
9
2013-02-06
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