Si4122DY Datasheet

New Product
Si4122DY
Vishay Siliconix
N-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)a
0.0045 at VGS = 10 V
27.2
0.006 at VGS = 4.5 V
23.5
VDS (V)
40
• Halogen-free
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
Qg (Typ.)
29 nC
RoHS
COMPLIANT
APPLICATIONS
• DC/DC Conversion
SO-8
D
S
1
8
D
S
2
7
D
S
3
6
D
5
D
G
4
G
Top View
S
Ordering Information: Si4122DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Single Pulse Avalanche Current
Avalanche Energy
ID
TC = 25 °C
TA = 25 °C
IS
L = 0.1 mH
IAS
EAS
TC = 25 °C
TC = 70 °C
Maximum Power Dissipation
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Unit
V
19.2b, c
15.3b, c
70
5.4
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Limit
40
± 25
27.2
20.1
A
2.7b, c
40
mJ
80
6.0
3.3
PD
3.0b, c
1.9b, c
- 55 to 150
TJ, Tstg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
t ≤ 10 s
Steady State
Symbol
RthJA
RthJF
Typical
33
16
Maximum
42
21
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 85 °C/W.
Document Number: 68665
S-81220-Rev. A, 02-Jun-08
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1
New Product
Si4122DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
40
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
V
43
ID = 250 µA
mV/°C
- 6.0
VGS(th)
VDS = VGS , ID = 250 µA
2.5
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 25 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 40 V, VGS = 0 V
1
VDS = 40 V, VGS = 0 V, TJ = 55 °C
10
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS ≥ 5 V, VGS = 10 V
1.2
30
µA
A
VGS = 10 V, ID = 15 A
0.0036
0.0045
VGS = 4.5 V, ID = 10 A
0.0048
0.006
VDS = 15 V, ID = 15 A
65
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Rg
Gate Resistance
4200
VDS = 20 V, VGS = 0 V, f = 1 MHz
VDS = 20 V, VGS = 10 V, ID = 10 A
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
44
nC
9
f = 1 MHz
VDD = 20 V, RL = 2 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
0.2
1.0
2.0
42
70
34
60
75
28
45
td(on)
14
25
10
20
35
60
9
18
VDD = 20 V, RL = 2 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
tf
Fall Time
95
29
45
td(off)
Turn-Off Delay Time
62
tf
tr
Rise Time
pF
12
VDS = 20 V, VGS = 4.5 V, ID = 10 A
td(on)
Turn-On Delay Time
475
225
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
IS
TC = 25 °C
5.4
ISM
VSD
70
IS = 3 A
0.72
1.1
A
V
Body Diode Reverse Recovery Time
trr
31
50
ns
Body Diode Reverse Recovery Charge
Qrr
31
50
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C
18
13
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68665
S-81220-Rev. A, 02-Jun-08
New Product
Si4122DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
70
5
VGS = 10 thru 4 V
4
I D - Drain Current (A)
I D - Drain Current (A)
56
42
28
14
3
2
TC = 25 °C
1
TC = 125 °C
VGS = 3 V
TC = - 55 °C
0
0.0
0
0.5
1.0
1.5
2.0
2.5
0
3
4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
5
6600
5500
0.0054
VGS = 4.5 V
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
2
VDS - Drain-to-Source Voltage (V)
0.0060
0.0048
0.0042
VGS = 10 V
Ciss
4400
3300
2200
Coss
0.0036
1100
Crss
0
0.0030
0
14
28
42
56
70
0
8
16
24
32
I D - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
40
1.8
VGS = 10 V
ID = 15 A
VDS = 10 V
ID = 10 A
8
VDS = 20 V
6
VDS = 30 V
4
1.5
(Normalized)
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
1
VGS = 4.5 V
1.2
0.9
2
0
0
13
Document Number: 68665
S-81220-Rev. A, 02-Jun-08
26
39
52
65
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
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New Product
Si4122DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.020
100
ID = 10 A
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
10
TJ = 150 °C
1
0.1
TJ = 25 °C
0.01
0.016
0.012
0.008
TJ = 125 °C
0.004
TJ = 25 °C
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
1
2
3
4
5
6
7
8
9
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
200
0.2
160
- 0.1
ID = 5 mA
- 0.4
Power (W)
VGS(th) Variance (V)
0.001
0.0
10
120
80
ID = 250 µA
- 0.7
- 1.0
- 50
40
0
- 25
0
25
50
75
100
125
150
0.001
0.01
0.1
1
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
10
100
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
10 ms
1
100 ms
1s
0.1
10 s
TA = 25 °C
Single Pulse
0.01
0.01
BVDSS
Limited
DC
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 68665
S-81220-Rev. A, 02-Jun-08
New Product
Si4122DY
Vishay Siliconix
30
7.5
24
6.0
Power (W)
I D - Drain Current (A)
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
18
12
4.5
3.0
1.5
6
0.0
0
0
25
50
75
100
125
0
150
25
TC - Case Temperature (°C)
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating*
Power Derating, Junction-to-Foot
2.0
Power (W)
1.6
1.2
0.8
0.4
0.0
0
25
50
75
100
125
150
TA - Ambient Temperature (°C)
Power, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 68665
S-81220-Rev. A, 02-Jun-08
www.vishay.com
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New Product
Si4122DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 85 °C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?68665.
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Document Number: 68665
S-81220-Rev. A, 02-Jun-08
Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
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Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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22
Document Number: 72606
Revision: 21-Jan-08
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Revision: 02-Oct-12
1
Document Number: 91000