REVISIONS LTR DATE (YR-MO-DA) DESCRIPTION APPROVED REV SHEET REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A 18 19 REV SHEET 1 2 3 4 PREPARED BY Thomas M. Hess 5 6 7 8 9 10 11 12 13 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CMOS, MANCHESTER ENCODER-DECODER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-05-21 REVISION LEVEL SIZE CAGE CODE SHEET 1 67268 A DESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. OF 5962-90888 19 5962-E285-93 14 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 01 90888 Federal stock class designator RHA designator (see 1.2.1) R X Device class designator (see 1.2.3) Case outline (See 1.2.4) Lead finish (see 1.2.5) Device type (see 1.2.2) \ M / \/ Drawing number 1.2.1 RHA designator. Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 01 Circuit function 6409 Manchester encoder-decoder 1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows: Device requirements documentation Device class M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter R 2 Descriptive designator Terminals Package style 20 Dual-in-line package 20 Square leadless chip carrier GDIP1-T20 or CDIP2-T20 CQCC1-N20 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input, Output or I/O voltage range applied . . . . . . . . . . . . Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (soldering 10 sec) . . . . . . . . . . . . . . . . Power dissipation Case R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Case 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal resistance, Junction-to-case . . . . . . . . . . . . . . . . +7.0 V GND - 0.5 V to VCC + 0.5 V -65(C to +150(C +175(C +300(C 602 mW 595 mW See MIL-STD-1835 1.4 Recommended operating conditions. Operating temperature range . . . . . . . . . . . . . . . . . . . . . . -55(C to +125(C Supply voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 V VCC 5.5 V Input rise and fall times . . . . . . . . . . . . . . . . . . . . . . . . . . 50 ns max 1.5 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 2/ percent 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 MIL-I-38535 - Microcircuits, General Specification for. - Integrated Circuits, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-480 MIL-STD-883 MIL-STD-1835 - Configuration Control-Engineering Changes, Deviations and Waivers. - Test Methods and Procedures for Microelectronics. - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD's). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 1/ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Values will be added when they become available. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. For device classes B and S, a full electrical characterization table for each device type shall be included in this SMD. The individual item requirements for device classes Q and V shall be in accordance with MIL-I-38535, the device manufacturer's Quality Management (QM) plan, and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes M, B, and S and MIL-I-38535 for device classes Q and V and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be specified when available. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103. Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be in accordance with MIL-I-38535. 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-STD-883 (see 3.1 herein). The certification mark for device classes B and S shall be a "J" or "JAN" as required in MIL-M-38510. The certification mark for device classes Q and V shall be a "QML" as required in MIL-I-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-I-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-480. 3.9 Verification and review for device class M. For device class M, DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device classes M, B, and S. Device classes M, B, and S devices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 4 TABLE I. Electrical performance characteristics. Test Input high voltage Input low voltage e s e t Input high voltage R e s e t Input low voltage R Input high voltage Clock Input low voltage Clock Input leakage current (except IX) Input leakage current (IX) I/O leakage current Output high voltage (All except OX) Output low voltage (All except OX) Standby power supply current Operating power supply current Symbol Group A Conditions 1/ subgroups -55(C TC +125(C unless otherwise specified VIH VIL VIHR VILR VIHC VILC II II IO VOH VOL ICCSB ICCOP VCC = 4.5 V VCC = 4.5 V VCC = 5.5 V VCC = 4.5 V VCC = 5.5 V VCC = 4.5 V VIN = VCC or GND VCC = 5.5 V VIN = VCC or GND VCC = 5.5 V VOUT = VCC or GND VCC = 5.5 V IOH = -2.0 mA VCC = 4.5 V 2/ IOH = 2.0 mA VCC = 4.5 V 2/ VOUT = VCC or GND VCC = 5.5 V Outputs open f = 16 MHz VIN = VCC or GD VCC = 5.5 V, CL = 50 pF 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 Device type All All All All All All All All All All All All All Limits Min Max .7 VCC .2 VCC VCC- 0.5 GND +0.5 VCC -0.5 GND +0.5 -1.0 1.0 -20 20 -10 10 VCC -0.4 0.4 100 18 Unit V V V V V V )A )A )A V V )A mA See footnotes at end of table. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Input capacitance I/O capacitance Functional test Output rise time (all except clock) Output fall time (all except clock) Clock output rise time Clock output fall time , BO O ECLK to B ZO CTS low to BZO O O enables B low to ECLK C TS enabled CTS high to ECLK disabled CTS high to B ZO O O disabled B VM UDI to SDO, N Symbol Conditions 1/ -55(C TC +125(C unless otherwise specified CIN CI/O tr tf tr tf tCE3 tCE4 tCE5 tCE6 tCE7 tCD1 VCC = Open f = 1 MHz See 4.4.1.c TA = +25( C VCC = 4.5 V See 4.4.1.b From 1.0 to 3.5 V CL = 50 pF 3/ From 3.5 to 1.0 V CL = 50 pF 3/ From 1.0 to 3.5 V CL = 20 pF 3/ From 3.5 to 1.0 V CL = 20 pF 3/ See figure 3 4/ 3/ VCC = 4.5 V See figure 3 4/ 3/ VCC = 4.5 V See figure 3 4/ 3/ VCC = 4.5 V See figure 3 4/ 3/ VCC = 4.5 V See figure 3 4/ 3/ VCC = 4.5 V See figure 3 4/ 3/ VCC = 4.5 V Group A Device subgroups type 4 4 7, 8 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 All All All All All All All All All All All All All Limits Min 0.5 0.5 10.5 1.5 2.5 Max 10 12 50 50 11 11 1.0 1.5 11.5 1.0 2.5 3.0 Unit pF pF ns ns ns ns DBP DBP DBP DBP DBP DBP See footnotes at end of table. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test RST low to DCLK, VM low SDO, N RST high to DCLK, enabled ZO , BO O UDI to B VM UDI to SDO, N Clock frequency Clock period Bipolar pulse width One-zero overlap Clock high time Clock low time Serial data setup time Serial data hold time VM DCLK to SDO, N Symbol Conditions 1/ -55(C TC +125(C unless otherwise specified tCD3 tCD4 tR1 tR3 fC tC t1 t3 tCH tCL tCE1 tCE2 tCD2 See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V f = 16 MHz See figure 3 4/ VCC = 4.5 V f = 16 MHz See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V See figure 3 4/ VCC = 4.5 V 3/ 3/ 3/ 3/ 5/ 5/ 5/ 5/ 5/ 5/ 5/ 5/ 5/ Group A Device subgroups type 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 All All All All All All All All All All All All All Limits 0.5 0.5 0.5 2.5 1/fC tC+10 20 20 120 0 Min Max 1.5 1.5 1.0 3.0 16 tC-10 40 Unit DBP DBP DBP DBP MHz s ns ns ns ns ns ns ns See footnotes at end of table. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test ECLK to B ZO Symbol Conditions 1/ -55(C TC +125(C unless otherwise specified See figure 3 4/ 5/ tR2 VCC = 4.5 V Group A subgroups 9, 10, 11 Device type All Limits Min Max 40 Unit ns 1/ Unless otherwise specified, all testing to be performed using worst-case test conditions. 2/ Interchanging of force and sense conditions is permitted. 3/ Guaranteed but not tested. 4/ Data Bit Period (DBP), clock rate = 16x, one DBP = 16 clock cycles; clock rate = 32x, one DBP = 32 clock cycles. 5/ Unless otherwise specified tested at f = 4.0 MHz, VIH = 70% VCC, VIL = 20% VCC, speed select = 16x, VOH VCC/2, VOL VCC/2, VCC = 4.5 V and 5.5 V, input rise and fall times driven at 1 ns/V. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 8 FIGURE 1. Terminal connections. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 9 FIGURE 2. Block diagram. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 10 FIGURE 3. Timing waveforms. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 11 FIGURE 3. Timing waveforms - Continued. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 12 FIGURE 3. Timing waveforms - Continued. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 13 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). For device classes B and S, sampling and inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535 and the device manufacturer's QM plan. 4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes B and S, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to qualification and quality conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-I-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes M, B, and S. a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. For device class M, the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. For device classes B and S, the test circuit shall be submitted to the qualifying activity. For device classes M, B, and S, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125(C, minimum. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-I-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-I-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in appendix B of MIL-I-38535. 4.3 Qualification inspection. 4.3.1 Qualification inspection for device classes B and S. Qualification inspection for device classes B and S shall be in accordance with MIL-M-38510. Inspections to be performed shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.5). 4.3.2 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-I-38535. Inspections to be performed shall be those specified in MIL-I-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.5). 4.4 Conformance inspection. Quality conformance inspection for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein) and as specified herein. Quality conformance inspection for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. Inspections to be performed for device classes M, B, and S shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.5). Technology conformance inspection for classes Q and V shall be in accordance with MIL-I-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-I-38535 permits alternate in-line control testing. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 14 b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes B and S, subgroups 7 and 8 tests shall be sufficient to verify the truth table as approved by the qualifying activity. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with MIL-STD-883, test method 5012 (see 1.5 herein). c. Subgroups 4(CIN and CI/O) shall be measured only for the initial test and after process or design changes which may affect capacitance. A minimum sample size of five devices with zero defects shall be required. TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group B end-point electrical parameters (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device Device Device class class class B S M 1, 7, 9 1, 2, 3, 1, 2, 3 1, 2, 3 7 1/ 7 1/ 7 2/ 8,9,10,11 8,9,10,11 8,9,10,11 1,2,3,4 1,2,3,4 1,2,3,4 7, 8 7, 8 7, 8 9,10,11 9,10,11 9,10,11 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 -- -- -- Subgroups (in accordance with MIL-I-38535, table III) Device Device class class Q V 1, 7, 9 1, 2, 3 1, 2, 3 7 1/ 7 2/ 8,9,10,11 8,9,10,11 1,2,3,4 1,2,3,4 7, 8 7, 8 9,10,11 9,10,11 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 -- -- 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.2 Group B inspection. The group B inspection end-point electrical parameters shall be as specified in table II herein. For device class S steady-state life tests, the test circuit shall be submitted to the qualifying activity. 4.4.3 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 15 4.4.3.1 Additional criteria for device classes M and B. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. For device class M, the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. For device class B, the test circuit shall be submitted to the qualifying activity. For device classes M and B, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005. b. TA = +125(C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.3.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-I-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-I-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005. 4.4.4 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.5 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device classes B, S, Q, and V shall be M, D, R, and H and for device class M shall be M and D. a. End-point electrical parameters shall be as specified in table II herein. b. For device classes M, B, and S, the devices shall be subjected to radiation hardness assured tests as specified in MIL-M-38510 for the RHA level being tested. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-I-38535 for the RHA environment and level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25(C ±5(C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38510 for device classes M, B, and S and MIL-I-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.1.2 Substitutability. Device classes B and Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-481 using DD Form 1693, Engineering Change Proposal (Short Form). 6.3 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and which SMD's are applicable to that system. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DESC-EC, telephone (513) 296-6047. 6.4 Comments. Comments on this drawing should be directed to DESC-EC, Dayton, Ohio 45444, or telephone (513) 296-5377. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 16 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-M38510 and MIL-STD-1331 and Table III. Table III. Pin descriptions Symbol Name Description BZI Bipolar Zero Input Used in conjunction with pin 2, bipolar one input (BOI), to input Manchester encoder data to the decoder. BZI and BOI are logical complements. When using pin 3, unipolar data input (UDI) for data input, BZI must be held high. BOI Bipolar One Input Used in conjunction with pin 1, Bipolar Zero Input (BZI) to input Manchester encoded data to the decoder, BOI and BZI are logical complements. When using pin 3, Unipolar Data Inputs (UDI) for data input, BOI must be held low. UDI Unipolar Data Input An alternate to bipolar input (BZI,BOI), Unipolar Data Input (UDI) is used to input Manchester encoded data to the decoder. When using pin 1, (BZI) and pin 2 (BOI) for data input, UDI must be held low. SD/CDS Serial Data/Command Data Sync In the converter mode, SD/CDS is an input used to receive serial NRZ data. NRZ data is accepted synchronously on the falling edge of encoder clock output (ECLK). In the repeater mode, SD/CDS is an output indicating the status of last valid sync pattern received. A high indicates a command sync and a low indicates a data sync pattern. SDO Serial Data Out R ST S e r i a l R e s e t S VM N Nonval i d M anchester VM indicates that the decoder has received invalid Manchester data A low on N and present data on Serial Data Out (SDO) is invalid. A high indicates that is set low by a low the sync pulse and data were valid and SDO is valid. N VM on R S T and remains low after R S T goes high until valid sync pulse followed by two valid Manchester bits is received. ST R e s e t R ST forces SDO, DCLK, N VM and SR ST low. In the converter mode, a low on R T enables SDO and DCLK , and forces SR ST high. N VM A high on RS remains low after R S T goes high until a valid sync pulse followed by two Manchester bits are received, after which it goes high. In the repeater mode, RS T has the same effect on SDO, DCLK and N as in the converter mode. VM When RST goes low, S R S T goes low and remains low after R S T goes high, S RS T goes high only when R S T is high, the reset bit is zero and a valid synchronization sequence is received. DCLK Decoder Clock The decoder clock is a 1x clock recovered from BZI and BOI to synchronously output received NRZ data (SDO). The decoded serial NRZ data is transmitted out synchronously with the ST is low. decoder clock (DCLK). SDO is forced low when R R ST follows R ST. In the repeater mode when R ST In the converter mode, S R ST goes low and remains low after RS goes high. SR ST goes goes low, S high only when R S T is high, The reset bit is zero and a valid synchronization sequence is received. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 17 Table III. Pin descriptions. - Continued Symbol Name Description GND Ground CO Clock Output IX Clock Input IX is the input for an external clock or, if the internal oscillator is used, IX and OX are used for the connection of the crystal. OX Clock Drive If the internal oscillator is used, OX and IX are used for the connection of the crystal. MS Mode Select MS must be held low for operation in the converter mode, and high for operation in the repeater mode. TS C Clear to Send ECLK Encoder Clock In the converter mode, ECLK is a 1X clock output used to receive serial NRZ data to SD/CDS. In the repeater mode, ECLK is a 2X clock which is recovered from BZI and BOI data by the digital phase locked loop. SS Speed Select A logic high on SS sets the data rate at 1/32 times the clock frequency while a low sets the data rate at 1/16 times the clock frequency. ZO B Bi pol ar Zero O utput B ZO and its logical complement B O O are the Manchester data outputs of the encoder. The inactive state for these outputs is in the high state. O O B Bi pol ar One O ut ZO See B VCC Supply Voltage VCC is the +5 V power supply pin. A 0.1 )F decoupling capacitor from VCC (pin 20) to GND (pin 10) is recommended. Ground Buffered output of clock input IX, may be used as clock signal for other peripherals. O O , BZO In the converter mode, a high disables the encoder, forcing outputs B TS initiates transmission of high and ECLK low. A high to low transition of C TS enables BO O , BZO and ECLK. In the a command sync pulse. A low on C T repeater mode, the function of C S is identical to that of the converter mode T with the exception that a transition of C S does not initiate a synchronization sequence. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 18 6.6 One part - one part number system. The one part - one part number system described below has been developed to allow for transitions between identical generic devices covered by the four major microcircuit requirements documents (MIL-M-38510, MIL-H-38534, MIL-I-38535, and 1.2.1 of MIL-STD-883) without the necessity for the generation of unique PIN's. The four military requirements documents represent different class levels, and previously when a device manufacturer upgraded military product from one class level to another, the benefits of the upgraded product were unavailable to the Original Equipment Manufacturer (OEM), that was contractually locked into the original unique PIN. By establishing a one part number system covering all four documents, the OEM can acquire to the highest class level available for a given generic device to meet system needs without modifying the original contract parts selection criteria. Example PIN under new system Manufacturing source listing Document listing New MIL-M-38510 Military Detail Specifications (in the SMD format) 5962-XXXXXZZ(B or S)YY (Part 1 or 2) QPL-38510 MIL-BUL-103 New MIL-H-38534 Standardized Military Drawings 5962-XXXXXZZ(H or K)YY QML-38534 MIL-BUL-103 New MIL-I-38535 Standardized Military Drawings 5962-XXXXXZZ(Q or V)YY QML-38535 MIL-BUL-103 New 1.2.1 of MIL-STD-883 Standardized Military Drawings 5962-XXXXXZZ(M)YY MIL-BUL-103 MIL-BUL-103 Military documentation format 6.7 Sources of supply. 6.7.1 Sources of supply for device classes B and S. Sources of supply for device classes B and S are listed in QPL-38510. 6.7.2 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DESC-EC and have agreed to this drawing. 6.7.3 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-BUL-103. The vendors listed in MIL-BUL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-EC. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90888 A REVISION LEVEL SHEET 19 STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN DATE: 93-05-21 Approved sources of supply for SMD 5962-90888 are listed below for immediate acquisition only and shall be added to MIL-BUL-103 during the next revision. MIL-BUL-103 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DESC-EC. This bulletin is superseded by the next dated revision of MIL-BUL-103. Standardized military drawing PIN 5962-9088801MRX 5962-9088801M2X Vendor CAGE number 34371 34371 Vendor similar PIN 1/ HD1-6409/883 HD4-6409/883 1/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 34371 Vendor name and address Harris Semiconductor P.O. Box 883 Melbourne FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in this information bulletin.