DATASHEET

ACTS244MS
Radiation Hardened Octal
Non-Inverting Three-State Buffer
January 1996
tle
TS
MS
-
Features
Pinouts
• Devices QML Qualified in Accordance with MIL-PRF-38535
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20,
LEAD FINISH C
TOP VIEW
• Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96718 and Intersil’s QM Plan
• 1.25 Micron Radiation Hardened SOS CMOS
iadl
rt-
• Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
• Single Event Upset (SEU) Immunity: <1 x
(Typ)
10-10
Errors/Bit/Day
• SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg
• Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse
• Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
ee
er)
• Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC
hor
• Input Logic Levels
- VIL = 0.8V Max
- VIH = VCC/2 Min
ds
rpon,
ior,
iad,
1
20 VCC
2
19 BE
BO4
3
18 AO1
AI2
4
17 BI4
BO3
5
16 AO2
AI3
6
15 BI3
BO2
7
14 AO3
AI4
8
13 BI2
BO1
9
12 AO4
GND 10
11 BI1
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20,
LEAD FINISH C
TOP VIEW
• Input Current ≤ 1µA at VOL, VOH
• Fast Propagation Delay . . . . . . . . . . . . . . . 14.5ns (Max), 10ns (Typ)
Description
The Intersil ACTS244MS is a Radiation Hardened Octal Non-Inverting
Three-State Buffer having two active low enable inputs.
The ACTS244MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of radiation hardened,
high-speed, CMOS/SOS Logic Family.
AE
1
20
VCC
AI1
2
19
BE
BO4
3
18
AO1
AI2
4
17
BI4
BO3
5
16
AO2
AI3
6
15
BI3
BO2
7
14
AO3
AI4
8
13
BI2
BO1
9
12
AO4
GND
10
11
BI1
The ACTS244MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or
a Dual-In-Line Ceramic Package (D suffix).
Ordering Information
PART NUMBER
d,
L,
AE
AI1
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
5962F9671801VRC
-55oC to +125oC
MIL-PRF-38535 Class V
20 Lead SBDIP
5962F9671801VXC
-55oC to +125oC
MIL-PRF-38535 Class V
20 Lead Ceramic Flatpack
ACTS244D/Sample
25oC
Sample
20 Lead SBDIP
ACTS244K/Sample
25oC
Sample
20 Lead Ceramic Flatpack
ACTS244HMSR
25oC
Die
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
Spec Number
File Number
518784
3187.1
ACTS244MS
Functional Diagram
NOTE: (1 CIRCUIT OF 2)
AE
1(19)
P
AO1
N 18(9)
AI1
2(11)
P
AO2
N 16(7)
AI2
4(13)
P
AO3
N 14(5)
AI3
6(15)
P
AO4
N 12(3)
AI4
8(17)
TRUTH TABLE
INPUTS
OUTPUT
AE, BE
AIn, BIn
AOn, BOn
L
L
L
L
H
H
H
X
Z
NOTE: H = High Voltage Level, L = Low Voltage Level,
X = Immaterial, Z = High Impedance
Spec Number
2
518784
ACTS244MS
Die Characteristics
DIE DIMENSIONS:
100 x 100 (mils)
2.54 x 2.54 (mm)
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
110 x 110 (µm)
4.4 x 4.4 (mils)
Metallization Mask Layout
ACTS244MS
AI1
(2)
AE
(1)
VCC
(20)
VCC
(20)
BE
(19)
(18) AO1
BO4 (3)
(17) BI4
AI2 (4)
(16) AO2
BO3 (5)
(15) BI3
AI3 (6)
(14) AO3
BO2 (7)
(13) BI2
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number
3
518784
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