Data Sheet

XS
ON
6
IP4221CZ6-XS
ESD protection for high-speed interfaces
Rev. 2 — 13 December 2012
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as USB 2.0, Ethernet and
Digital Visual Interface (DVI) against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal
lines and is encapsulated in a leadless ultra small DFN1010-6 (SOT891) plastic package.
Special diode configuration protects all signal lines and offers ultra low line capacitance of
only 1 pF. The rail-to-rail diodes are connected to the Zener diode which allows ESD
protection to be independent of supply voltage.
1.2 Features and benefits
 System ESD protection for high-speed data lines such as USB 2.0, Ethernet and DVI
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 8 kV according to IEC 61000-4-2, level 4
 Line capacitance of only 1 pF for each channel
 Leadless ultra small DFN1010-6 package: 1 1 0.5 mm; pitch 0.5 mm
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
 Mobile phones, smartphones and handsets
 TVs and monitors
 DVD recorders and players
 Notebooks, mother boards, graphic cards and ports
 Set-top boxes and game consoles
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
Simplified outline
1
I/O 1
ESD protection
2
GND
ground
3
I/O 2
ESD protection
4
I/O 3
ESD protection
5
VCC
supply voltage
6
I/O 4
ESD protection
1
2
Graphic symbol
3
6
5
4
1
2
3
6
5
4
bottom view
001aag273
3. Ordering information
Table 2.
Ordering information
Type number
IP4221CZ6-XS
Package
Name
Description
Version
DFN1010-6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1  0.5 mm
SOT891
4. Marking
Table 3.
Marking codes
Type number
Marking code
IP4221CZ6-XS
1X
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
electrostatic discharge
voltage
Tstg
Tamb
[1]
IP4221CZ6-XS
Product data sheet
Conditions
Min
Max
Unit
0.5
+5.5
V
8
+8
kV
storage temperature
55
+125
C
ambient temperature
40
+85
C
IEC 61000-4-2, level 4;
contact discharge
[1]
All pins to ground.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
2 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
6. Characteristics
Table 5.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
1
1.2
pF
C(I/O-GND)
input/output to ground
capacitance
VI = 0 V; f = 1 MHz;
VCC = 3 V
[1][2]
IRM
reverse leakage current
VI = 3 V
[3][2]
-
-
100
nA
[4]
6
-
9
V
-
0.7
-
V
VBRzd
Zener diode breakdown
voltage
II = 1 mA
VF
forward voltage
Itest = 10 mA
[1]
This parameter is guaranteed by design.
[2]
Pins 1, 3, 4 and 6 are measured to ground.
[3]
All pins measured to ground (pin 2).
[4]
Measured from pin 5 to pin 2.
7. Application information
7.1 USB 1.1 and 2.0 protection
VBUS
DAT+
DAT+
USB
DAT− PORT
GND
DAT−
USB 2.0/
IEEE 1394
CONTROLLER
1
6
2
5
3
4
VBUS
DAT+
DAT−
DAT+
USB
DAT− PORT
GND
001aah371
Each device is capable to protect USB data lines and VBUS supply.
Fig 1.
IP4221CZ6-XS
Product data sheet
Typical application for USB ESD protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
3 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
7.2 USB On-The-GO (OTG) protection
VBUS
DAT+
DAT−
to phone
USB OTG
RECEPTACLE
CARKIT
ID
GND
Shld GND
mini B receptacle
mini A receptacle
1
6
2
5
3
4
001aag051
The device is capable to protect USB data lines, VBUS supply and ID pin.
Fig 2.
Typical application for USB OTG ESD protection
7.3 Universal SIM card protection
I/O
CLOCK
RESET
SIM
VCC
GND
1
6
2
5
3
4
001aag052
The device also protects VCC.
Fig 3.
IP4221CZ6-XS
Product data sheet
Typical application for universal SIM card ESD protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
4 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
7.4 IEEE 1394a/b protection
TPBIAS
Shld1
1 μF
PWR
BUS PWR
56 Ω
1
56 Ω
TPA+
TPA+
TPA−
TPA−
IEEE 1394
PHYSICAL
LAYER
7
6
5
6
1
1394
CONNECTOR
2
5
3
4
TPB+
TPB+
TPB−
TPB−
GND
56 Ω
56 Ω
Shld2
220 pF
5 kΩ
1 nF
10 nF
4
3
2
8
1 MΩ
001aag050
Fig 4.
IP4221CZ6-XS
Product data sheet
Typical application for IEEE 1394a/b ESD protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
5 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
7.5 Gigabit Ethernet transceiver protection
TPOPA
R1
C1
C5
C2
C6
TPONA
1
6
2
5
3
4
TPOPB
R2
TPONB
GIGABIT
ETHERNET
TPOPC
TRANSCEIVER
QUAD
TRANSFORMER
R3
RJ45
C3
C7
C4
C8
TPONC
1
6
2
5
3
4
TPOPD
R4
TPOND
001aag053
Fig 5.
IP4221CZ6-XS
Product data sheet
Typical application for gigabit Ethernet transceiver ESD protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
6 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
7.6 Universal microSD/TransFlash and SD memory card protection
DAT0
DAT1
DAT2
DAT3/CD
TRANSFLASH
CMD
CLK
VCC
GND
1
6
1
6
2
5
2
5
3
4
3
4
001aag054
Fig 6.
IP4221CZ6-XS
Product data sheet
Typical application for universal microSD/TransFlash and SD memory card ESD
protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
7 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
8. Package outline
1.05
0.95
0.5
max
0.04
max
0.55
3
4
2
5
1
6
0.35
1.05
0.95
0.20
0.12
0.35
0.40
0.32
0.35
0.27
Dimensions in mm
Fig 7.
07-05-15
Package outline DFN1010-6 (SOT891)
9. Packing information
Table 6.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
5000
IP4221CZ6-XS
DFN1010-6 4 mm pitch, 8 mm tape and reel; T4
(SOT891)
[2]
[1]
For further information and the availability of packing methods, see Section 13.
[2]
T4: reverse taping
-132
10. Soldering
1.05
0.5
(6×)
1.4
0.6
(6×)
solder resist
solder land plus
solder paste
0.7
occupied area
Dimensions in mm
0.15
(6×)
0.25
(6×)
Fig 8.
IP4221CZ6-XS
Product data sheet
0.35
sot891_fr
Reflow soldering footprint DFN1010-6 (SOT891)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
8 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
11. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4221CZ6-XS v.2
20121213
Product data sheet
-
IP4221CZ6-XS v.1
Modifications:
IP4221CZ6-XS v.1
IP4221CZ6-XS
Product data sheet
•
•
•
•
•
•
•
•
•
Section 1 “Product profile”: updated
Section 4 “Marking”: added
Section 5 “Limiting values”: Tamb added
Recommended operating conditions: removed
Table 5 “Characteristics”: updated
Section 7 “Application information”: updated
Section 8 “Package outline”: drawing replaced with minimized package outline drawing
Section 10 “Soldering”: added
Section 12 “Legal information”: updated
20070611
Objective data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
-
© NXP B.V. 2012. All rights reserved.
9 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
IP4221CZ6-XS
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 December 2012
© NXP B.V. 2012. All rights reserved.
10 of 12
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 December 2012
Document identifier: IP4221CZ6-XS
IP4221CZ6-XS
NXP Semiconductors
ESD protection for high-speed interfaces
14. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 3
USB 1.1 and 2.0 protection . . . . . . . . . . . . . . . 3
USB On-The-GO (OTG) protection . . . . . . . . . 4
Universal SIM card protection. . . . . . . . . . . . . . 4
IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 5
Gigabit Ethernet transceiver protection . . . . . . 6
Universal microSD/TransFlash and SD memory
card protection . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 December 2012
Document identifier: IP4221CZ6-XS