MID Datasheet

MID
www.vishay.com
Vishay Electro-Films
Thin Film Microwave Resistor
FEATURES
• Wire bondable
• High frequency
• Chip size: 0.050" x 0.050"
• Microwave resistance range: 18  to 500 
• Overall resistance range: 2  to 100 k
• Alumina substrate
• Low stray capacitance: < 0.2 pF
• Power: 200 mW
Product may not be to scale
• Resistor material: Tantalum nitride, self passivating
• Moisture resistant
The MID resistor chips on alumina are designed for low
shunt capacitance applications with 200 mW power
requirements.
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
These chips are manufactured using Vishay Electro-Films
(EFI) sophisticated Thin Film equipment and manufacturing
technology. The MIDs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
APPLICATIONS
Vishay EFI MIC chip resistors provide excellent
high-frequency response and are ideally suited for
prototyping. Typical application areas are:
• Amplifiers
• Oscillators
• Attenuators
• Couplers
• Filters
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Resistance Range
Tolerances
VALUE
UNIT
2 to 100K

1
%
± 25; ± 50; ± 100; ± 200
ppm/°C
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
- 20 typ.
dB
TCR
Note
• Only 18  to 500  are standard strip line designs for microwave applications
STANDARD ELECTRICAL SPECIFICATIONS
Moisture Resistance, MIL-STD-202, Method 106
± 0.1 max. R/R
%
Stability, 1000 h, + 125 °C, 100 mW
± 0.2 max. R/R
%
- 55 to + 125
°C
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
± 0.1 max. R/R
%
High Temperature Exposure + 150 °C, 1000 h
± 0.2 max. R/R
%
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at 150 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 18-Apr-13
400
V
1012 min.

100 max.
V
0.200 max.
W
± 0.1 max. R/R
%
Document Number: 61076
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MID
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.050
0.050
0.050
0.050
0.050
0.044
0.050
0.016
0.010
0.044
0.044
0.044
TYPICAL RANGE
2 Ω to 7.9 Ω
TYPICAL RANGE
8 Ω to 17 Ω
TYPICAL RANGE
18 Ω to 100 kΩ
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
Chip Size
0.050" x 0.050" ± 0.003" (1.27 mm x 1.27 mm ± 0.076 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
99.6 % alumina, 2 μ" to 4 μ" finish
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad Size
0.010" x 0.044" (0.254 mm x 1.11 mm)
Number of Pads
2
Pad Material
25 kÅ minimum gold standard
Backing
None
GLOBAL PART NUMBER INFORMATION
Global Part Number: MID5000AFCSGGKWS
Global Part Number Description: MID 500 1 %, 50 ppm/°C, standard, Au, Au, K, WS
M
I
D
MODEL
RESISTANCE
MID
First 4
digits are
significant
figures of
resistance
50 x 50
size
microwave
resistor
TaN on
alumina
Revision: 18-Apr-13
5
0
0
RESISTANCE
MULTILPLIER
CODE
TOL.
CODE
(%)
C = 0.001
B = 0.01
A = 0.1
0=1
1 = 10
2 = 100
F = 1.0
G = 2.0
J = 5.0
K = 10
M = 20
0
A
F
C
TCR
(ppm/°C)
TRIM
STYLE
E = ± 25
C = ± 50
K = ± 100
L = ± 200
M=
Microwave
S=
Standard
S
G
TERMINATION
G = Au
S = SnPb
A = Al
T=
Lead (Pb)-free
(e1)
G
K
W
S
BACK
METAL
VISUAL
CLASS
PACKAGING
CODE
G = Au
N = None
H=
Class H
K=
Class K
WS =
Waffle pack
100 min,
1 mult
Document Number: 61076
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000