Class-AB Speaker Amplifiers 1.9W+1.9W Stereo Speaker Amplifier No.10077EAT07 BD7836EFV ●Description BD7836EFV is a Class-AB stereo speaker amplifier, developed for note-book PC, desktop PC, portable devices and others. Class-AB amplifier has no EMI noise. Power package HTSSOP-B20 can realize high output power. Low circuit current at active mode reduce consumption of battery. Shutdown current is 0.1µA typically, and pop noise level when shutdown turns on and off is very small. This device is suitable for the application that often changes mode between “shutdown state” and “active state”. ●Features 1) High power 1.9W typ. (VDD=5V, RL=4Ω, THD+N=1%, stereo input) High power 1.2W typ. (VDD=5V, RL=8Ω, THD+N=1%, stereo input) 2) Gain selectable by the external control (6,10,15.6,21.6dB) 3) Pop noise suppression circuitry 4) Shutdown function (also Mute function) [Isd=0.1µA(typ.)] 5) Protection circuitry (Thermal shutdown, Under voltage lockout) 6) Power Package with thermal pad HTSSOP-B20 ●Applications Note-book PC, Desktop PC, etc. ●Absolute maximum ratings (Ta=+25℃) Parameter Power Supply Voltage Symbol Ratings Unit VDDmax 7.0 V *1 W 3.2 *2 W Tstg -55 ～ +150 ℃ Vin -0.3～VDD+0.3 V Vctl -0.3～VDD+0.3 V 1 Power Dissipation Pd Storage Temperature Input Terminal Input Voltage Range *3 Control Terminal Input Voltage Range *4 *1 70mm×70mm×1.6mm FR4 1-layer glass epoxy board(Copper on top layer 0%) Derating in done at 8mW/℃ for operating above Ta=25℃. There are thermal via on the board. *2 70mm×70mm×1.6mm FR4 4-layer glass epoxy board (Copper on bottom 2 and 3 layer 100%) Derating in done at 25.6mW/℃ for operating above Ta=25℃. There are thermal via on the board. *3 Input Terminal (LIN+, LIN-, RIN+, RIN-) *4 Control Terminal ( SHUTDOWN , GAIN0, GAIN1) ●Operating conditions Parameter Symbol Range Unit Power Supply Voltage VDD +4.5 ～ +5.5 V Temperature Topr -40 ～ +85 ℃ * These products aren’t designed for protection against radioactive rays. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/16 2010.07 - Rev.A Technical Note BD7836EFV ●Electric characteristic (Unless otherwise specified, Ta=+25℃, VDD=+5.0V, RL=8Ω, AC stereo input) Parameter Symbol Limits Min. Typ. Max. Unit Condition Circuit current (Active) Icc ― 5 10 mA IC active, No load SHUTDOWN =Hi Circuit current (Shutdown) Isd ― 0.1 2.0 µA IC Shutdown SHUTDOWN =Lo Output power 1 PO1 0.7 1.2 ― W RL=8Ω, BTL, f=1kHz, THD+N=1% *1 Output power 2 PO2 ― 1.9 ― W RL=4Ω, BTL, f=1kHz, THD+N=1% *1 5.5 6.0 6.5 dB BTL, GAIN0=GAIN1=L <Speaker amplifier> Gain GV Input resistance 9.5 10 10.5 dB BTL, GAIN0=L, GAIN1=H 14.6 15.6 16.5 dB BTL, GAIN0=H, GAIN1=L 20.6 21.6 22.6 dB BTL, GAIN0=GAIN1=H 63 90 117 kΩ GAIN0=GAIN1=L 49 70 91 kΩ GAIN0=L, GAIN1=H 31 45 59 kΩ GAIN0=H, GAIN1=L 17 25 33 kΩ GAIN0=GAIN1=H Vripple=0.2Vp-p,CBYP=0.47µF f=1kHz, BTL RIN Supply ripple rejection ratio PSRR 62 68 ― dB Output noise Vnoise ― 16 80 µVrms SN ― 105 ― dB ⊿Vo ― 0 ±25 mV S/N Output DC offset voltage BTL, f=1kHz, 20-20kHz BTL, Po=1W, BTL, f=1kHz, 20-20kHz <Control terminal ( SHUTDOWN ,GAIN0,GAIN1)> Control terminal Input voltage Hi level VIH 2.0 ― VDD V Lo level VIL 0 ― 0.8 V *1: B.W.=400～30kHz， BTL：The voltage between 4pin and 8pin, 14pin and 18pin. ●Control terminal’s settings SHUTDOWN IC condition Hi Active Lo Shutdown GAIN0 GAIN1 Gain Input resistance Lo Lo 6dB 90kΩ (TYP.) Lo Hi 10dB 70kΩ (TYP.) Hi Lo 15.6dB 45kΩ (TYP.) Hi Hi 21.6dB 25kΩ (TYP.) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/16 2010.07 - Rev.A Technical Note BD7836EFV ●Package outlines BD7836 Lot No. (unit : mm) Fig.1 HTSSOP-B20 ●Block diagram ●Pin assignment table Pin Terminal name No. RIN- ROUT+ RIN+ ROUT- GAIN0 GAIN1 PVDD Gain Control Depop Circuitry Function 1 GND Ground 2 GAIN0 Bit 0 of gain select 3 GAIN1 Bit 1 of gain select 4 LOUT+ Left channel positive output 5 LIN- 6 PVDD Supply voltage terminal 7 RIN+ Right channel negative differential input 8 LOUT- 9 LIN+ 10 BYPASS 11 GND 12 NC Left channel negative differential input VDD Power Management BYPASS SHUTDOWN Left channel negative output Left channel positive differential input GND LIN- LOUT+ LIN+ Tap to voltage divider for internal midsupply bias generator Ground No connection 13 GND 14 ROUT- Ground Right channel negative output 15 PVDD Supply voltage terminal 16 VDD Supply voltage terminal 17 RIN- Right channel negative differential input 18 ROUT+ LOUT- Fig.2 19 20 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/16 Right channel positive output Places IC in shutdown mode when SHUTDOWN held low GND Ground 2010.07 - Rev.A Technical Note BD7836EFV ●Measurement circuit diagram CRIN0.47µＦ 17 RINRight Line Input C + RIN Signal 0.47µＦ ROUT+ 18 + RL ROUT- 14 7 RIN+ PVDD 6.15 VDD 16 VDD CSR 0.1µＦ VDD CSR 0.1µＦ Power Management 2 GAIN0 3 GAIN1 Gain Control BYPASS 10 SHUTDOWN 19 GND CLIN0.47µＦ 5 LINLeft Line Input Signal LOUT+ 4 + CLIN+ 0.47µＦ CBYP 0.47µＦ To System Control 1,11, 13,20 RL 9 LIN+ LOUT- 8 Fig.3 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/16 2010.07 - Rev.A Technical Note BD7836EFV ●Application circuit example Right Line Input Signal CRIN0.47µＦ 17 RIN- ROUT+ 18 + CRIN+ 0.47µＦ 7 RIN+ ROUT- 14 PVDD 6.15 CSR 0.1µＦ VDD 16 CSR 0.1µＦ Gain Control CBYP 0.47µＦ SHUTDOWN 19 GND Left Line Input Signal VDD BYPASS 10 Power Management 2 GAIN0 3 GAIN1 VDD To System Control CLIN0.47µＦ 5 LIN- 1,11, 13,20 LOUT+ 4 + CLIN+ 0.47µＦ 9 LIN+ LOUT- 8 Fig.4 Single Ended inputs Right Line Input Signal CRIN0.47µＦ 17 RIN- ROUT+ 18 + CRIN+ 0.47µＦ 7 RIN+ ROUT- 14 PVDD 6.15 CSR 0.1µＦ VDD 16 CSR 0.1µＦ BYPASS 10 Power Management 2 GAIN0 3 GAIN1 Gain Control VDD CBYP 0.47µＦ SHUTDOWN 19 GND Left Line Input Signal VDD To System Control CLIN0.47µＦ 5 LIN- LOUT+ 4 1,11, 13,20 + CLIN+ 0.47µＦ 9 LIN+ LOUT- 8 Fig.5 Differential inputs www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/16 2010.07 - Rev.A Technical Note BD7836EFV ●Evaluation board circuit diagram CRIN0.47μＦ 17 RIN- ROUT+ 18 + CRIN+ 0.47μＦ ROUT- 14 7 RIN+ PVDD 6.15 CSR 0.1μＦ VDD 16 CSR 0.1μＦ Power Management 2 GAIN0 3 GAIN1 Gain Control BYPASS 10 SHUTDOWN CBYP 0.47μＦ 19 GND 1,11, 13,20 CLIN0.47μＦ 5 LIN- LOUT+ 4 + CLIN+ 0.47μＦ 9 LIN+ LOUT- 8 Please connect speaker. Please connect to GND. Please connect to Power Supply (VDD=+4.5～5.5V) line. Please connect ito input signal line. Use these solder jumper for connecting the control terminal to GND. Use these solder jumper for connecting the control terminal to VDD. Fig .6 Please connect speaker. ●Evaluation board partts list Number Part name Type, Value SMD size 4 CLIN+/-,CRIN+/- Capacitor, 0.47μF 1608 2 CSR Capacitor, 0.1μF 1608 1 CBYP Capacitor, 0.47μF 1608 1 U1 1 PCB1 IC, BD7836EFV, Class-AB stereo speaker Amplifier Printed-circuit board BD7836EFV www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/16 PKG:HTSSOP-B20 ― Manufacturer/ Part number Murata GRM188R71C474KA01D Murata GRM188R71C104KA01D Murata GRM188R71C474KA01D ROHM BD7836EFV-E2 ― 2010.07 - Rev.A Technical Note BD7836EFV ●Description of external parts ①Input coupling capacitors Ci (CLIN+/-,CRIN+/-) It sets cutoff frequency fc by the following formula by input coupling capacitors Ci(CLIN+/-,CRIN+/-) and input impedance Zi. 1 [Hz] 2π Zi Ci It makes an input coupling capacitors of evaluation board 0.47μF on evaluation board.. Input impedance Zi and cutoff frequency fc in each gain settings are given in Table1. fc Table1. The relations in the gain settings and cutoff frequency fc. GAIN0 GAIN1 Gain [dB] Ri Ω] Zi [Ω] fc [Hz] Lo Lo 6 90k 45k 7.5 Lo Hi 12 70k 35k 9.7 Hi Lo 18 45k 22.5k 15 Hi Hi 24 25k 12.5k 27 ②The power decoupling capacitors (CSR) It makes a power decoupling capacitors 0.1μF. Because power decoupling capacitors influences total harmonic distortion (THD) and some audio characteristics, please place a good low equivalent-series-resistance (ESR) capacitors as close as possible to IC. ③BYPASS capacitor (CBYP) Because BYPASS capacitor influences THD, PSRR and some audio characteristics, please place good low equivalent-series-resistance (ESR) capacitor as close as possible to IC. The value of BYPASS capacitor determines the turn on time and turn off time. Refer to the following section of “Turn ON and Turn OFF”. It makes BYPASS capacitor of evaluation board 0.47μF. ④Control terminal Each control terminal ( SHUTDOWN , GAIN0, GAIN1) don’t have pull-down resistance internal circuit. Connect to GND line or VDD line or input Low or high level voltage to terminals in order to avoid the terminals made high Impedance. Using IC under the control terminal let high impedance, operation fault may occur. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/16 2010.07 - Rev.A Technical Note BD7836EFV ●Evaluation board PCB layer Fig.7 Top layer Fig.8 Bottom Layer www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/16 2010.07 - Rev.A Technical Note BD7836EFV ●Turn on and Turn off This IC has the circuit that reduces pop noise at “turn on” and “turn off”. Reducing pop noise is realized in controlling to adjust the turn on and turn off time. SHUTDOWN 5V/div. BYPASS 1V/div. LOUT1V/div. Turn ON time Turn OFF time (a)Turn ON (b)Turn OFF Fig. 9 The following table show the Turn ON time and Turn OFF time when It makes the BYPASS capacitor 0.47uF. CBYP Turn ON Turn OFF 0.47uF 280ms 340ms Turn ON time is defined as the time until BYPASS terminal voltage reaches the 90% of VDD/2 after SHUTDOWN L→H. Turn OFF time is defined as the time until BYPASS terminal voltage reaches the 10% of VDD/2 after SHUTDOWN H→L. The values of above table are typical characteristics. These values will shift by 30% at some conditions. ●Input terminal This IC can be inputed signal by differntial inputs or single ended inputs. When sing the single ended inputs, connect the terminal of not signal inputed line to AC GND with input couppling capacitors. Please makes the value of all input capacitors same because of preventing pop noise. If they are not same value, for example, LOUT+=0.47µF, LOUT-=0.33µF, it caused pop noise increase and characteristics become worse. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/16 2010.07 - Rev.A Technical Note BD7836EFV ●About the thermal design by the IC Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following. Since an maximum junction temperature (TjMAX.)or operating temperature range (Topr) is shown in the absolute maximum ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve). If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate. TSD, which operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately +100℃. Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity that TSD affects decrease IC reliability. Temperature Derating Curve Reference Data HTSSOP-B20 3.5 ④3.2W Power dissipation Pd(W) 3.2 Measurement conditions: IC unit Rohm standard board mounted Board ： 70mm×70mm×1.6mmt board① FR4 1-layer glass epoxy board (Copper on top layer 0%) board② FR4 2-layer glass epoxy board (Copper on top layer 0%) board③ FR4 3-layer glass epoxy board (Copper on top layer 100%) board④ FR4 4-layer glass epoxy board (Copper on top layer 100%) 2.5 ③2.3W 2.3 2.0 1.5 ②1.45W 1.0 ①1W 0.5 0.0 0 25 50 75 85 100 125 150 Ambient Temperature Ta(℃) Note) Values are actual measurements and are not guaranteed. Fig.10 Power dissipation vs. Ambient temperature Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when mounted on a multilayer board designed to radiate is greater than the values in the graph above. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/16 2010.07 - Rev.A Technical Note BD7836EFV ●Typical Characteristics TABLE OF GRAPHS Items Parameter Figure number vs. Frequency 11, 12, 17, 18 vs. Output power 13, 14, 15, 16, 19, 20, 21, 22 Supply current (Icc) vs. Supply voltage 23 Shutdown current (Isd) vs. Supply voltage 24 Gain vs. Frequency 25 Crosstalk vs. Frequency 26 Supply ripple rejection ratio vs. Frequency 27 Shutdown attenuation vs. Frequency 28 Power dissipation vs. Output power 29 Efficiency vs. Output power 30 vs. Load resistance 31 Total harmonic distortion plus noise (THD+N) Output power www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/16 2010.07 - Rev.A Technical Note BD7836EFV THD+N vs Frequency VDD=5V, RL=4Ω 400Hz-30kHz THD+N vs Frequency VDD=5V, RL=4Ω, Po=1.5W 400Hz-30kHz 10 Po=0.5W Po=1W Po=1.5W 1 THD+N [%] THD+N [%] 10 0.1 0.01 10 100 1k Frequency [Hz] 10k 6dB 10dB 15.6dB 21.6dB 1 0.1 0.01 100k 10 100 1k Frequency [Hz] Fig.11 Figure.1 THD+N vs Output power VDD-5V, RL=4Ω Gv=10dB, f=1kHz, 400Hz-30kHz 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) THD+N [%] THD+N [%] 10 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 1 0.1 0.01 0.01 0.1 1 Output power [W] 0.01 0.01 10 0.1 1 Output power [W] Fig.13 Figure.3 10 1 1 THD+N [%] THD+N [%] 10 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.01 0.01 0.1 1 THD+N vs Output power VDD=5V, RL=4Ω Gv=21.6dB, f=1kHz, 400Hz-30kHz 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.01 0.01 10 0.1 1 10 Output power [W] Output power [W] Fig.15 Figure.5 Fig.16 Figure.6 THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W 400Hz-30kHz THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W 400Hz-30kHz 10 10 Po=0.25W Po=0.5W Po=1W THD+N [%] 1 10 Fig.14 Figure.4 THD+N vs Output power VDD=5V, RL=4Ω Gv=15.6dB, f=1kHz, 400Hz-30kHz THD+N [%] 100k Fig.12 Figure.2 THD+N vs Output power VDD=5V, RL=4Ω Gv=6dB, f=1kHz, 400Hz-30kHz 1 10k 0.1 6dB 10dB 15.6dB 21.6dB 1 0.1 0.01 10 100 1k Frequency [Hz] 10k 0.01 100k 10 Fig.17 Figure.7 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 100 1k Frequency [Hz] 10k 100k Fig.18 Figure.8 12/16 2010.07 - Rev.A Technical Note BD7836EFV THD+N vs Output power VDD=5V, RL=8Ω Gv=6dB, f=1kHz, 400Hz-30kHz THD+N vs Output power VDD=5V, RL=8Ω Gv=10dB, f=1kHz, 400Hz-30kHz 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 1 THD+N [%] 1 THD+N [%] 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.1 0.1 0.01 0.01 0.1 1 Output power [W] 0.01 0.01 10 0.1 1 Outpupower [W] Fig.19 Figure.9 Fig.20 Figure.10 THD+N vs Output power VDD-5V, RL=8Ω Gv=15.6dB, f=1kHz, 400Hz-30kHz THD+N vs Output power VDD-5V, RL=8Ω Gv=21.6dB, f=1kHz, 400Hz-30kHz 10 10 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 1 1 THD+N [%] THD+N [%] 10 0.1 0.1 f=100Hz (30kHz LPF) f=1kHz (400Hz-30kHz) f=10kHz (80kHz LPF) 0.1 1 Outpu power [W] 0.01 0.01 10 0.1 1 Output power [W] Fig.21 Figure.11 Fig.22 Figure.12 Icc-VDD Noload, No signal Isd vs VDD Noload, No signal 10 9 8 7 6 5 4 3 2 1 0 0.5 0.3 0.2 0.1 0 1 2 3 VDD [V] 4 5 0 6 0 1 2 Fig.23 Figure.13 35 25 4 5 6 Cross talk vs Frequency VDD=5V, RL=8Ω, Gv=6dB 80ｋHz LPF 0 6dB 10dB 15.6dB 21.6dB 30 3 VDD[V] Fig.24 Figure.14 Gain vs Frequency VDD=5V, RL=8Ω 10Hz-500kHz -20 Left to Right -40 20 gain [dB] gain [dB] 10 0.4 Icd [uA] Icc [mA] 0.01 0.01 15 10 Right to Left -60 -80 5 -100 0 10 100 1k Frequency [Hz] 10k -120 100k 10 Fig.25 Figure.15 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 100 1k Frequency [Hz] 10k 100k Fig.26 Figure.16 13/16 2010.07 - Rev.A Technical Note BD7836EFV 0 SHUTDOWN attnuation [dB] 0 6ｄB 10ｄB 15.6ｄB 21.6ｄB -20 PSRR [dB] SHUTDOWN attenuation vs Frequency VDD=5V RL=8Ω, Vin=1Vrms(2Vrms@BTL), 10Hz-500kHz PSRR vs Frequency VDD-5V, RL=8 Ω,CBYP=0.47uF Vripple=0.2Vpp, 10Hz-500kHz Bandpass -40 -60 -80 -100 -20 -40 -60 -80 -100 -120 -120 10 100 1k 10k 10 100k 100 Frequency [Hz] Output power vs Efficiency VDD=5V, Gv=6dB, f=1kHz 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 100 90 80 70 60 50 40 30 20 10 0 Efficiency [%] Power Dissipation [W] Output power vs Power Dissipation VDD=5V, Gv=6dB, f=1kHz RL=8Ω RL=4Ω RL=3Ω 0.5 100k Fig.28 Figure.18 Figure.17 Fig.27 0 1k 10k Frequency [Hz] 1 1.5 Output power [W] 2 2.5 RL=8Ω RL=4Ω RL=3Ω 0 0.5 1 1.5 Outputpower [W] 2 2.5 Fig.30 Figure.20 Fig.29 Figure.19 Output power vs Load Resisitance VDD=5V, Gv=6dB, f=1kHz 3.5 Output power[%] 3 2.5 THD=1％ THD=10％ 2 1.5 1 0.5 0 0 8 16 24 32 40 48 Load Resistance[Ω] 56 64 Fig.31 Figure.20 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/16 2010.07 - Rev.A Technical Note BD7836EFV ●Notes for use (1) Absolute maximum ratings This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other parameters are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings. if it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and determine ways to avoid exceeding the IC’s absolute maximum ratings. (2) GND terminal’s potential Try to set the minimum voltage for GND terminal’s potential, regardless of the operation mode. (3) Shorting between pins and mounting errors When mounting the IC chip on a board, be very careful to set the chip’s orientation and position precisely. When the power is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs (due to a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND. (4) Operation in strong magnetic fields Note with caution that operation faults may occur when this IC operates in a strong magnetic field. (5) Thermal design Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use modes, because this IC is power amp. When excessive signal inputs which the heat dissipation is insufficient condition, it is possible that thermal shutdown circuit is active (6) Thermal shutdown circuit This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shutdown the IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = +150℃, and is not intended to protect and secure an electrical appliance (7) Load of the output terminal This IC corresponds to dynamic speaker load, and doesn't correspond to the load except for dynamic speakers. (8) The short protection of the output terminal This IC has short protection circuit. The function protects the IC from rash current on road. (9) Operating ranges The rated operating power supply voltage range (VDD=+4.5V～+5.5V) and the rated operating temperature range (Ta=-40℃～+85℃) are the range by which basic circuit functions is operated. Characteristics and rated output power are not guaranteed in all power supply voltage ranges or temperature ranges. (10) Electrical characteristics Electrical characteristics show the typical performance of device and depend on board layout, parts, power supply. The standard value is in mounting device and parts on surface of ROHM’s board directly. (11) Maximum output power When stereo inputs at RL=4Ω, maximum output power may not achieve up to typical value because the device heats. Ensure sufficient margins to the thermal design to get larger output power. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/16 2010.07 - Rev.A Technical Note BD7836EFV ●Ordering part number B D 7 Part No. 8 3 6 E Part No. 7836 F V Package EFV:HTSSOP-B20 - E 2 Packaging and forming specification E2: Embossed tape ad reel HTSSOP-B20 <Tape and Reel information> 6.5±0.1 (MAX 6.85 include BURR) (4.0) 1 1.0±0.2 (2.4) 6.4±0.2 0.5±0.15 11 4.4±0.1 20 Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 10 0.325 1.0MAX +0.05 0.17 -0.03 0.08±0.05 0.85±0.05 S 0.08 S 0.65 +0.05 0.24 -0.04 1pin Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/16 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.07 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001