711AZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN16 4.0x1.35, 0.5P
CASE 711AZ
ISSUE O
16
DATE 09 SEP 2014
1
SCALE 4:1
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÏÏÏÏ
ÏÏÏÏ
0.10 C
L
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÏÏÏ
ÏÏÏ
ÎÎÎ
TOP VIEW
EXPOSED Cu
DETAIL B
(A3)
0.10 C
A
MOLD CMPD
DETAIL B
16X
0.08 C
A1
SIDE VIEW
C
SEATING
PLANE
e/2
DETAIL A
e
16X
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DIM
A
A1
A3
b
D
E
e
L
L1
L2
GENERIC
MARKING DIAGRAM*
XXXM
G
L
8
1
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
4.00 BSC
1.35 BSC
0.50 BSC
0.40
0.60
−−−
0.15
0.20 REF
1
L2
16
9
16X
b
0.10 C A B
0.05 C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
0.50
PITCH
XXX = Specific Device Code
M = Month Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
16X
0.65
1.55
1
15X
0.48
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON90324F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XDFN16 4.0X1.35, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON90324F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
09 SEP 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. O
Case Outline Number:
711AZ