16 Pin UDFN, 3.5x1.2, 0.4P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN16 3.5x1.2, 0.4P
CASE 517AF
ISSUE C
16
1
SCALE 4:1
2X
0.10 C
PIN ONE
REFERENCE
2X
ÏÏÏ
ÏÏÏ
0.10 C
ÏÏ
ÎÎ
ÏÏ
A
B
D
A1
E
DATE 23 OCT 2012
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL B
OPTIONAL
CONSTRUCTION
TOP VIEW
(A3)
DETAIL B
0.05 MIN
A
0.10 C
(0.10)
16X
SEATING
PLANE
0.08 C
SIDE VIEW
L
C
A1
D2
DETAIL A
16X
L1
14X
e
L
8
1
16X
K
16
9
DETAIL A
E2
16X
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
NOM MAX
0.45
0.50
0.55
0.00
0.03
0.05
0.127 REF
0.15
0.20
0.25
3.50 BSC
2.70
2.80
2.90
1.20 BSC
0.20
0.30
0.40
0.40 BSC
0.20 TYP
0.20
0.25
0.30
−−−
−−−
0.10
GENERIC
MARKING DIAGRAM*
XXXM
G
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
SOLDERING FOOTPRINT*
1
XXX = Specific Device Code
M = Month Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1.35
1
DETAIL A
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
0.35
0.30
0.10
2.85
15X
0.40 PITCH
0.20
16X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON22156D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN16 3.5X1.2, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON22156D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
13 JUN 2006
A
ADDED DEVICE MARKING INFORMATION. REQ. BY A. TAM.
10 MAY 2007
B
CORRECTED DEVICE MARKING INFORMATION. REQ. BY A. TAM.
18 MAY 2007
C
CHANGED DIMENSION K FROM 0.20 MIN TO 0.20 TYP. REQ. BY M. BEGONIA.
23 OCT 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. C
Case Outline Number:
517AE