RClamp0552T Datasheet

RClamp0552T
Ultra Low Capacitance TVS
2-Line ESD Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
RailClamp TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and other portable
electronics. This device offers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device degradation.
The RClamp®0552T has a maximum capacitance of
only 0.40pF. This allows it to be used on circuits
operating in excess of 5GHz without signal attenuation.
The RClamp0552T is in a 3-pin SLP1006N3T package.
It measures 1.0 x 0.6 mm with a nominal height of only
0.4mm. The leads are finished with lead-free NiPdAu.
Each device will protect two lines operating at 5 volts.
It gives the designer the flexibility to replace multiple
single line devices in space constrained applications.
They may be used to meet the ESD immunity requirements of IEC 61000-4-2. The combination of small
size and high ESD surge capability makes them ideal
for use in portable applications such as cellular
phones, digital cameras, and MP3 players.
®
 High ESD withstand Voltage: +/-17kV (Contact and
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Air) per IEC 61000-4-2
Very small PCB area: 0.6mm2
Protects up to two high-speed data lines
Low reverse current: <5nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: <0.4pF (VR=0V)
Low dynamic resistance: 0.90 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006N3T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
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Dimensions
HDMI 1.3 and HDMI 1.4
USB 3.0
MHL
eDP
LVDS Interfaces
eSATA Interfaces
Schematic & PIN Configuration
1
1.00
0.68
1
2
2
0.60
0.40
3
Nominal Dimensions (mm)
Revision 3/19/2013
2-Line, Bidirectional
1
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RClamp0552T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
60
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
3
Amps
VESD
+/- 17
+/- 17
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O Pin
to GN D
Reverse Breakdown Voltage
V BR
It = 1mA
Any I/O Pin
to GN D
Reverse Leakage Current
IR
Reverse Leakage Current
Minimum
Maximum
Units
5
V
9
11
V
VRWM = 2V, T=25°C
Any I/O Pin
to GN D
<5
20
nA
IR
VRWM = 5V, T=25°C
Any I/O Pin
to GN D
<55
100
nA
Clamping Voltage
VC
IPP = 3A, tp = 8/20μs
Any I/O Pin
to GN D
20
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
24.5
V
Dynamic Resistance2, 3
RDyn
tp = 100ns
0.90
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Any I/O Pin
to GN D
0.21
6.5
Typical
0.4
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
4)Guaranteed by design. Not production tested
© 2013 Semtech Corporation
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RClamp0552T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1000
DR040412-65
TA = 25OC
25
Clamping Voltage -VC (V)
Peak Pulse Power - PPP (W)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
100
10
20
15
10
Waveform
Parameters:
tr = 8µs
td = 20µs
5
0
1
0.1
1
10
100
0
1000
1
Pulse Duration - tp (µs)
3
TLP Characteristic
30
0.50
25
TLP Current (A)
0.40
0.30
0.20
0.10
20
15
10
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
5
f = 1 MHz
0.00
0
0
1
2
3
4
5
0
10
20
Reverse Voltage - VR(V)
50
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 40dB attenuator.
ESD gun return path connected to ESD
ground plane
120
40
ESD Clamping (-8kV Contact per IEC 61000-4-2)
160
140
30
TLP Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
-20
-40
100
Voltage (V)
Voltage (V)
4
Peak Pulse Current - IPP (A)
Junction Capacitance vs. Reverse Voltage
Capacitance - Cj(pf)
2
80
60
-60
-80
-100
40
-120
20
-140
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 40dB
attenuator. ESD gun return path
connected to ESD ground plane
-160
-10
0
10
20
30
40
50
60
70
-10
80
© 2013 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
3
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RClamp0552T
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21
LOG
Analog Crosstalk
CH1 S21
6 dB / REF 0 dB
LOG
20dB /REF 0 dB
1: - .20480 dB
800 MHz
0 dB
5
12
-6 dB
3
2: - .31660 dB
900 MHz
0 dB
3: - .68660 dB
1.8 GHz
-20 dB
4
-40 dB
-12 dB
4: - .70880 dB
2.5 GHz
-18 dB
-60 dB
5: - 1.4302 dB
2.7 GHz
-24 dB
-80 dB
-30 dB
-100 dB
-36 dB
-120 dB
-42 dB
-48 dB
-140 dB
1
MHz
10
MHz
START. 030 MHz
© 2013 Semtech Corporation
100
MHz
3
1
GHz GHz
-160 dB
START. 030 MHz
STOP 3 000.000000 MHz
STOP 3000.000000 MHz
4
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RClamp0552T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Example Pin Configuration
The RClamp0552T is designed to protect two highspeed data lines operating up to 5 volts. The device is
bidirectional and may be used on lines where the signal
polarity is above and below ground. The diagram at the
right shows an example pin configuration with pin 3
connected to ground. However, due to the device
symmetry, any pin may be connected to ground with
the remaining pins conneted to the protected lines.
I/O 1 1
GND
I/O 2
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Recommended Mounting Pattern
Stencil Opening (220x460 mm)
Land Pad (200x400 mm)
Assembly Parameter
Solder Stencil Design
Aper ture shape
R ecommendation
Laser cut, Electro-polished
Rectangular
.850
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
1.000
OSP OR N iAu
All Dimensions are in mm.
Land Pad.
© 2013 Semtech Corporation
5
Stencil opening
Component
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RClamp0552T
PROTECTION PRODUCTS
Outline Drawing - SLP1006N3T
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
PIN 1
INDICATOR
(LASER MARK)
DIM
E
A
SEATING
PLANE
aaa C
C
A1
A2
e
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.145 0.17 0.195
0.175 0.20 0.225
0.90 1.00 1.10
0.50 0.60 0.70
0.68 BSC
0.225 0.25 0.275
3
0.08
0.10
R0.05
e/2
1
2
LxN
E/2
N
bbb
b1xN
C A B
bxN
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006N3T
X
DIMENSIONS
(C)
DIM
C
G
P
X
Y
Z
Z
Y
G
P/2
MILLIMETERS
(0.45)
0.05
0.68
0.20
0.40
0.85
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2013 Semtech Corporation
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RClamp0552T
PROTECTION PRODUCTS
Marking Code
Ordering Information
R2
Part Number
Qty per
Reel
Reel
Size
RClamp 0552T.TN T
10,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
Notes:
Marking will also include line matrix date code
Carrier Tape Specification
Bo
Ao
Ko
Device Orientation in Tape
A0
0.70 +/-0.05 mm
B0
1.15 +/-0.05 mm
K0
0.55 +/-0.05 mm
R2
R2
R2
R2
R2
Note: All dimensions in mm unless otherwise specified
Pin 1 Location
(Towards Sprocket Holes)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2013 Semtech Corporation
7
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