RClamp1821Z Datasheet

RClamp1821Z
Ultra Small RailClamp®
1-Line ESD protection
PROTECTION PRODUCTS - Z-PakTM
Description
Features
 High ESD withstand Voltage: +/-15kV (Contact),
RailClamp TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and other portable
electronics. This device offers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device degradation.
RClamp®1821Z has a maximum capacitance of only
0.8pF. This allows it to be used on circuits operating in
excess of 3GHz without signal attenuation.
RClamp1821Z is in a 2-pin SLP0603P2X3B package.
It measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 18 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
®







+/-18kV (Air) per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one data or power line
Low reverse current: <5nA typical (VR=18V)
Working voltage: +/- 18V
Low capacitance: 0.8pF Maximum
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP0603P2X3B package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications






Nominal Dimensions
Cellular Handsets & Accessories
Near Field Communication (NFC) lines
RF signal lines
FM Antenna
Digital Lines
USB VBus
Schematic
0.62
1
0.32
0.22
0.400 BSC
2
0.250
SLP0603P2X3B (Bottom View)
Revision 1/7/2014
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RClamp1821Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
85
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
2.5
Amps
VESD
+/- 18
+/- 15
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)1
ESD p er IEC 61000-4-2 (Contact)1
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or 2 to 1
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
VRWM = 18V, T=25°C
Pin 1 to 2 or 2 to 1
Clamping Voltage
VC
IPP = 2.5A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
ESD Clamping Voltage2
VC
IPP = 4A,
tlp = 0.2/100ns
30
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
48
V
Dynamic Resistance2, 3
RD
tp = 100ns
1.5
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz
0.63
20
Typical
Maximum
Units
18
V
22
24
V
5
50
nA
34
V
0.8
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2013 Semtech Corporation
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RClamp1821Z
PROTECTION PRODUCTS
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
35
DR040412-80
O
TA = 25 C
Clamping Voltage - VC (V)
Peak Pulse Power - PPP (kW)
30
1
0.1
25
20
15
10
Waveform
Parameters:
tr = 8μs
td = 20μs
5
0
0.01
0.1
1
10
Pulse Duration - tp (µs)
100
0
1000
0.5
1
Junction Capacitance vs. Reverse Voltage
2
2.5
3
TLP Characteristic
0.70
30
0.60
25
0.50
TLP Current (A)
Capacitance - Cj (pF)
1.5
Peak Pulse Current - Ipp (A)
0.40
0.30
0.20
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t 2 = 90ns
20
15
10
5
0.10
f = 1 MHz
0.00
0
0
5
10
15
20
0
10
20
30
Reverse Voltage - VR (V)
50
60
70
80
ESD Clamping (+8kV Contact per IEC 61000-4-2)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
170
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 40dB attenuator. ESD gun
return path connected to ESD ground
plane
150
130
-10
-30
110
-50
Voltage (V)
Voltage (V)
40
TLP Voltage (V)
90
70
50
-70
-90
-110
30
-130
10
-150
-10
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane
-170
-10
0
10
20
30
40
50
60
70
80
-10
Time (ns)
© 2013 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
3
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RClamp1821Z
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21
LOG
6 dB / REF 0 dB
1: - .22370 dB
800 MHz
5
0 dB
12
3
2: - .22970 dB
900 MHz
4
3: - .28610 dB
1.8 GHz
-6 dB
-12 dB
4: - .52490 dB
2.5 GHz
-18 dB
5: - .45760 dB
2.7 GHz
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2013 Semtech Corporation
0.370
0.300
0.088
R ecommendation
Solder Stencil Design
Solder Stencil Thickness
Stencil Opening
Land Pad
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Stencil Design
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
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RClamp1821Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3B
A
B
D
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
A
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.250 0.265
0.000 0.010 0.050
0.300 0.320 0.340
0.605 0.620 0.675
0.285 0.320 0.355
0.40 BSC
0.18
0.22 0.250
2
0.08
0.10
SEATING
PLANE
aaa C
C
A1
e
e/2
bxN
bbb
C A B
2xL
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
Land Pattern - SLP0603P2X3B
(C)
Z
G
DIM
C
G
X
Y
Z
DIMENSIONS
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2013 Semtech Corporation
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RClamp1821Z
PROTECTION PRODUCTS
Marking Code
Ordering Information
T
Part Number
Qty per
Reel
Reel
Size
RClamp 1821Z.TN T
10,000
7 Inch
Notes:
RailClamp and RClamp are trademarks of Semtech Corporation
Notes:
1)Dots represent date code matrix and Pin 1 location
Carrier Tape Specification
Bo
Ko
Ao
Device Orientation in Tape
A0
0.40 +/-0.05 mm
B0
0.71 +/-0.05 mm
K0
0.29 +/-0.05 mm
T
T
T
T
T
Note: All dimensions in mm unless otherwise specified
PIN 1 Location
(Towards Sprocket Holes)
© 2013 Semtech Corporation
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RClamp1821Z
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2013 Semtech Corporation
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