RClamp0503F RailClamp® TVS Array for USB OTG Interfaces PROTECTION PRODUCTS - RailClamp® Description Features Transient protection for high-speed data lines to RailClamp TVS arrays are low capacitance ESD protection devices designed to protect high speed data interfaces.. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. The low capacitance array configuration allows the user to protect three high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for ESD protection of USB OTG and SIM interfaces. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). ® IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Array of surge rated diodes with internal TVS Diode Small package saves board space Protects three I/O lines & power line Low capacitance (<3pF) for high-speed interfaces Low clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SC-70 5L package Molding compound flammability rating: UL 94V-0 Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Marking : F53 Packaging : Tape and Reel Applications Schematic USB OTG interfaces SIM Ports Video Graphics Cards Personal Digital Assistants (PDAs) Monitors and Flat Panel Displays Portable Electronics Microcontroller Input Protection Schematic & PIN Configuration 5 1 3 4 2 SC-70 5L (Top View) Revision 4/25/2014 1 www.semtech.com RClamp0503F PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 150 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 6 Amps VESD +/- 25 +/- 20 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage VRWM Pi n 5 to 2 5 V Reverse Breakdown Voltage V BR It = 1mA Pi n 5 to 2 Reverse Leakage Current IR VRWM = 5V, T=25°C Pi n 5 to 2 3 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs Pin 1, 3, or 4 to Pin 2 15 V Clamping Voltage VC IPP = 6A, tp = 8/20μs Pin 1, 3, or 4 to Pin 2 25 V Junction Capacitance Cj VR = 0V, f = 1MHz Pin 1, 3, or 4 to Pin 2 3 pF VR = 0V, f = 1MHz Between any two I/O pins (1, 3, 4) 1.5 pF 6 V Notes 1)ESD gun return path connected to ESD ground reference plane. © 2014 Semtech Corporation 2 www.semtech.com RClamp0503F PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current (tp=8/20us) 10 25 Clamping Voltage - VC (V) Peak Pulse Power - PPP (kW) TA = 25OC 1 0.1 20 Pin 5 to pin 2 10 5 DR040412-150 1 10 100 Pin 1, 3, or 4,to pin 2 15 0.01 0.1 Waveform Parameters: tr = 8µs td = 20µs 0 1000 1 2 3 4 5 Peak Pulse Current - IPP (A) 6 7 8 30 35 40 Pulse Duration - tp (µs) Junction Capacitance vs. Reverse Voltage (Pin 1, 3, or 4 to GND - Normalized to 0V) TLP Characteristic (Pin 1, 3, or 4 to GND) 30 2 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t 2 = 90ns f = 1MHz 20 Current (A) Normalized Capacitance 25 1.5 1 15 10 0.5 5 0 0 0 1 2 3 4 5 0 5 10 15 Reverse Voltage - V R (V) 20 25 Voltage (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) (Pin 1, 3, or 4 to GND) ESD Clamping (-8kV Contact per IEC 61000-4-2) (Pin 1, 3, or 4 to GND) 50 200 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane 150 0 Voltage (V) Voltage (V) -50 100 50 -100 -150 -200 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground l 0 -250 -50 -300 -10 0 10 20 30 40 50 60 70 -10 80 © 2014 Semtech Corporation 0 10 20 30 40 50 60 70 80 Time (ns) Time (ns) 3 www.semtech.com RClamp0503F PROTECTION PRODUCTS Typical Characteristics Insertion Loss S21 (Pin 1, 3, or 4 to GND) Insertion Loss S21 (Between any two I/O pins - 1, 3, 4) 0.2 1 0 0 -0.2 -0.4 S21 (dB) S21 (dB) -1 -2 -3 -0.6 -0.8 -1 -1.2 -4 -1.4 -5 -1.6 -6 -1.8 1 10 100 1000 1 10000 © 2014 Semtech Corporation 10 100 1000 10000 Frequency (MHz) Frequency (MHz) 4 www.semtech.com RClamp0503F PROTECTION PRODUCTS Applications Information Data Line and Power Supply Protection Using Vcc as reference Device Connection Options for Protection of Three High-Speed Data Lines This device is designed to protect three data lines from transient over-voltages by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage (plus diode VF) the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, and 4. The negative reference is connected at pin 2. This pin should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. Connect pin 5 directly to the positive supply rail (VCC). In this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. © 2014 Semtech Corporation 5 www.semtech.com RClamp0503F PROTECTION PRODUCTS Outline Drawing - SC-70 5L A DIM D e1 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc N E/2 E1 1 ccc C 2X N/2 TIPS E 2 e B D aaa C DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX A2 .000 .028 .006 .003 .071 .045 .043 .004 .035 .039 .012 .009 .079 .087 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 5 8° 0° .004 .004 .012 0.00 0.70 0.15 0.08 1.80 1.15 1.10 0.10 0.90 1.00 0.30 0.22 2.00 2.20 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 5 0° 8° 0.10 0.10 0.30 A SEATING PLANE A1 C H bxN bbb C A-B D c GAGE PLANE 0.15 L 01 (L1) DETAIL A SEE DETAIL A SIDE VIEW NOTES: 1. 2. 3. 4. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). -ADATUMS AND -B- TO BE DETERMINED AT DATUM PLANE -H- DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. REFERENCE JEDEC STD MO-203, VARIATION AA. Land Pattern - SC-70 5L X DIM C G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P NOTES: 1. © 2014 Semtech Corporation THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com RClamp0503F PROTECTION PRODUCTS Marking Code Ordering Information F53 Part Number Lead Finish Qty per Reel Reel Size RClamp0503F.TCT Matte Tin 3,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. 1 Carrier Tape Specification F53 F53 F53 F53 F53 F53 F53 F53 Device Orientation in Tape Tape Width B, (Max) D D1 ( M IN ) 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 1.0 mm (.039) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.3 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2014 Semtech Corporation 7 www.semtech.com