RClamp0531Z Datasheet

RClamp0531Z
Ultra Small RClamp®
1-Line ESD protection
PRELIMINARY
PROTECTION PRODUCTS - Z-PakTM
Features
Description
 High ESD withstand Voltage: +/-12kV (Contact) and
RailClamp TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and other portable
electronics. This device offers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device degradation.
The RClamp®0531Z has a typical capacitance of only
0.30pF. This allows it to be used on circuits operating
in excess of 5GHz without signal attenuation.
The RClamp0531Z is in a 2-pin SLP0603P2X3B package. It measures 0.6 x 0.3 mm with a nominal height
of only 0.25mm. The leads are finished with lead-free
NiAu. Each device will protect one line operating at 5
volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical. The combination of small size and high ESD surge
capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and RF
modules.
®








+/- 15kV (Air) per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one high-speed data line
Low reverse current: <5nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 0.30pF typical
Dynamic resistance: 0.67 Ohm (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP0603P2X3B package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications





RF Antenna and Modules
FM Antenna
USB 2.0
MHL
GPS
Circuit Diagram
Dimensions
0.62
1
0.32
0.22
0.400 BSC
2
0.250
Nominal Dimensions (mm)
Revision 12/8/2015
SLP0603P2X3B (Bottom View)
1
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
60
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
3
A
ESD p er IEC 61000-4-2 (Air)1
ESD p er IEC 61000-4-2 (Contact)1
VESD
+/- 15
+/- 12
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or 2 to 1
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pin 1 to 2 or 2 to 1
Clamp ing Voltage
VC
Clamp ing Voltage
Maximum
Units
5
V
9
11
V
5
20
nA
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
15
V
VC
IPP = 3A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
20
V
ESD Clamp ing Voltage2
VC
IPP = 4A,
tlp = 0.2/100ns
13
V
ESD Clamp ing Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
21
V
Dynamic Resistance2, 3
RD
tp = 100ns
0.67
Ohms
Junction Cap acitance
Cj
VR = 0V to 5V, f = 1MHz
0.30
Junction Cap acitance4
Cj
ΔCjVR
Change in Cap acitance Over VR4
Minimum
7
Typical
0.40
pF
VR = 0V to 5V, f = 1GHz
0.40
pF
VR = 0V to 5V, f = 1MHz
0.040
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
4)Guaranteed by design. Not production tested
© 2015 Semtech Corporation
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current
Junction Capacitance vs. Reverse Voltage
14
Capacitance - Cj (pF)
Clamping Voltage - VC (V)
0.50
13
13
12
12
Waveform
Parameters:
tr = 8µs
td = 20µs
11
0.40
0.30
0.20
0.10
f = 1MHz
0.00
11
0
0.5
1
1.5
2
2.5
3
0
3.5
1
2
Typical Insertion Loss (S21)
4
5
6
25
30
TLP Characteristic
0
25
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-0.1
-0.2
20
TLP Current (A)
-0.3
S21 (dB)
3
Reverse Voltage - VR (V)
Peak Pulse Current - Ipp (A)
-0.4
-0.5
-0.6
-0.7
-0.8
15
10
5
-0.9
-1
0
0.1
1
10
100
1000
10000
0
5
10
Frequency (MHz)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
20
ESD Clamping (-8kV Contact per IEC 61000-4-2)
110
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
90
-10
-30
Voltage (V)
70
Voltage (V)
15
TLP Voltage (V)
50
-50
30
-70
10
-90
-10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
-110
-10
0
10
20
30
40
50
60
70
80
-10
Time (ns)
© 2015 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
3
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2015 Semtech Corporation
Land Pad ( Follow drawing )
0.370
0.300
0.088
R ecommendation
Solder Stencil Design
Solder Stencil Thickness
Stencil Opening
All Dimensions are in mm.
Land Pad.
0.100 mm (0.004")
Stencil opening
Component
Recommended Mounting Pattern
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
4
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP0603P2X3B
A
B
D
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.250 0.265
0.000 0.010 0.050
0.300 0.320 0.340
0.605 0.620 0.675
0.285 0.320 0.355
0.40 BSC
0.18
0.22 0.250
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
e
e/2
bxN
bbb
C A B
2xL
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
Land Pattern - SLP0603P2X3B
(C)
Z
G
DIM
C
G
X
Y
Z
DIMENSIONS
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2015 Semtech Corporation
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Carrier Tape Specification
Plastic Tape
Bo
Ko
Ao
A0
0.40 +/-0.05 mm
B0
0.71 +/-0.05 mm
K0
0.29 +/-0.05 mm
Note: All dimensions in mm unless otherwise specified
Paper Tape
Device Orientation in Tape
R
R
R
R
R
PIN 1 Location
(Towards Sprocket Holes)
© 2015 Semtech Corporation
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RClamp0531Z
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
R
Notes:
1)Dots represent date code matrix and Pin 1 location
Ordering Information
Ordering Number Qty per Reel
RClamp0531Z.TNT
RClamp0531Z.TFT
10,000
15,000
Carrier Tape
Reel Size
Plastic
Paper
7 Inch
7 Inch
Comments
Not recommended
for new designs
RailClamp and RClamp are trademarks of Semtech Corporation.
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2015 Semtech Corporation
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