485C

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN10, 3x3, 0.5P
CASE 485C
ISSUE E
SCALE 2:1
DATE 11 FEB 2016
D
PIN ONE
REFERENCE
2X
2X
0.15 C
A
B
L
L1
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
L
ALTERNATE A−1
E
ALTERNATE TERMINAL
CONSTRUCTIONS
TOP VIEW
A1
(A3)
DETAIL B
ALTERNATE A−2
DETAIL A
ÏÏ
ÏÏ
ÎÎ
A
A1
ALTERNATE
CONSTRUCTIONS
C
D2
DETAIL A
10X
1
SEATING
PLANE
L
A3
A1
5
DETAIL B
WETTABLE FLANK OPTION
CONSTRUCTION
E2
K
10
6
10X
e
b
0.05 C
NOTE 3
SOLDERING FOOTPRINT*
2.64
PACKAGE
OUTLINE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.40
2.60
3.00 BSC
1.70
1.90
0.50 BSC
0.19 TYP
0.35
0.45
0.00
0.03
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
10X
0.55
1.90
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.10 C A B
BOTTOM VIEW
MOLD CMPD
ALTERNATE B−2
DETAIL B
0.08 C
SIDE VIEW
ÏÏ
ÏÏ
ÎÎ
EXPOSED Cu
ALTERNATE B−1
0.10 C
10X
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG
SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. FOR DEVICE OPN CONTAINING W OPTION, DETAIL A AND B
ALTERNATE CONSTRUCTION ARE NOT APPLICABLE. WETTABLE FLANK CONSTRUCTION IS DETAIL B AS SHOWN ON
SIDE VIEW OF PACKAGE.
3.30
10X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON03161D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN10, 3X3 MM, 0.5 MM
PITCH1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
http://onsemi.com
1
DOCUMENT NUMBER:
98AON03161D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION.
30 AUG 2000
A
CHANGED TITLE AND REDREW CASE OUTLINE FORMAT. ADDED DETAILS A
AND B. REQ. BY P. CELAYA
27 OCT 2005
B
CHANGED DIMENSIONS D2 AND E2. ADDED GENERIC MARKING INFORMATION. REQ. BY J. LETTERMAN.
12 AUG 2008
C
ADDED NOTE 7. REQ. BY B. MARQUIS.
23 MAY 2012
D
REMOVED NOTE 6. MODIFIED DETAILS A AND B AND SOLDERING FOOTPRINT
VALUES. REQ. BY I. HYLAND.
16 JUN 2015
E
ADDED DETAIL B WETTABLE FLANK OPTION. REQ. BY B. LOFTS.
11 FEB 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2016
February, 2016 − Rev. E
Case Outline Number:
485C