517CN

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN14, 5.5x1.5, 0.5P
CASE 517CN
ISSUE O
14
1
SCALE 2:1
PIN ONE
REFERENCE
2X
0.10 C
2X
ÏÏ
0.10 C
L1
DETAIL A
OPTIONAL
CONSTRUCTION
E
TOP VIEW
(A3)
DETAIL B
0.05 C
EXPOSED Cu
A
0.10 C
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
ÏÏ
ÎÎ
MOLD CMPD
DETAIL B
NOTE 4
A1
SIDE VIEW
e
DETAIL C
12
D2
C
0.10
REF
14
BOTTOM VIEW
M
C A B
0.05
M
C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.43
0.56
XXXXM
G
DETAIL C
b
0.10
3X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
5.50 BSC
0.45
0.55
1.50 BSC
0.50
0.70
0.50 BSC
0.20
0.40
0.00
0.05
GENERIC
MARKING DIAGRAM*
L
11
14X
PACKAGE
OUTLINE
OPTIONAL
CONSTRUCTION
SEATING
PLANE
DETAIL A
1
E2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A B
D
DATE 30 OCT 2012
XXXX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
1.80
3X
0.62
14X
0.26
0.50
PITCH
14X
0.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON84523E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN14, 5.5X1.5, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON84523E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
30 OCT 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. O
Case Outline Number:
517CN
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