uClamp0508T Datasheet

uClamp0508T
Low Profile μClampTM
8-Line ESD protection
PROTECTION PRODUCTS - MicroClampTM
Description
Features
The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting
high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and
no device degradation.
The μClampTM0508T is in a 8-pin, RoHS/WEEE compliant, SLP1713P8T package. It measures 1.7 x 1.3 mm
with a nominal height of only 0.4mm. The leads are
spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. Each device features eight TVS diodes
with an operating voltage of 5 volts and a maximum
loading capacitance of only 10pF.
They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and notebook computers.
TM
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package
Protects eight data lines
Low clamping voltage
Working voltage: 5V
Low capacitance (10pF)
Solid-state silicon-avalanche technology
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Mechanical Characteristics
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SLP1713P8T package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Applications
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Dimensions
Cellular Handsets & Accessories
Notebooks & Handhelds
Micro SD Ports
MMC & HS-MMC Ports
Portable Instrumentation
Digital Cameras
Peripherals
Schematic
1.70
1 2 3
4
1
2
3
4
5
6
7
8
1.30
8
7
6
5
0.40 BSC
Tab
0.40
Nominal Dimensions (mm)
(SLP1713P8T Bottom View)
Revision 01/07/2008
1
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uClamp0508T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
25
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
2
Amps
VESD
+/- 20
+/- 15
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Forward Voltage
VF
IF = 10mA
Clamp ing Voltage
VC
Junction Cap acitance
Junction Cap acitance
© 2008 Semtech Corp.
Minimum
Typical
Maximum
Units
5
V
6
V
0.25
μA
1.2
V
IPP = 2A, tp = 8/20μs
12.5
V
Cj
VR = 0V, f = 1MHz
10
pF
Cj
VR = 3.3V, f = 1MHz
2
1
4.5
pF
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uClamp0508T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
90
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
0
100
25
50
75
100
125
150
o
Ambient Temperature - TA ( C)
Pulse Duration - tp (us)
Forward Voltage vs. Forward Current
Clamping Voltage vs. Peak Pulse Current
8
15
Forward Voltage - VF V)
Clamping Voltage - VC (V)
7
10
5
Waveform
Parameters:
tr = 8μs
td = 20μs
6
5
4
3
Waveform
Parameters:
tr = 8μs
td = 20μs
2
1
0
0
0
0.5
1
1.5
2
2.5
0
3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Forward Current - IF (A)
Peak Pulse Current - IPP (A)
Junction Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2)
1.1
f = 1 MHz
1
0.9
CJ(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
1
2
3
Reverse Voltage - VR (V)
4
5
Note: Data is taken with a 10x attenuator
© 2008 Semtech Corp.
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uClamp0508T
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21
CH1 S21
LOG
Analog Crosstalk
6 dB / REF 0 dB
CH1 S21
LOG
20 dB /REF 0 dB
1: -3.0037dB
572.149 MHz
2: -5.0581 dB
800.00 MHz
0 dB
3: -5.8299 dB
900.00 MHz
1
-6 dB
2
3
5
-12 dB
4: -23.207
1.80000 GHz
-18 dB
-24 dB
4
5: -13.452
2.50000 GHz
-30 dB
-36 dB
1
MHz
START. 030 MHz
© 2008 Semtech Corp.
10
MHz
100
MHz
3
1
GHz GHz
START. 030 MHz
STOP 3000. 000000 MHz
4
STOP 3000. 000000 MHz
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uClamp0508T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Figure 1 - Circuit Diagram (Eight Each)
This device is designed to protect eight data lines. The
device is unidirectional and may be used on lines
where the signal polarity is above ground.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering and ESD performance of the device.
Ground loop inductance can be reduced by using
multiple vias to make the connection to the ground
plane. Figure 2 shows the recommended device
layout. The ground pad vias have a diameter of 0.008
inches (0.20 mm) while the two external vias have a
diameter of 0.010 inches (0.250mm). The internal
vias are spacedapproximately evenly from the center
of the pad. The designer may choose to use more vias
with a smaller diameter (such as 0.005 inches or
0.125mm) since changing the diameter of the via will
result in little change in inductance.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2008 Semtech Corp.
Figure 2 - Recommended Layout using Ground Vias
5
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uClamp0508T
PROTECTION PRODUCTS
Applications Information - Spice Model
uClamp0508T Spice Model
uClamp0508T Spice Parameters
© 2008 Semtech Corp.
Parameter
Unit
D1 (T VS)
IS
Amp
2.05e-15
BV
Volt
7.0
VJ
Volt
0.80
RS
Ohm
0.75
IB V
Amp
1.0E-3
CJO
Farad
9e-12
TT
sec
2.541E-9
M
--
0.25
N
--
1.1
EG
eV
1.11
6
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uClamp0508T
PROTECTION PRODUCTS
Outline Drawing - SLP1713P8T
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
E
A
SEATING
PLANE
aaa C
A2
C
A1
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.015 .016 .017
.000 .001 .002
(.005)
.006 .008 .010
.065 .067 .070
.047 .051 .055
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
8
.003
.004
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
1.65 1.70 1.78
1.20 1.30 1.40
1.25 1.30 1.38
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
8
0.08
0.10
D1
1
2
LxN
E/2
E1
N
bxN
e/2
bbb
C A B
e
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1713P8T
P
Z
X
G
DIMENSIONS
DIM
C
G
H
K
P
X
Y
Z
H (C)
Y
INCHES
(.050)
.027
.012
.055
.016
.008
.023
.073
MILLIMETERS
(1.27)
0.69
0.30
1.40
0.40
0.20
0.58
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
© 2008 Semtech Corp.
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uClamp0508T
PROTECTION PRODUCTS
Marking Code
Ordering Information
0508T
PIN 1
INDICATOR
Part Number
Working
Voltage
Qty per
Reel
Reel
Size
uClamp 0508T.TCT
5V
3,000
7 Inch
Notes:
1) This is a lead-free, RoHS/WEEE compliant product
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
YYWW
Note: YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.10 mm
B0
K0
1.91 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2008 Semtech Corp.
8
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