TFA9888
9.7 V stereo boosted audio system with adaptive sound
maximizer and speaker protection
Rev. 1 — 29 February 2016
Product short data sheet
1. General description
The TFA9888 is a high-efficiency stereo class-D audio amplifier featuring an adaptive
sound maximizer and speaker protection (implemented via a speaker-boost and
protection algorithm). It can deliver 4.8 W peak output power per channel into an 8
speaker at a supply voltage of 3.6 V. The internal adaptive DC-to-DC converter raises the
supply voltage to 9.7 V, providing ample headroom for major improvements in sound
quality.
A safe working environment is provided for the speaker under all operating conditions.
The TFA9888 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures that the quality of the
audio signal is never degraded by unwanted clipping or distortion in the amplifier or
speaker. The speaker-boost and protection algorithm uses feedback to calculate both the
temperature and the excursion, allowing the TFA9888 to adapt to changes in the acoustic
environment.
The device allows a single speaker to support both the handset call and handsfree call
use-cases. This feature reduces the number of amplifiers needed in an application without
the need for additional external components.
Smart Receiver stereo playback is supported with a handsfree speaker and an earpiece
speaker (32 ) connected to the two channels of the TFA9888. The speaker-boost and
protection algorithm allows the TFA9888 to deliver about 1.2 W at the earpiece speaker,
making it possible to generate a loud stereo impression using normal mobile phone
acoustics.
The TFA9888 is available in a 99-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
2. Features and benefits
Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
Fully embedded software, no additional license fee or porting required
Total integrated solution that includes Digital Signal Processor (DSP), stereo
amplifiers, DC-to-DC converter sensing and more
Adaptive excursion control - guarantees that the speaker membrane excursion never
exceeds its rated limit
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
Support for handset call and handsfree call use cases using the same speaker:
Handset use case, Vn(o) = 11 V (typical), PSRR = 110 dB (typical), PO = 300 mW
(THD = 1 %, RL = 8 ), PO = 120 mW (THD = 1 %, RL = 32 )
Hands-free use case, Vn(o) = 45 V (typical), PSRR = 80 dB (typical), PO = 2
2.4 W (THD = 1 %, RL = 2 8 )
Smart Receiver stereo support using the main and earpiece speakers in handsfree
use case for stereo playback, PO = 4.1 W (THD = 1 %, RL = 8 no signal on receiver
speaker) and PO = 1.2 W (THD = 1 %, RL = 32 no signal on main speaker)
Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage
Bandwidth extension option to increase low frequency response
Compatible with standard Acoustic Echo Cancellers (AECs)
Adaptive DC-to-DC converter increases the supply voltage smoothly when necessary,
preventing large battery supply spikes and limiting quiescent power consumption
High efficiency and low power dissipation
Wide supply voltage range (fully operational from 2.7 V to 5.5 V)
I2C-bus control interface (400 kHz)
Dedicated speech mode with speech activity detector
Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo
Cancellation (AEC) at the host
48 kHz sample frequency supported
Configurable TDM/I2S input interface supporting up to 16 slots
Bi-directional TDM/I2S interface supported (full duplex)
PDM input interface supporting:
Stereo audio input or
Two digital microphones
Sidetone mixing supported
External haptic driver supported via the TFA9881
Interrupt control via a dedicated interrupt pin
Four GPIOs
Volume control
Low RF susceptibility
Input clock jitter insensitive interface (jitter caused by thermal noise)
Thermal foldback and overtemperature protection
15 kV system-level ESD protection without external components
‘Pop and click noise' free at all transitions between use cases
3. Applications
TFA9888_SDS
Product short data sheet
Mobile phones
Tablets
Portable Navigation Devices (PND)
Notebooks/Netbooks
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Rev. 1 — 29 February 2016
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2 of 16
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
MP3 players and portable media players
Small audio systems
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
VBAT
VDDD
battery supply voltage
on pin VBAT1/VBAT2
2.7
-
5.5
V
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
VDD(IO)
input/output supply voltage
on pin VDD(IO)
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT1/VBAT2 and in DC-to-DC
converter coil; handsfree or multimedia
playback use case; DPSAL = DPSAR = 0;
silence
-
8
-
mA
on pin VBAT1/VBAT2 and in DC-to-DC
converter coil; handset call use case;
DPSAL = DPSAR = 0; silence;
-
6
-
mA
Power-down state
-
1
-
A
on pin VDDD; handsfree or multimedia
playback use case; silence
-
47
-
mA
on pin VDDD; handset call use case;
SSPDME = CSRIGHTE = CSLEFTE =
VSRIGHTE = VSLEFTE = SSRIGHTE = 0
-
6
-
mA
on pin VDDD; Power-down state;
BCK = FS = DIO1 = DIO2 = GAINIO = 0 V;
MANAOOSC = 1;
-
5
-
A
one output channel active
-
3.5
-
W
two output channels active
-
2
2.4
-
W
main speaker; RL = 8 ; LL = 44 H, no
signal on receiver speaker
-
4.1
-
W
receiver speaker; RL = 32 ; LL = 160 H,
no signal on main speaker
-
1.2
-
W
IDDD
digital supply current
Po(RMS)
RMS output power
Typ
Max
Unit
THD+N = 1 %; stereo application (2 x RL =
8 ; handsfree call or multimedia playback
use case; VBST = 9.2 V
THD+N = 1 %; Smart Receiver application;
handsfree call or multimedia playback use
case; VBST = 9.7 V
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TFA9888UK
WLCSP99
wafer level chip-scale package; 99 bumps; 4.37 3.82 0.5 mm
SOT1447-1
TFA9888_SDS
Product short data sheet
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Rev. 1 — 29 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 16
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
6. Block diagram
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Block diagram
TFA9888_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
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4 of 16
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
7. Pinning information
7.1 Pinning
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Fig 2.
DDD
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b. Transparent top view
Bump configuration
TFA9888_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
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5 of 16
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
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Fig 3.
Bump mapping
8. Functional description
The TFA9888 is a highly efficient stereo Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated speaker-boost and protection algorithm. Figure 1 is a block diagram
of the TFA9888.
It contains a TDM/I2S input/output interface for communicating with the audio host. The
TDM/I2S data pins (DIO1, DIO2 and GAINIO) can be configured as inputs or outputs. It is
possible to configure the interface in full duplex mode with one data pin. Some TDM slots
can be configured as data inputs and others as TDM data outputs per TDM frame sync.
The maximum number of slots is 16 and the minimum number is 2 (like I2S). The interface
is therefore compliant with all I2S interface configurations and supports a wide range of
TDM interface configurations.
A PDM input stream can be applied to the TFA9888 (via pin PDMI). This audio interface
can be used for connecting digital microphones or connected to the audio host.
A speaker-boost and protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures that the audio quality is always acceptable.
The speaker-boost and protection algorithm implements an adaptive loudspeaker model
that is used to predict the extent of membrane excursion. The model is continuously
updated to ensure that the protection scheme remains effective even when speaker
parameter values change or the acoustic enclosure is modified.
TFA9888_SDS
Product short data sheet
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Rev. 1 — 29 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 16
TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
Output sound pressure levels (SPLs) are boosted within given mechanical, thermal and
quality limits. An optional bandwidth extension mode extends the low frequency response
up to a predefined limit before maximizing the output level. This mode is suitable for
listening to high-quality music in quiet environments.
The frequency response of the TFA9888 can be modified via 2 10 fully programmable
cascaded second-order biquad filters. The first two biquads in each channel are
processed with 48-bit double precision; biquads 3 to 10 are processed with 24-bit single
precision.
The speaker-boost and protection algorithm can also be used for Smart receiver stereo.
Stereo imaging can be achieved with this option by using a handsfree speaker in
combination with an earpiece speaker (receiver speaker).
The left channel class-D audio amplifier can be configured for handsfree or handset call
use cases. The maximum output power, the gain, and the noise levels are lower in
handset call use case than in handsfree call use case. The receiver outputs can be
connected to the earpiece for a handset call or to the handsfree outputs, so only one
speaker is needed for both use cases. Power supply rejection is increased via an internal
LDO used to supply the receiver amplifier.
The gain is automatically reduced to limit battery current when the battery voltage is low.
The output volume can be controlled by the speaker-boost and protection algorithm or by
the host application (external). In the latter case, the boost features of the speaker-boost
and protection algorithm must be disabled to avoid neutralizing external volume control.
The speaker-boost and protection algorithm output is converted into two pulse width
modulated (PWM) signals that are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
The speaker must be calibrated to prevent speaker impedance spread influencing the
speaker temperature calculation/measurement. Failure to calibrate the speaker correctly
can result in low volumes or damage to the speaker. Speaker binding and/or calibration is
usually performed once during the phone manufacturing process.
9. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
on pin VBAT1/VBAT2
0.3
+6
V
0.3
+12
V
VBAT
battery supply voltage
VBST
voltage on pin BST
VDDP
power supply voltage
on pin VDDP1/VDDP2
0.3
+12
V
VDDD
digital supply voltage
on pin VDDD
0.3
+1.95
V
VDD(IO)
input/output supply voltage
on pin VDD(IO)
0.3
+1.95
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
VESD
electrostatic discharge voltage
TFA9888_SDS
Product short data sheet
according to Human Body Model (HBM)
2
+2
kV
according to Charge Device Model (CDM)
500
+500
V
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Rev. 1 — 29 February 2016
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
10. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction to ambient 4-layer application board
TFA9888_SDS
Product short data sheet
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
Typ
Max
Unit
38
-
K/W
© NXP Semiconductors N.V. 2016. All rights reserved.
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
11. Package outline
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Package outline TFA9888 (WLCSP99)
TFA9888_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
12. Soldering of WLCSP packages
12.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
12.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
12.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 5) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 5.
Table 5.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 5.
TFA9888_SDS
Product short data sheet
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 5.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
12.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
12.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
12.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
TFA9888_SDS
Product short data sheet
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
12.3.4 Cleaning
Cleaning can be done after reflow soldering.
TFA9888_SDS
Product short data sheet
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
speaker protection
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TFA9888_SDS v.1
20160229
Product short data sheet
-
-
TFA9888_SDS
Product short data sheet
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TFA9888
NXP Semiconductors
9.7 V stereo boosted audio system with adaptive sound maximizer and
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14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TFA9888_SDS
Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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9.7 V stereo boosted audio system with adaptive sound maximizer and
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
CoolFlux — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9888_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 16
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9.7 V stereo boosted audio system with adaptive sound maximizer and
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16. Contents
1
2
3
4
5
6
7
7.1
8
9
10
11
12
12.1
12.2
12.3
12.3.1
12.3.2
12.3.3
12.3.4
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering of WLCSP packages. . . . . . . . . . . . 10
Introduction to soldering WLCSP packages . . 10
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 10
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 10
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Quality of solder joint . . . . . . . . . . . . . . . . . . . 11
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 February 2016
Document identifier: TFA9888_SDS