Data Sheet

TFA9897
Boosted audio system with adaptive sound maximizer and
speaker protection
Rev. 1 — 27 November 2014
Preliminary short data sheet
1. General description
The TFA9897 is a high efficiency class-D audio amplifier with a sophisticated
speaker-boost protection algorithm. It can deliver 1.2 W (RMS; THD = 1 %) output power
into an 8  speaker at a battery voltage of 3.6 V. The internal boost converter raises the
supply voltage to 5.3 V, providing ample headroom for major improvements in sound
quality.
A safe working environment is provided for the speaker under all operating conditions.
The TFA9897 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures that the audio signal is
always of optimum quality.
The adaptive sound maximizer algorithm uses feedback to accurately calculate both the
temperature and the excursion, allowing the TFA9897 to adapt to changes in the acoustic
environment.
Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional
headroom and power output. The supply voltage is only raised when necessary. This
feature maximizes the output power of the class-D audio amplifier while limiting quiescent
power consumption.
The TFA9897 also incorporates advanced battery protection. By limiting the supply
current when the battery voltage is low, it prevents the audio system drawing excessive
load currents from the battery (excessive load currents could cause a system
undervoltage). The advanced processor minimizes the impact of a falling battery voltage
on the audio quality by preventing distortion as the battery discharges.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in a class-D
audio amplifier provides excellent audio performance and high supply voltage ripple
rejection. The audio input interface is TDM and can be I2S configured. Control settings are
communicated via an I2C-bus interface.
The TFA9897 is available in a 30-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
2. Features and benefits
 Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
 Fully embedded software, no additional license fee or porting required
 Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more.
 Adaptive excursion control guarantees that the speaker membrane excursion never
exceeds its rated limit
 Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
 Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
 Output power: 1.2 W (RMS) into 8  at 3.6 V supply voltage (THD = 1 %)
 Low noise Receiver mode
 Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage
 Bandwidth extension option to increase low frequency response
 Intelligent DC-to-DC converter maximizes audio headroom from any supply level and
limits current consumption at low battery voltages
 Compatible with standard Acoustic Echo Cancellers (AECs)
 High efficiency and low-power dissipation
 Wide supply voltage range (fully operational from 2.5 V to 5.5 V)
 TDM audio interface configurable from 2 slots (I2S) up to 16 slots
 I2C-bus control interface (400 kHz)
 Dedicated speech mode with speech activity detector
 Speaker current and voltage monitoring (via the TDM-bus) for Acoustic Echo
Cancellation (AEC) at the host
 Fully short-circuit proof across the load and to the supply lines
 Sample frequencies from 8 kHz up to 48 kHz supported
 Option to route TDM input direct to TDM output to allow a second TDM input slave
device to be used in combination with the TFA9897
 Volume control
 Low RF susceptibility
 Input clock jitter insensitive interface
 Thermally protected
 Low ‘pop noise' at all mode transitions
3. Applications






TFA9897_SDS
Preliminary short data sheet
Mobile phones
Tablets
Portable gaming devices
Portable Navigation Devices (PND)
Notebooks/Netbooks
MP3 players and portable media players
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
VDD(IO)
input/output supply voltage
on pin VDD(IO)
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in the DC-to-DC converter
coil; Operating modes with load; DC-to-DC
converter in Adaptive boost mode (no output
signal)
-
1.55
-
mA
on pin VBAT and in the DC-to-DC converter
coil; Power-down mode
-
-
1
A
on pin VDDD; Operating modes;
speaker-boost protection activated
-
15
-
mA
on pin VDDD; Operating modes; CoolFlux
DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK = FS = DIO = GAINIO = 0 V
-
10
-
A
-
100
-
A
RL = 8 ; fs = 48 kHz
-
1.2
-
W
RL = 8 ; fs = 32 kHz
-
1.5
-
W
6.3
8
-

digital supply current
IDDD
IDD(IO)
input/output supply current
on pin VDD(IO); Operating modes;
speaker-boost protection activated; I2S
configured TDM
Po(RMS)
RMS output power
CLIP = 0
load impedance
ZL
of speaker
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TFA9897UK
WLCSP30
wafer level chip-size package; 30 bumps; 2.06  2.72  0.50 mm
TFA9897UK
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
6. Block diagram
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Block diagram
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
7. Pinning information
7.1 Pinning
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a. Bottom view showing A1 marking
Fig 2.
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b. Bump mapping
Bump configuration
Table 3.
Pinning
Symbol
Pin
Type
Description
SCL
A1
I
I2C-bus clock input
SDA
A2
I/O
I2C-bus data input/output
BCK
A3
I
digital audio bit clock
FS
A4
I
word select or frame sync
GAINIO
A5
I/O
digital audio I/O; also used as gain sync for stereo
VDD(IO)
B1
P
digital I/O supply
ADS1
B2
I
address select 1
GNDD
B3
P
digital ground
INT
B4
O
interrupt output configurable as push pull or open-drain output
DIO
B5
I/O
digital audio IO also used as I2S input
VDDD
C1
P
digital core supply voltage
ADS2
C2
I
address select 2
GNDD
C3
P
digital ground
TEST3
C4
RST
C5
TEST1
D1
test signal input 3; for test purposes only, connect to PCB ground
I
reset input
test signal input 1; for test purposes only, connect to PCB ground
TEST2
D2
GNDD
D3
P
digital ground
GNDD
D4
P
digital ground
VBAT
D5
I
battery supply sense input
GNDB
E1
P
DC-to-DC booster ground
TFA9897_SDS
Preliminary short data sheet
test signal input 2; for test purposes only, connect to PCB ground
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Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
Table 3.
Pinning …continued
Symbol
Pin
Type
Description
GNDB
E2
P
DC-to-DC booster ground
GNDD
E3
P
digital ground
GNDP
E4
P
class-D power ground
GNDD
E5
P
digital ground
INB
F1
P
DC-to-DC booster input
VBST
F2
P
DC-to-DC booster output
OUTA
F3
O
non-inverting output
VDDP
F4
P
class-D power supply
OUTB
F5
O
inverting output
8. Functional description
The TFA9897 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated speaker-boost protection algorithm. Figure 1 is a block diagram of the
TFA9897.
The device contains two TDM input/output channels. The number of slots and number of
bits per slot can be configured for each TDM channel and the channel can be configured
as input or output. Typically, one TDM channel is configured as a standard I2S input while
the other TDM channel is used for stereo sync, where gain information is transferred
between the devices.
It is also possible to output current sense and voltage sense information on the TDM
interface, which can be processed by the audio host.
The speaker-boost protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures that the audio quality is always acceptable.
The protection algorithm implements an adaptive loudspeaker model that is used to
predict the extent of membrane excursion. The model is continuously updated to ensure
that the protection scheme remains effective even when speaker parameter values
change or the acoustic enclosure is modified.
The speaker-boost protection algorithm boosts the output sound pressure level within
given mechanical, thermal and quality limits. An optional Bandwidth extension mode
extends the low frequency response up to a predefined limit before maximizing the output
level. This mode is suitable for listening to high-quality music in quiet environments.
The frequency response of the TFA9897 can be modified via ten fully programmable
cascaded second-order biquad filters. The first two biquads are processed with 48-bit
double precision; biquads 3 to 8 are processed with 24-bit single precision.
At low battery voltage levels, the gain is automatically reduced to limit battery current.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
The output volume can be controlled by the speaker-boost protection algorithm or by the
host application (external). In the latter case, the boost features of the speaker-boost
protection algorithm must be disabled to avoid neutralizing external volume control.
The speaker-boost protection algorithm output is converted into two pulse width
modulated (PWM) signals which are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
The adaptive DC-to-DC converter boosts the battery supply voltage in line with the output
of the speaker-boost protection algorithm. It switches to Follower mode (VBST = VBAT; no
boost) when the audio output voltage is lower than the battery voltage.
8.1 Protection mechanisms
The following protection circuits are included in the TFA9897:
•
•
•
•
OverTemperature Protection (OTP)
OverVoltage Protection (OVP)
UnderVoltage Protection (UVP)
OverCurrent Protection (OCP)
The reaction of the device to fault conditions differs depending on the protection circuit
involved.
8.1.1 OverTemperature Protection (OTP)
OTP prevents heat damage to the TFA9897. It is triggered when the junction temperature
exceeds Tact(th_prot). When this happens, the output stages are set floating. OTP is cleared
automatically via an internal timer (approximately 200 ms), after which the output stages
start to operate normally again.
8.1.2 Supply voltage protection (UVP and OVP)
UVP is activated and the power stages are set floating if VBAT drops below the
undervoltage protection threshold, VP(uvp). When the supply voltage rises above VP(uvp)
again, the system will be restarted after approximately 200 ms.
OVP is activated and the power stages are set floating if the power supply voltage (VDDP)
rises above the overvoltage protection threshold, VP(ovp). The power stages are
re-enabled as soon as the supply voltage drops below VP(ovp) again. The system will be
restarted after approximately 200 ms.
8.1.3 OverCurrent Protection (OCP)
OCP detects a short circuit across the load or between one of the amplifier outputs and
one of the supply lines. If the output current exceeds the overcurrent protection threshold
(IO(ocp)), it is limited to IO(ocp) while the amplifier outputs are switching (the amplifier is not
powered down completely). The amplifier can distinguish between an impedance drop at
the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines.
The impedance threshold depends on which supply voltage is being used.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Vx
voltage on pin x
pin INB
0.3
+6
V
pins GAINIO, DIO, BCK, FS, INT, SCL,
SDA, ADS1, ADS2 and RST
0.3
+1.95
V
VBAT
battery supply voltage
on pin VBAT
0.3
+6
V
VDDP
power supply voltage
on pin VDDP
0.3
+6
V
VDDD
digital supply voltage
on pin VDDD
0.3
+1.95
V
VDD(IO)
input/output supply voltage
on pin VDD(IO)
0.3
+1.95
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
VESD
electrostatic discharge voltage
40
+85
C
according to Human Body Model (HBM)
2
+2
kV
according to Charge Device Model (CDM)
500
+500
V
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-a)
thermal resistance from junction to ambient
in free air; natural convection
-
4-layer application board
60
Unit
K/W
11. Characteristics
11.1 DC Characteristics
Table 6.
DC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 8[1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDP
power supply voltage
on pin VDDP
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
VDD(IO)
input/output supply voltage
on pin VDD(IO)
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in the DC-to-DC
converter coil; Operating modes with
load; DC-to-DC converter in Adaptive
boost mode (no output signal)
-
1.55
-
mA
on pin VBAT and in the DC-to-DC
converter coil; Power-down mode
-
-
1
A
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
Table 6.
DC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 8[1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDDD
digital supply current
on pin VDDD; Operating modes;
speaker-boost protection activated
-
15
-
mA
on pin VDDD; Operating modes;
CoolFlux DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK = FS = DIO = GAINIO = 0 V
-
10
-
A
on pin VDD(IO); Operating modes;
speaker-boost protection activated;
I2S configured TDM
-
100
-
A
0.7VDD(IO) -
1.95
V
-
-
0.3VDD(IO) V
-
-
3
pF
1.8 V on input pin
-
-
0.1
A
IDD(IO)
input/output supply current
Pins BCK, FS, DIO, GAINIO, RESET, ADS1, ADS2, SCL, SDA
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Cin
input capacitance
ILI
input leakage current
[2]
Pins DIO, GAINIO, INT
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDD(IO) 
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
Pins SDA, open-drain outputs, external 10 k resistor to VDDD
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDD(IO) 
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
VDDP = 5.3 V
-
200
-
m
130
-
150
C
Pins OUTA, OUTB
RDSon
drain-source on-state
resistance
Protection
Tact(th_prot) thermal protection activation
temperature
VP(ovp)
overvoltage protection supply
voltage
protection on VDDP
5.5
-
5.7
V
VP(uvp)
undervoltage protection
supply voltage
protection on VBAT
2.3
-
2.5
V
IO(ocp)
overcurrent protection output
current
0.7
-
-
A
5.25
5.3
5.35
V
DC-to-DC converter
VBST
voltage on pin BST
DCVO = 111; Boost mode
[1]
LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; value is guaranteed by design and checked during product validation.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
11.2 AC characteristics
Table 7.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 8[1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RMS output power
THD+N = 1 %; CLIP = 1; RCV = 0
RL = 8 ; fs = 48 kHz
-
1.5
-
W
RL = 8 ; fs = 32 kHz
-
1.65
-
W
RL = 8 ; fs = 48 kHz
-
1.2
-
W
RL = 8 ; fs = 32 kHz
-
1.35
-
W
RL = 8 ; fs = 48 kHz
-
0.68
-
W
RL = 8 ; fs = 32 kHz
-
0.76
-
W
RL = 8 ; fs = 48 kHz
-
2
-
W
RL = 8 ; fs = 32 kHz
-
2
-
W
6.3
8
-

-
-
1
mV
-
80
-
%
-
0.03
0.1
%
-
27
-
V
-
30
-
V
-
20
-
-
100
-
dB
-
97
-
dB
Vripple = 200 mV (RMS); fripple = 217 Hz
-
90
-
dB
-
75
-
dB
3
-
+3
%
-
8
-
kHz
-
-
2
ms
-
-
6
ms
-
-
10
s
Amplifier
Po(RMS)
THD+N = 1 %; CLIP = 0; RCV = 0
THD+N = 1 %; CLIP = 0; RCV = 1
THD+N = 10 %; CLIP = 1; RCV = 0
ZL
load impedance
of speaker
VO(offset)
output offset voltage
absolute value
po
output power efficiency
THD+N
total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ;
LL = 44 H
Vn(o)
output noise voltage
including DC-to-DC converter;
Po(RMS) = 1.35 W;
[2]
[2]
A-weighted; DATAI1 = DATAI2 = 0 V
CoolFlux DSP disabled and
bypassed
CoolFlux DSP enabled
[2]
Receiver mode; VDDP  4.3 V
S/N
signal-to-noise ratio
VO = 4.5 V (peak); A-weighted
CoolFlux DSP disabled and
bypassed
CoolFlux DSP enabled
PSRR
power supply rejection ratio
[2]
Current-sensing performance
S/N
signal-to-noise ratio
IO = 1.2 A (peak); A-weighted
Isense(acc)
sense current accuracy
IO = 0.5 A (peak)
B
[2]
bandwidth
Timing
td(on)
turn-on delay time
PLL locked on BCK (IPLL = 0)
fs = 32 kHz to 48 kHz
PLL locked on FS (IPLL = 1)
fs = 48 kHz
td(off)
turn-off delay time
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
Table 7.
AC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 8[1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
td(mute_off)
mute off delay time
td(soft_mute)
soft mute delay time
tPD
propagation delay
Conditions
Min
Typ
Max
Unit
-
1
-
ms
-
1
-
ms
fs = 8 kHz
-
-
3.2
ms
fs = 48 kHz
-
-
600
s
fs = 8 kHz
-
-
14
ms
fs = 48 kHz
-
-
4
ms
CoolFlux DSP bypassed
speaker-boost protection mode,
tLookAhead = 2 ms
[1]
LBST = boost converter inductor; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; value is guaranteed by design and checked during product validation.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 21
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NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
12. Application information
12.1 Application diagrams
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TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
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Typical stereo application (simplified)
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 21
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NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
13. Package outline
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Package outline TFA9897 (WLCSP30)
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 6) than a SnPb process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 8.
Table 8.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 6.
TFA9897_SDS
Preliminary short data sheet
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Rev. 1 — 27 November 2014
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15 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 6.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
16 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
15. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
TFA9897_SDS v.1
20141127
Preliminary short data sheet -
TFA9897_SDS
Preliminary short data sheet
Change notice
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
Supersedes
-
© NXP Semiconductors N.V. 2014. All rights reserved.
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TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TFA9897_SDS
Preliminary short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
CoolFlux — is a trademark of NXP Semiconductors N.V.
CoolFlux DSP — is a trademark of NXP Semiconductors N.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9897_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
20 of 21
TFA9897
NXP Semiconductors
Boosted audio system with sound maximizer and speaker protection
18. Contents
1
2
3
4
5
6
7
7.1
8
8.1
8.1.1
8.1.2
8.1.3
9
10
11
11.1
11.2
12
12.1
13
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
14.3.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Protection mechanisms . . . . . . . . . . . . . . . . . . 7
OverTemperature Protection (OTP) . . . . . . . . . 7
Supply voltage protection (UVP and OVP) . . . . 7
OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 8
AC characteristics. . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Application diagrams . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering of WLCSP packages. . . . . . . . . . . . 15
Introduction to soldering WLCSP packages . . 15
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 15
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Quality of solder joint . . . . . . . . . . . . . . . . . . . 16
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 27 November 2014
Document identifier: TFA9897_SDS
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